Epoxy resins curing reactions summary

In Chapter 2 the DSC technique is discussed in terms of instruments, experimental methods, and ways of analysing the kinetic data. Chapter 3 provides a brief summary of epoxy resin curing reactions. Results of studies on the application of DSC to the cure of epoxy resins are reviewed and discussed in Chapter 4. These results are concerned with the use of carboxylic acid anhydrides, primary and secondary amines, dicyanodiamide, and imidazoles as curing agents. 

The basic chemical reactions, used to synthesize monomer and polymer resins and the chemistry involved in the use of curing agents to polymerize the resins, have been extensively studied and are well documented. This section serves as a summary only of those polymers that are primarily used in adhesives formulations for electronic applications. Among these polymers are the epoxies, silicones, polyurethanes, polyimides, acrylates, cyanate esters, and cyclo-olefins. Further technical detail for these polymers maybe acquired through literature searches in the transactions of the American Chemical Society (Polymer Group), Society of Plastics Engineers (SPE), and the Society for the Advancement of Materials and Process Engineers (SAMPE). 

---