Diaminodiphenyl sulfone, curing epoxy adhesives

A variety of aromatic polyfunctional amines is also used in curing epoxy adhesives. They generally are slower to react than the aliphatic amines and require a heat cure to be practical. They do provide generally better high-temperature properties than the aliphatic amines. The most commonly used aromatic amine curatives are m-phenylenediamine (MPDA, DuPont), methylenedianiline (MDA, Bayer), and diaminodiphenyl sulfone (DDS, Aceto). Albemarle Corporation s Ethacure 100 is claimed to be a more user-friendly... 

The chemical structures of important amines for curing epoxy resins in adhesive systems are identified in Fig. 5.1. Diethylenetriamine (DETA), triethylenetetramine (TETA), ra-aminoethylpiperazine (AEP), diethylaminopropylamine (DEAPA), ra-phenylenediamine (MPDA), and diaminodiphenyl sulfone (DDS) are the most commonly used members of this class. They are all primary amines. They give room or elevated temperature cure at near stoichiometric ratios. Ethylenediamine is too reactive to be used in most practical adhesive formulations. Polyoxypropyleneamines (amine-terminated polypropylene glycols) impart superior flexibility and adhesion. 

Adhesive B. Bulk materials and adhesive film were made with a blend of diglycidyl ether of bisphenol A (DGEBA) epoxy resin in a solid form (epoxy equivalent weight 530), 25 parts, and liquid form (epoxy equivalent weight 190), 75 parts, and were cured with 4,4 -diaminodiphenyl sulfone (DDS, amine equivalent weight 64), 28 parts, and toughened with the core-shell polymers, 0 or 15 parts (Table II). 

---