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Curing epoxy adhesives

TABLE 11.7 Typical Formulation for an Epoxy Adhesive Cured with an Amidoamine6... [Pg.209]

TABLE 11.8 Typical Epoxy Adhesive Cured with Triethylenetetramine9... [Pg.210]

TABLE 11.9 Room Temperature Cure, General-Purpose Epoxy Adhesive Cured with Triethylenetetramine10... [Pg.210]

TABLE 11.11 Quick-Curing Epoxy Adhesive Cured with a Poly mercaptan14... [Pg.212]

TABLE 12.2 General-Purpose Two-Component Epoxy Adhesive Cured with DEAPA1... [Pg.229]

TABLE 12.4 Starting Formulations for Epoxy Adhesives Cured with MPDA2... [Pg.231]

TABLE 12.7 One-Component Epoxy Adhesive Cured with Dicyandiamide9... [Pg.234]

BFj-MEA cured epoxy adhesives are very economical to produce since only a small amount of catalyst is required. These adhesives have good elevated service temperature. Table 12.10 is a starting formulation for a one-component epoxy adhesive cured with a BE3 MEA catalyst. It has a shelf life of approximately 4 months at room temperature. [Pg.236]

PMDA or trimellitic anhydride has also been shown to provide epoxy adhesive formulations with high-temperature properties. Table 12.13 shows the elevated-temperature tensile shear strength of an epoxy adhesive cured with 4 pph of PMDA. Another specialized formulation employing PMDA was found to provide high shear strength when tested at 260°C even after aging 1000 h at 260°C.15... [Pg.239]

TABLE 12.13 Tensile Shear Strength of Epoxy Adhesive Cured with PMDA17... [Pg.240]

Several studies have shown that a microwave cure cycle can be developed that provides equivalent performance properties to a thermal cure cycle. Table 14.9 shows the processing and performance characteristics of three commercial one-component epoxy adhesives cured via microwave and conventional thermal energy. Certain commercial epoxy adhesives could contain a large number of bubbles due to volatiles present during the cure cycle and the fast rate of cure. Therefore, specifically formulated adhesives for microwave curing may be necessary to optimize performance. [Pg.278]

Typical formulation for an epoxy adhesive cured with an amidoamine Typical epoxy adhesive cured with triethylenetetramine (TETA)... [Pg.485]

Quick-curing epoxy adhesive cured with polymercaptan Starting formulations for rapid-setting, room temperature curing epoxy adhesives... [Pg.485]

General-purpose, two-component epoxy adhesive cured with DEAPA... [Pg.486]

Starting formulation for epoxy adhesive cured with MPDA... [Pg.486]

Epoxy adhesives cured with polyamidoamines are flexible, tough, durable adhesives useful on a wide variety of adherends. They probably have contributed heavily to making the words epoxy and adhesive equivalent for many people. [Pg.603]

Figure 27 Shear storage modulus, G, and damping, G", as a function of temperature for a carbon fiber-reinforced epoxy adhesive cured at 120°C. [Pg.324]

Table 4.4. Effect of joint geometry on the apparent shear strengths of two epoxy adhesives cured at 20 C... [Pg.143]

The final paper, a contribution from The Institute of Chemistry in Beijing, covers the development and some of the properties of a CTBN-toughened epoxy adhesive cured with an imidazole. [Pg.171]

The above approach has not, to date, been extended to include steel, although considerable effort is expended in its pre-treatment prior to painting. The current practice is to weld bond oil steel using single-part epoxy adhesives curing during the first (electrocoat)... [Pg.59]

Fig. 1. XPS survey scan of the surface of an epoxy adhesive cured in contact with PTFE. The PTFE film became detached in a peel test at very low load, but some transfer to the epoxide has taken place. Characteristic core level peaks (e.g. F Is), Auger peaks (F KLL) and valence band peaks (VB) are all present in this spectrum... Fig. 1. XPS survey scan of the surface of an epoxy adhesive cured in contact with PTFE. The PTFE film became detached in a peel test at very low load, but some transfer to the epoxide has taken place. Characteristic core level peaks (e.g. F Is), Auger peaks (F KLL) and valence band peaks (VB) are all present in this spectrum...
Holubka, J. W., Bach, R. D., Andres, J. L. 1992. Theoretical study of reaction of ethylene oxide and ammonia. A model study of the epoxy adhesive curing mechanism. Macromolecules 35 1189-1192. [Pg.270]

Fig. 5. Fracture envelope, Gc versus phase angle, f, for FPL-etched 7075-T6 aluminum ad-herends bonded with 0.4 mm Cybond 4523GB epoxy adhesive cured at 150 C for 45 min... Fig. 5. Fracture envelope, Gc versus phase angle, f, for FPL-etched 7075-T6 aluminum ad-herends bonded with 0.4 mm Cybond 4523GB epoxy adhesive cured at 150 C for 45 min...
Aluminum inserts, frames, and titanium telecom reflector parts can also be bonded by two-part epoxy adhesives cured at room temperature. [Pg.1156]

Araldite epoxy adhesive, cured 17 hat 40 °C lap joint 13 mm wide with 13 mm overlap. Totalbondarea 170 mnf substrate aluminum. Testing method tested shear at 20 mm/min. [Pg.116]


See other pages where Curing epoxy adhesives is mentioned: [Pg.318]    [Pg.334]    [Pg.655]    [Pg.223]   
See also in sourсe #XX -- [ Pg.186 ]

See also in sourсe #XX -- [ Pg.100 ]




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Adhesion epoxies

Adhesive curing

Cured adhesives

Curing epoxy

Diaminodiphenyl sulfone, curing epoxy adhesives

Elevated-Temperature Curing Liquid and Paste Epoxy Adhesives

Epoxy Adhesives That Cure by Indirect Heating

Epoxy adhesives

Epoxy adhesives amide-amine curing agents

Epoxy adhesives amine curing agents

Epoxy adhesives anhydride curing agents

Epoxy adhesives catalytic-curing agents

Epoxy adhesives curing agents

Epoxy cured

Room Temperature Curing Epoxy Adhesives

Two-Part Room Temperature Curing Epoxy Adhesives

Ultraviolet and Electron Beam Cured Epoxy Adhesives

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