Paste resistance

Papp-. paperboard, pasteboard, cardboard, -band, m. board binding volume bound in boards, -bogen, m. sheet of pasteboard (or cardboard), -deckel, m. pasteboard, paper-board. -druck, m. paste resist printing, -diite, /. heavy-paper bag. 

Papp-karton, m. paperboard box, carton, -masse,/. papier-m ch6. -reserve,/. (Calico) paste resist, -schachtel, /. paperboard box. -schinn, m. paperboard screen, -ffite, /. heavy-paper bag. -weiss, n. (Calico) pigment white. 

The past resistance to the validation of APIs is that much of the required information and documentation should be contained within the scope and requirements of a successfully completed DMF. A DMF document, however, does not have the legal weight of the CGMP regulations, which provide the basis for requiring API validation documentation. 

Stabilization/solidification of hazardous liquids and sludges by combination of the waste with Portland cement to form a cement paste has been studied as a way to minimize environmental impact. The structure of the paste resists physical attack and the alkaUne nature of the material resists chemical attack, making the technique attractive as a disposal alternative for heavy metal sludges. 

A high to medium reactive, amine acceierated rigid tetrahydrophthaiic base resin, cured with BPO and suitabie for putties and filler pastes. Resistant to standard and methanol containing petrol. 

For resist printing first a printing paste (resist) is printed on a textiie fabric. In a subsequent dyeing process the applied printing resist prevents a local, partial, or complete staining of the textile fabric in these areas. 

A solid, by definition, is a portion of matter that is rigid and resists stress. Although the surface of a solid must, in principle, be characterized by surface free energy, it is evident that the usual methods of capillarity are not very useful since they depend on measurements of equilibrium surface properties given by Laplace s equation (Eq. II-7). Since a solid deforms in an elastic manner, its shape will be determined more by its past history than by surface tension forces. 

The derivatives are hydroxyethyl and hydroxypropyl cellulose. AH four derivatives find numerous appHcations and there are other reactants that can be added to ceUulose, including the mixed addition of reactants lea ding to adducts of commercial significance. In the commercial production of mixed ethers there are economic factors to consider that include the efficiency of adduct additions (ca 40%), waste product disposal, and the method of product recovery and drying on a commercial scale. The products produced by equation 2 require heat and produce NaCl, a corrosive by-product, with each mole of adduct added. These products are produced by a paste process and require corrosion-resistant production units. The oxirane additions (eq. 3) are exothermic, and with the explosive nature of the oxiranes, require a dispersion diluent in their synthesis (see Cellulose ethers). 

The solder and ahoy market, including low melting or fusible ahoys, is a principal user of indium (see SoLDERS AND BRAZING ALLOYS). The addition of indium results in unique properties of solders such as improved corrosion and fatigue resistance, increased hardness, and compatibhity with gold substrates. To fachitate use in various appHcations, indium and its ahoys can be easily fabricated into wine, ribbon, foil, spheres, preforms, solder paste, and powder. 

Metal powder—glass powder—binder mixtures are used to apply conductive (or resistive) coatings to ceramics or metals, especially for printed circuits and electronics parts on ceramic substrates, such as multichip modules. Multiple layers of aluminum nitride [24304-00-5] AIN, or aluminay ceramic are fused with copper sheet and other metals in powdered form. The mixtures are appHed as a paste, paint, or slurry, then fired to fuse the metal and glass to the surface while burning off the binder. Copper, palladium, gold, silver, and many alloys are commonly used. 

Use of a shoe poHsh imparts high gloss, maintains the supple hand of the leather (qv), and increases the weather resistance of the leather (3,57—59). Three general types of poHshes are produced solvent pastes, self-polishing Hquids, and emulsion creams. Solvent pastes represent ca 60% of the market (58). 

Cordierite [12182-53-5] Mg Al Si O g, is a ceramic made from talc (25%), kaolin (65%), and Al O (10%). It has the lowest thermal expansion coefficient of any commercial ceramic and thus tremendous thermal shock resistance. It has traditionally been used for kiln furniture and mote recently for automotive exhaust catalyst substrates. In the latter, the cordierite taw materials ate mixed as a wet paste, extmded into the honeycomb shape, then dried and fired. The finished part is coated with transition-metal catalysts in a separate process. 

In the 2inc chloride cell, precipitated basic 2inc chloride is the primary anode product because of the low concentration of ammonium chloride in the cell. Water and 2inc chloride are consumed in equations 1 and 7 and must be provided in adequate amounts for the cell to discharge efficiendy. Usually more carbon is used in 2inc chloride cells than in Led an chit cells in order to increase the electrolyte absorptivity of the cathode and thus allow the use of a larger volume of electrolyte. Also, the use of a thin paper separator, which decreases internal resistance, allows less space for water storage than the thick, pasted separator constmction traditionally used in Leclanchn cells. 

Properties. Under nitrogen pressure hexagonal boron nitride melts at about 3000°C but sublimes at about 2500°C at atmospheric pressure. Despite the high melting point, the substance is mechanically weak because of the relatively easy sliding of the sheets of rings past one another (3). The theoretical density is 2.27 g/mL and the resistivity is about 10 H-cm. 

Urea—formaldehyde (UF) resias commonly were used ia the past. However, because of the lack of moisture resistance and the potential for the resias to hydroly2e ia the presence of moisture and decompose iato urea and formaldehyde, they are not used as much now. Governmental regulations are under development that eliminate the use of UF resia ia wood products. This would limit the exposure of the pubHc to formaldehyde, a Hsted carciaogen, formed by the decomposition of UF resia. Today most wood products use pheaol—formaldehyde (pheaoHc) resias, but urethane-based resias are becoming more common. 

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