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National Center of Manufacturing Science

We are getting a lot of positive feedback from our partners. [Our] members regard an ATP award as the gold medal in the research Olympics. This quote from the Ohio Aerospace Institute (OAI) is not only wonderful because of how it captures the prestige felt by ATP participants, but also because it allows me to highlight the fact that we have a number of not-for-profit companies that successfully lead joint ventures. OAI is one of them and so is the National Center for Manufacturing Sciences, which Christopher Hill mentioned in his presentation. [Pg.119]

National Academy of Sciences, 1097 National Ambient Air Quality Standards (NAAQSs), 590, 592, 593, 595 National Center for Manufacturing Sciences, 954... [Pg.2755]

Chalmer P (2008) The future of finishing. National Center for Manufacturing Sciences (NCMS), Ann Arbor, p 32. www.nmfrc.org/futfinrev2.doc... [Pg.105]

Contact resistance between an ICA (generally a Ag-flake-filled epoxy) and nonnoble metal finished components increases dramatically during an elevated temperature and humidity aging, especially at 85°C/85% RH. The National Center of Manufacturing and Science (NCMS) defined the stability criterion for solder replacement conductive adhesives as a contact resistance shift of less than 20% after aging at 85°C/85% RH conditions for 500 h (67). [Pg.1794]

Professional technical readers. This category includes research directors, research associates, and institutions involved in both the design and implementation of logistics systems in manufacturing and service-related projects. Examples include the National Center for Manufacturing Sciences and the Southwest Research Institute. [Pg.311]

Commercial Technologies for Maintenance Activities (CTMA) http //ctma.ncms.org (accessed October 27, 2010). This is collaboration between the National Center for Manufacturing Sciences and the Department of Defense. Organizational members benefit from the use of new manufacturing technologies created under CTMA activities. This Web site gives details about CTMA projects and services, and a newsletter is also available. [Pg.360]

AH, J/mol and T, K. Studies were performed under the auspices of the National Center for Manufacturing Sciences (NCMS) consortium, which examined the compression creep of bulk 96.5Sn-3.5Ag solder (Ref 69). There was an inadequate amount of data to be fit to the sinh law equation. However, the data were fit to the power law equation the resulting expression appears below as Eq 14 ... [Pg.94]

The approximate number of years of industry experience about 50 years for Sn-Pb assembly versus about 12 years for lead-free or SAC, using a starting date of 1992 for the first lead-free consortium project in North America, under the auspices of the National Center for Manufacturing Sciences (NCMS) (Ref 34). [Pg.124]

The National Center for Manufacturing Sciences (NCMS) backed by a consortium of North American industrial corporations, national laboratories, and academic institutions conducted an evaluation of alternatives to eutectic Sn-Pb solder between 1992 and 1996. Corporate participants included ATT-Lucent, Ford Motor Company, GM-Delco Electronics, GM-Hughes Aircraft, Hamilton Standard, National Institute for Standards and Technology (NIST), Rensse-lear Polytechnic Institute, Rockwell International, Sandia National Laboratories, Texas Instruments, and the U.S. Navy s Electronics Manufacturing Productivity Facility. The goal of the project was to determine whether safe, cost-effective, nontoxic, reliable lead solder alternatives could be identified. With over 79 alloys examined, the study results indicated that while a number of possible lead-free solders were functionally possible, there was no universal drop-in replacement for lead-based solders in electronics applications. This study is discussed in detail in Chap. 17. [Pg.163]

A concern has been raised with regard to the replacement of Pb with Bi metal in current Pb-Sn solder applications. Since the major source of Bi metal is as a by-product of Pb refining [40], the replacement of Pb with Bi would lead to the dilemma of drastically increasing the amount of refined Pb metal. However, since the amount of Pb used in electronics is less than 2% of the total Pb consumption, the mining of Pb for automobile batteries which utilizes approximately 80% of the Pb consumed would provide a sufficient supply of Bi metal. The final report of the National Center for Manufacturing Sciences (NCMS) on Lead-Free Solder Project has raised a serious... [Pg.287]

From 1992 to 1996, the National Center for Manufacturing Sciences (NCMS), a not-for-profit cooperative research consortium of more than 200 North American manufacturers, national laboratories, and universities, carried out a multiyear effort to develop Pb-free alternatives to Pb-based solders used for electronics assembly [2]. The proposed Reid bill, banning or taxing the use of lead in electronics, sensitized the microelectronics industry to the possible need to remove Pb from solders, and led to the formation of this project. The total cost of the research project was 10.6 million, with approximately 1 million coming from Department of Defense funds and the balance from in-kind contributions. Participating organizations and primary technical contacts are presented in Table 1. [Pg.666]

Ranky, P. G., Focus on RFID (radio frequency identification) methods, technologies and education, presented as part of the NCME Mission (National Center for Manufacturing Education), sponsored by NSF (National Science Foundation, USA) and industry, Jan. 2006. [Pg.195]

Our laboratory has recently been selected by the National Aeronautics and Space Administration (NASA) as one of its two national centers of excellence in separation science. This has given us an opportunity to broaden our efforts towards the advancement of all modes of electrophoresis for large scale processing. Thus, our Center has been chosen by European manufacturers as the demonstration site for the United States of two unique electrophoretic instruments. [Pg.191]

He received his Ph.D. from Cornell University in 1974 and worked on semiconductor manufacturing techniques at the Engineering Research Center of Western Electric Co. until 1976. He then spent a year as a director s postdoctoral staff member at Los Alamos National Laboratory and moved to Madison as an assistant professor in 1977. He was chair of the department from 1995 to 1998, and is currently chair of the Committee on Professional Training of the American Chemical Society. His research in chemical reaction dynamics uses lasers to explore and control the course of chemical reactions in both gases and liquids. He is a member of the National Academy of Sciences. [Pg.50]


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