Ceramic metallization technologies thick-film

Equally important as tape casting in the fabrication of multilayer ceramics is thick film processing. Thick film technology is widely used in microelectronics for resistor networks, hybrid integrated circuitry, and discrete components, such as capacitors and inductors along with metallization of MLC capacitors and packages as mentioned above. 

Thick-Film Multilayer. Thick-film multilayer technology has been used for many years to fabricate hybrid circuits that interconnect small-scale ICs or discrete components on a ceramic or metal substrate (67-70). This technology has also been used for multichip packaging of more highly integrated ICs for large computer applications. 

In thick-film technology (layer thickness > 1 pm), roll or tampon printing methods well known in the porcelain industry are suitable for applying layers of defined geometry on the green ceramic. The thickness is controlled by precise adjustment of the paste viscosity and solid content. To provide an adequate three-phase boundary, zirconia is added to the platinum to form a cermet (ceramic-metal compound). 

Bare die and other chip devices are attached with electrically conductive or nonconductive adhesives to ceramic substrates having defined circuit patterns produced by thin-film vapor deposition and photoetching of metals or by screen-printing and firing of thick-film pastes. With recent advancements in fine-line printed-circuit boards, adhesives are also finding use in attaching bare die to PWBs, a technology known as chip-on-board (COB). 

Electronic circuits must be protected from the harsh environment of the human body. The packaging of implantable electronics uses various materials, including polymers, metals, and ceramics. The encapsulation method depends somewhat on the electronic circuit technology. Older devices may still use discrete components in a classical form, such as leaded transistors and resistors. The newer designs, depending on the sophistication of the implanted device, may employ application-specific integrated circuits (ASICs) and thick film hybrid circuitry for their implementation. Such circuits place considerable requirements for hermeticity and protection on the implanted circuit packaging. 

The method of deposition is what differentiates the hybrid circuit from other packaging technologies and may be one of two types thick film or thin film. Other methods of metallizing a ceramic substrate, such as direct bond copper, active metal brazing, and plated copper, may also be considered to be in the hybrid family, but do not have a means for directly fabricating resistors and are not considered here. Semiconductor technology provides the active components, such as integrated circuits, transistors, and diodes. The passive components, such as resistors, capacitors, and inductors, may also be fabricated by thick- or thin-film methods or may be added as separate components. 

Ceramic technology offers a wide choice of conductor metallizations, and various conductor technologies are used with ceramics. Screen-printed and photo-defined, thick-film, thin-film, electroplating [3], electroplating over thick film, and direct bond copper (DBC) [4] are tfie most prevalent metallizations. 

The composihon and characterishcs of the paste are critical factors in screen printing. The cermet (combinahon of ceramic and metal) pastes commonly used in the thick-film technology have four major ingredients (1) an active element that establishes the frmction of the film, (2) an adhesion element that provides the adhesion to the substrate, (3) an organic binder a matrix that holds the active particles in suspension and which provides the proper fluid properhes for screen printing, and (4) a solvent or thinner that establishes the viscosity of the vehicle phase [21,22]. 

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