Electroless copper plating Chemistry

Control of desmear and electroless copper-plating chemistries is also important. Minimizing any further attack of the resin-to-glass interface and plating into the dielectric are the key considerations. Good rinsing to minimize residual ionic contamination from these processes is also important. 

Accelerator 19. These materials are available from Shipley Company no differences were observed when similar formulations produced by other suppliers were substituted. Initial metallization was accomplished via electroless deposition of either copper or nickel. Copper was deposited from the Shipley Cuposit 2S1 bath and nickel from the Enthone Enplate Nl-426 (1-3 % P) plating chemistry. The metal was deposited to a thickness of 1-2 pm. Following metallization, the clad substrates were heat treated to develop the chemical portion of adhesion K. Single-sided plating was accomplished either by masking one side of injection-molded plaques or affixing a film to a carrier so that only one face was exposed. 

Manufacture of Printed Wiring Boards. Printed wiring boards, or printed circuit boards, are usually thin flat panels than contain one or multiple layers of thin copper patterns that interconnect the various electronic components (e.g. integrated circuit chips, connectors, resistors) that are attached to the boards. These panels are present in almost every consumer electronic product and automobile sold today. The various photopolymer products used to manufacture the printed wiring boards include film resists, electroless plating resists (23), liquid resists, electrodeposited resists (24), solder masks (25), laser exposed photoresists (26), flexible photoimageable permanent coatings (27) and polyimide interlayer insulator films (28). Another new use of photopolymer chemistry is the selective formation of conductive patterns in polymers (29). 

Hypophosphorous acid is an important reducing agent, both in chemistry labs and in industry. Its best known use in organic chemistry is in the reduction of arenediazonium cations (ArN2 ) to arenes (ArH). In industry, its chief application is electroless plating where a metal such as nickel or copper is deposited on a surface by chemical reduction, as opposed to passing an electfic current (hence the name). 

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