Copper plating characteristics

The HF-treated Cu33Zr67 alloy exhibits higher activity than a similarly treated Cu TUs sample showing characteristics similar to those of a copper plate. XPS measurements revealed (109) that Ti was almost lost from the Cu-Ti surface after the HF treatment whereas a noticeable amount of Zr still remained on the Cu-Zr. Therefore, the higher activity may be due to the presence of Zr in the surface layer. Since the HF-corroded Cu-Zr exhibited characteristics similar to a Cu plate, it seems unlikely that its activity is due to some peculiar ensemble of Cu atoms emphasized by surrounding Zr atoms. 

Electrodeposition of copper is one of the most important deposition processes in industry. Copper is already being refined by electrolysis. Copper plating is the main deposition process for the production of printed circuit boards. Plating processes for many applications are known with varying results for the characteristic properties of the deposits. Examples are... 

Electrodes. AH of the finished silver electrodes have certain common characteristics the grids or substrates used in the electrodes are exclusively made of silver, although in some particular cases silver-plated copper is used. Material can be in the form of expanded silver sheet, silver wire mesh, or perforated silver sheet. In any case, the intent is to provide electronic contact of the external circuit of the battery or cell and the active material of the positive plate. Silver is necessary to avoid any possible oxidation at this junction and the increased resistance that would result. 

Microelectronic devices on silicon chips are typically made from layers of n-type and p-type silicon. Films of silica act like the plastic sheath on copper cable, since silica is insulating. A layer of p-type silicon back to back with a layer of n-type, called a p-n junction, allows a current moving across the junction to flow in one direction but not the reverse. This one-way behaviour is the fundamental characteristic of a device called a diode. Early diodes in electronics were made from metal plates sealed inside evacuated glass tubes, which could be seen glowing in the innards of old radio sets. Diodes made from doped silicon can be much smaller and more robust since they are made from solid materials, they are components of solid-state electronics. 

Electrodes. All of the finished silver electrodes have certain common characteristics the grids or substrates used in the electrodes are made exclusively of silver, although in some particular cases silver-plated copper is used,... 

Metals and ceramics (claylike materials) are also used as matrices in advanced composites. In most cases, metal matrix composites consist of aluminum, magnesium, copper, or titanium alloys of these metals or intermetallic compounds, such as TiAl and NiAl. The reinforcement is usually a ceramic material such as boron carbide (B4C), silicon carbide (SiC), aluminum oxide (A1203), aluminum nitride (AlN), or boron nitride (BN). Metals have also been used as reinforcements in metal matrices. For example, the physical characteristics of some types of steel have been improved by the addition of aluminum fibers. The reinforcement is usually added in the form of particles, whiskers, plates, or fibers. 

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