Epoxy resin curing epoxide-phenol systems

Novolac resins are broadly used in electronics because their functionality higher than two increases the crossimkmg density and yields cured resins exhibiting enhanced chemical and physical properties. Mixtures of epoxy resins and phenol novolacs 61 are excellent structural adhesives in the aerospace industry. However, the phenolic hydroxyl groups are not very reachve at moderate temperatures and most systems include catalysts or accelerators. Classical adhesive compositions are prepared by mixing a solid epoxy resin, t5rpicahy an epoxidized phenol novolac resin (60 parts), a phenol novolac resin (40 parts), a solvent such as 2-butoxyethanol or butylcehosolve acetate, an imidazole catalyst, and silver flakes. 

---