Properties of the Copper-Plating Bath Containing Microcapsules

Properties of the Copper-Plating Bath Containing Microcapsules 

Microcapsules prepared with silicone resin or lube oil as the core and PVA as the wall were incorporated into the copper-plating bath (for composition, see Table 9.2), and electrolytic co-deposition was carried out at current densities (D(J of 10, 

The times at which microcapsules began to deposit on the electrode surface during the composite copper-plating are detailed in Table 9.3. The amount of deposited microcapsules was found to be directly related to and to the plating time. Microcapsules with a lube oil core were deposited later than the encapsulated silicone resin under the same D]. This showed that a higher and a longer time would be 

10 mA cm A few microcapsules found after 24 min. A few microcapsules found after 30 min. 

20 mA cm Microcapsules start to deposit on the coating after 18 min amounts increase with time. Microcapsules start to deposit on the coating after 20 min amounts increase with time. 

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