Epoxy cured

The two-part epoxy adhesive, readily available in hardware stores or other consumer outlets, comes in two tubes. One tube contains the epoxy resin, the other contains an amine hardener. Common diamine room temperature epoxy curing agents are materials such as the polyamides, available under the trade name Versamid. These polyamides are the reaction products of dimer acids and aUphatic diamines such as diethylenetriamine [111-40-0] ... 

The production of alkylphenols exceeds 450,000 t/yr on a worldwide basis. Alkylphenols of greatest commercial importance have alkyl groups ranging in size from one to twelve carbons. The direct use of alkylphenols is limited to a few minor appUcations such as epoxy-curing catalysts and biocides. The vast majority of alkylphenols are used to synthesize derivatives which have appUcations ranging from surfactants to pharmaceuticals. The four principal markets are nonionic surfactants, phenoUc resins, polymer additives, and agrochemicals. 

High purity 4-dodecylphenol is used to produce specialty surfactants by its reaction with ethylene oxide. The low color of high purity 4-dodecylphenol is important in this appHcation from a standpoint of aesthetics. 4-Dodecylphenol is also used to produce phenoHc resins which are used in adhesive appHcations and printing inks. 4-Dodecylphenol is also used as an epoxy curing catalyst where the addition of 4-dodecylphenol accelerates curing of the epoxy resin to a hard, nontacky soHd. 

Only a few commercial uses for TDA per se have been found. In epoxy curing appHcations, 2,4- I DA has been used as a component of a eutectic mixture with short chain aUphatic glycidal ether resins (46) as well as by itself (46,47) TDA (46) and single isomers (47) are also used as amine curatives. TDA can be used as a chain extender in polyurethanes (48,49). TDA is cited as a monomer in making aromatic polymers with unique properties, eg, amorphous polyamides (50), powdered polyamides (51), and low melting, whoUy aromatic polyamides (52). 

Fig. 9. Initiation of epoxy cure. Irradiation of a triaryl sulfonium salt produces a radical cation that reacts with an organic substrate RH to produce a cation capable of releasing a proton. The proton initiates ring-opening polymerization. X = BF , PFg, AsFg, and SgFg. ...

Epoxy cross-linking is cataly2ed by TYZOR TPT and TYZOR TBT, alone or with piperidine, and by TYZOR TE. The soHd condensation product from 3 TPT 4 TEA (triethanolamine) has also been appHed to epoxy curing (490). Titanate curing is accelerated by selected phenoHc ethers and esters at 150°C the mixtures have along pot life at 50°C (491) (see Epoxyresins). 

Comparisons of the properties of solvent-free Hquid coatings based on unmodified bisphenol A epoxies cured with varying amine hardeners are shown in Table 6. Examples include diethylenetriamine [111-40-0] H2NC2H4NHC2H4NH2 (7), triethylenetetramine [112-24-3] ... 

Epoxy cured silicones were developed to be photo initiated rather than thermally cured [54]. The chain length of these materials ranges to 200 monomer repeat units, but the majority component of most formulations is significantly shorter. The structure of a typical base polymer is shown in Fig. 4. The chain can be terminal and/or pendant functional, with degree and type of epoxy function-... 

Kinetically controlled epoxy curing reactions, 10 423 Kinetic barriers, 11 529 Kinetic friction, 15 224 Kinetic incompatibility, in acrylonitrile copolymerization, 11 203 Kinetic measurements, 14 607-629. See also Very fast kinetics combined methods for unstable reagents, 14 621... 

Stoichiometric combustion air requirement, 72 322t Stoichiometric concentration, 27 840 Stoichiometric organic synthesis, metal carbonyls in, 76 72 Stoichiometric parameters, in reactor technology, 27 337-338 Stoichiometric ratios, epoxy/curing agent, 70 418-420... 

Fig. 8.5 Epoxy curing through resistive heating of nanocarbons dispersed in the matrix (a) shows a schematic representation of the process (b) experimentally obtained curing cycle and (c) repair of a structural composite panel using the conductive epoxy as resistively curable adhesive [36]. With kind permission from Elsevier (2013).

Cyanamide and its aromatic derivative, such as 4,4 -methylene bis(phenyl cyanamide), were reported to cure an epoxy resin at elevated temperatures.(4) It is also well known that the dimer of cyanamide (dicyandiamide) is the most important epoxy curing agent in one-package epoxy compounding.(5) Unfortunately, this dimer precipitates from the dispersion causing uneven mixing upon standing. 

In order to confirm that the polymer synthesized from a di-N-cyanourea compound was an epoxy curing agent, the polymer prepared for TDI, PCP (MW 530 g/mole) and cyanamide was dissolved in acetone with Epon 828, cast into film, and then heated at 165°C for 2 hours. Similar results were obtained. 

The desired volume of low molecular weight liquid was added and the three components - epoxy, curing agent, and low molecular weight liquid - were mixed together under gentle stirring at room temperature, until a clear and ho-... 

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