Aerospace resins epoxy with curing agent

Typically, a low molecular weight solid epoxy resin and latent curing agent, such as dicyandiamide dissolved in an appropriate solvent, are widely used in dry lay-up formulations for electrical laminates for computers, aerospace applications, and communications equipment. Wet lay-up systems are almost exclusively based on low-viscosity resins cured with aliphatic amines. These ambient cure resin systems are used primarily for manufacture of large chemical-resistant tanks, ducting, and scrubbers. Filament winding is used... 

Carboxylic acid and anhydride curing agents are used to a lesser extent in aerospace applications as compared to the amines which have mechanical properties and cure conditions that can be tailored to a wider variety of specific applications. Anhydrides tend to be somewhat brittle but offer useful service as high as 250 °C with novolac-type epoxy resins. In addition, the aliphatic dicarboxylic acid anhydrides give tough and sometimes flexible properties which are useful in encapsulation applications. 

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