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Photolithography process

Figure 14.15 Outline of the photolithography process for producing integrated circuit chips. Figure 14.15 Outline of the photolithography process for producing integrated circuit chips.
Metal is then deposited into the opened vias (openings) in the oxide layer and over its surface. During the subsequent photolithography process, it is patterned to form the desired electrical interconnections. These two steps are repeated for each succeeding level to produce additional levels of interconnections. Finally, a protective overcoat of oxide/nitride is applied (passivation), and vias are opened so that the wires eonnectlng the IC chip to its carrier package can be bonded to output pads. [Pg.333]

TABLE 1. Compositions of Perfluoro Resist Protective Copolymer Coating Monomers Useful in Immersion Photolithography Processes" Prepared According to the Current Invention... [Pg.577]

Fabrication of Multi-Phase Organosilane Monolayers through Chemisorption and Photolithography Process... [Pg.201]

Fig. 6.8. In situ synthesis of DNA probes on a silicon substrate. An example of a 3 X 3 array is shown in which 3-mers are synthesized in three different locations of the array. Defined locations on the surface of a silicon wafer are activated via a photolithography process using a mask, and subsequently exposed to an activated nucleic acid nucleotide which bears at the same time a photoactivatable protection group for further coupling reactions. With each exposure step a new nucleotide can be synthesized into a defined location. Fig. 6.8. In situ synthesis of DNA probes on a silicon substrate. An example of a 3 X 3 array is shown in which 3-mers are synthesized in three different locations of the array. Defined locations on the surface of a silicon wafer are activated via a photolithography process using a mask, and subsequently exposed to an activated nucleic acid nucleotide which bears at the same time a photoactivatable protection group for further coupling reactions. With each exposure step a new nucleotide can be synthesized into a defined location.
Fig. 1 Schematic presentation of a commonly used photolithography process. (View this art in color at www.dekker.com.)... Fig. 1 Schematic presentation of a commonly used photolithography process. (View this art in color at www.dekker.com.)...
The process simulator PROLITHf is used to simulate a photolithography process and create a library of the input-technological parameters-profile relations. These profiles are then used to generate simulated diffraction responses, resulting in a library of diffraction-response-technological parameters-profile inter-relations. [Pg.2124]

Membranes deposited with a photolithography process. Spinning, UV exposure, and development of photosensitive materials are well known, low-cost, mass production procedures. One has to take into account, however, that photosensitized membrane materials needed in biosensors are not available commercially. To cope with this problem, one has to prepare the photosensitive material from high-purity materials. [Pg.86]

FIGURE 51.3 Schematic of the photolithography process to transfer a pattern to a silicon wafer, forming a template for microchannel imprinting. [Pg.1426]

Microphase separation (MPS) leading to regular patterns at nanometer levels formed by block copolymers in thin films has recently been a subject of intensive study. Such nanostructures allow for fabrication of even smaller feature sizes than those obtained by the conventional photolithography process, and have potentials for future nanofabrications (Lazzari et al., 2006). Attempts to create active and photocontrollable MPS systems are a fascinating challenge. [Pg.291]

Later, with the introduction of the photoresist SU-8, microstructures could be produced using the standard photolithography process, obtaining channel height of 100 pm and an aspect ratio of >10 1. Several typologies of SU-8 with different viscosities can be used to obtain different channel heights. [Pg.373]

An important process in integrated circuit manufacture is photolithography, where a circuit pattern is transferred ftom a mask onto a photosensitive polymer (the PR), ultimately replicating that pattern onto the surface of a silicon wafer (Lachman-Shalem et al., 2002). A typical photolithography process consists of seven consecutive steps spin coat of the PR, piebake, chiU, expose, postex-... [Pg.674]

Flexible circuits. Flexible circuits (flex circuits) are analogous to rigid printed-circuit boards except they are fabricated from a thin flexible dielectric film to which is adhesively bonded a thin copper foil. The copper is then photoetched to form a circuit pattern using normal photolithography processes. A plastic film (coverlay) is then adhesive bonded to the etched... [Pg.25]

Peles [4] made a micro heat exchanger using photolithography processes on a silicon substrate. The micro heat exchanger was based on multiple parallel triangular microchannels. The results obtained using pressure measurements and fast... [Pg.1132]

Photolithography is comprised of sequential process steps that are schematically summarized in Fig. 1. The process begins by choosing or preparing a substrate for the photolithography process. The ideal substrate should be dehydrated before any application of photoresist. This dehydration is usually done by a baking step called dehydration bake to remove adsorbed water from the substrate, usually a silicon wafer. Thereafter, the dehydrated substrate is spin coated with... [Pg.2712]

The reproducible drug loading of microcontainers for oral delivery of a poorly water-soluble compound has been detailed (40). A protot5rpe of such a device is made from an epoxy resin using a two-step photolithography process. The microcontainers are designed with a circular base, cylindrical walls, and an open top side with a cylindrical cavity of 50-300 pm in diameter. [Pg.246]


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See also in sourсe #XX -- [ Pg.7 , Pg.8 ]

See also in sourсe #XX -- [ Pg.941 ]




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