Ceramic metallization technologies

Enamel Bibliography and Absiracis, American Ceramic Society (1928-39, 1940-49, 1950-59) Vargin, V. V., Technology of Enamels, (translated Shaw, K.), Maclaren and Sons (1967) Salamah, M. A. and White, D., Surfaces and Interfaces in Ceramic-Metal Systems, Vol. 14, pp. 467-476 (1981)... 

PEAT, Inc., has developed the thermal destruction and recovery (TDR) system for the treatment of medical, hazardous, and radioactive wastes. An electronic plasma heating system is used to break down wastes into three phases. The ceramic, metal, and off-gas phases can aU be used as commercial products. The technology has been evaluated in treatability studies on infectious medical waste. Department of Defense (DOD) ammunition and energetic materials, U.S. Department of Energy (DOE) weapon components, ash, electronic scrap, batteries, asbestos, and organic compounds. 

University of Illinois Urbana-Champaign. Materials Science and Technology. Available online. URL http //matsel.mse.uiuc.edu/ tw/. Accessed May 28, 2009. Thanks to the hard work of dozens of high school teachers, as well as a number of college professors and students, this Web site presents a highly informative set of pages on the science of materials. There are modules on ceramics, metals, polymers (plastics), composites, concrete, and more. 

The most advanced implementation of cofired-ceramic-packaging technology is the thermal conduction module (TCM) used in large-scale computers (IBM) (4, 72, 74). This package can accommodate over 100 flip-chip-bonded ICs on a 90 by 90 mm cofired ceramic substrate. The multilayer ceramic substrate contains 33 metal layers for chip pad redistribution, signal interconnection, and power distribution (Figure 14). Each chip contains 120 bonding pads, and 1800 pins are brazed to the bottom of the substrate for connection to a PWB. 

Alumina ceramics are used wherever exceptionally good dielectric properties, high mechanical strength and high thermal conductivity, coupled with a reliable ceramic-metal joining technology such as the moly-manganese process, are demanded. Examples of components are illustrated in Fig. 5.25. 

Carbide powder is manufaetured by carburization of the metal, metal oxide or metal hydride with nuclear-pure graphite at ca. 2000°C. Carbide powder pellets (see Section 5.5.5.1.5) or beads up to 0.6 mm in diameter are formed and sintered using ceramic process technology. Reaction sintering is commonly used for the manufacture of uranium earbide fuel beads, in whieh uranium oxide and carbon are first mixed then annealed to form the carbide and then are sintered to 90 to 95% of the theoretical density. An... 

Volume I The Use of Phase Diagrams in Ceramic, Glass, and Metal Technology Volume II The Use of Phase Diagrams in Metal, Refractory, Ceramic, and Cement Technology... 

In thick-film technology (layer thickness > 1 pm), roll or tampon printing methods well known in the porcelain industry are suitable for applying layers of defined geometry on the green ceramic. The thickness is controlled by precise adjustment of the paste viscosity and solid content. To provide an adequate three-phase boundary, zirconia is added to the platinum to form a cermet (ceramic-metal compound). 

The term composite membrane, as defined in membrane technology, refers to membranes with two or more distinct layers. A layer within a composite membrane could itself be a composite material possessing two or more distinct components, as in membranes employing a layer of palladium cermet (ceramic-metal) supported by a layer of porous ceramic. The layers need not be composite, as in membranes using films of palladium on both sides of foils of niobium, tantalum, vanadium or zirconium. 

The polymer pyrolysis technology has several advantages over the conventional methods and some of these include the ability to purify precursors at low cost lower processing temperature versatility of precursors to form complex shapes, films, fibers, etc the opportunity to prepare novel materials such as ceramic-ceramic and ceramic-metal composites and modify chemical, physical, optical, mechanical, and electrical properties and at least some ability to control grain size, microstructure, and crystallinity, thereby allowing densification at temperature lower than traditional processing temperatures. 

---