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Copper plating with

For the Ni-Al2C>3 system [27] there was little effect of pH on the amount of incorporation above a pH of 2. However, decreasing the pH below 2 resulted in a sharp decrease in the amount of incorporation. Below a pH of 2.0, reportedly no particle incorporation was obtained for copper plating with SiC or AI2O3 [27], Other researchers [25] found no effect of pH on amount of BaS04 incorporated within a copper matrix, in the presence of tetraethylene pentamine, although in the presence of thallous ions incorporation for the same system was found to increase with pH. [Pg.199]

For the smaller air-cooled, oil diffusion pumps, plate baffles are used. The air-cooled arrangement consists of a copper plate with copper webs to the housing wall. The temperature of the plate baffle remains nearly ambient during the operation of the diffusion pump. [Pg.44]

Following deposition, the Ti02 coated plates were subjected to a reduction treatment under H2 at 600°C for 2 hours. After verification of a good electrical contact at the back surface of the Ti sheet, a copper plate with an electrode lead was attached to the electrode back with silver paint. The electrode back and edges were covered with silicone rubber adhesive (GE RTV 108). [Pg.308]

The micro structure is etched from a copper plate with channel dimensions ranging from 25 to 1000 pm in depth and from 100 pm to 2000 pm in width. The thickness of the base plate varies from 200 pm to 2000 pm. [Pg.620]

As a rule, corrosion is not uniformly distributed on the exposed surface. An average rale of corrosion of 0.05 cm/year may be concentrated in spots, leading to holes in a piece of metal (e.g., a pipeline) that is 0.5 cm thick or more. Perhaps the worst design error, from the corrosion point of view, is to combine two different metals without isolating them electrically. For example, connecting copper plates with... [Pg.566]

Repeal Prob. 3-116 using a copper plate with copper fins (k = 386 W/m °C) instead of aluminum ones. [Pg.223]

The third example of field emission from Si-based nanowires is from the aligned SiC nanowires. The field emission measurements [68] were carried out in a vacuum chamber at a pressure of 5 x 10 Torr at room temperature. An oriented SiC nanowire array, which was used as the cathode, was stuck to a stainless steel substrate by silver paste with the bottom end of the nanowires facing upward. A copper plate with a diameter of 1 cm, mounted on a precision linear feedthrough, was used as the anode. Field emission current densities of 10 pA cm were observed at applied fields of 0.7-1.5 V pm and current densities of 10 mA cm were realized at applied fields as low as 2.5-3.5 V pm , as shown in Figure 10.35. These results represent one of the lowest fields ever reported for any field-emitting materials at technologically useful current densities. We attributed this emission... [Pg.350]

For example, it is not desirable to have a small anode connected to a large cathode as this favors accelerated localized anodic dissolution. Rivets of copper on a steel plate and steel rivets on a copper plate on immersion in seawater for a period of 15 months resulted in the steel plate covered with corrosion products while the steel rivets were corroded completely and disappeared. As copper is more noble than iron, it accelerated the hydrogen reduction reaction for the oxidation of the steel plate. In the case of the copper plate with steel rivets, the steel rivets corroded because of the relatively important cathodic surface of copper. The same reasoning applies to the corrosion of noncoated auto parts in contact with a large stainless steel surface (Fig. 1.6). [Pg.7]

A copper plate, with dimensions of 3 cm X 3 cm X 5 cm (length, width, and thickness, respectively), is exposed to a thermal energy source that puts out 150 J every second, as shown in the accompanyii figure. The density of copper is 8900 1 /m. Assuming no... [Pg.317]

The major workhorse of the diaphragm-cell electrolysis is the ELTECH electrolyzer, H-4 and MDC-55. There are several conunon features in these cell designs, as can be seen in Fig. 5.17. The base of the cell is a copper plate with spot faced holes to anchor the anodes (Fig. 5.18). It also acts as a current conductor. Either a sheet rubber cover or a titanium base cover using rubber rings around the anode posts protects the copper base. [Pg.408]

The first successful attempt on continuous distillation and improved efficiency as well as profitability was the Coffey Still in 1831. It was used to produce Whisky. The Coffey Still consists of two columns called analyser and rectifier. The fermented feedstock is preheated against condensing vapours in the rectifier and fed at the top of the analyser. The liquid flows over a copper plate with openings and from there into a down-comer leading onto another, underlying plate, and so on. More than 10 perforated plates (called trays) are typically installed in the analyser. [Pg.281]

This approach was used in paper chromatography the chromatographic spot was wetted with electrolyte solution and sandwiched between Pt electrodes or amalgamated electrodes and a voltammogram was recorded. It was also possible to use thin-layer chromatography, when a copper plate with an alumina layer supported by... [Pg.148]

The advancing contact angle 0a was measured with the sessile drop method [26]. Two flat plates were used a copper plate with 0a = 62° (good wettability) and an acrylic plate coated with paraffin with 0a = 104° (poor wettability). [Pg.111]


See other pages where Copper plating with is mentioned: [Pg.1905]    [Pg.164]    [Pg.207]    [Pg.761]    [Pg.466]    [Pg.317]    [Pg.282]    [Pg.349]    [Pg.308]    [Pg.1905]    [Pg.706]    [Pg.1292]    [Pg.754]    [Pg.1507]    [Pg.706]    [Pg.266]   
See also in sourсe #XX -- [ Pg.503 ]




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Copper plating

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With Copper

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