Curing-induced shrinkage in epoxy resins

Monitoring the effect of micro-Znanofillers on curing-induced shrinkage in epoxy resins... 

Zarrelli M, Skordos A A and Partridge I K (2002), Investigation of cure induced shrinkage in unreinforced epoxy resin , Plast Rubber Compos Process Appl, 31, 377-384. doi 10.1179/146580102225006350. 

This chapter presents the study of the effect of various micro- and nanofiUers and different curing cycles on resin curing-induced shrinkage. The resin used in the experiments is conventionally used in aerospace and defense apphcations (Kelkar et al., 2006), a two-part toughened epoxy resin, namely SC-15. 3M Glass Bubbles iM16K, Cloisite 20A nanoclay, and Cloisite 30B nanoclay with 0.5, 1, 2, 3, and 5 wt% concentrations were selected as micro- and nanofiUers, respectively. 

Reactive adhesives such as epoxy and acrylic resins may induce shrinkage stresses that reduce often the bonding strengths. Therefore, the volume shrinkage should be measured by standards such as JIS K6911, in which adhesives are cured in a mold and the dimension of the adhesive is measured to calculate the shrinkage ratio. 

---