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Dielectric layer

It should be mentioned that as well as for metals the passivation of semiconductors (particularly on Si, GaAs, InP) is also a subject of intense investigation. However, the goal is mostly not the suppression of corrosion but either the fonnation of a dielectric layer that can be exploited for devices (MIS stmctures) or the minimization of interface states (dangling bonds) on the semiconductor surface [63, 64]. [Pg.2724]

Layer Stacks and Protective Layers. The layer stack of an MO disk consists mainly of an MO layer, a dielectric antirefiection layer, and a metallic reflection layer (Fig. 14). The thickness of the antireflection layer as well as that of the MO layer have to be properly chosen to obtain a maximum magnetooptical figure-of-mefit (FOM). The FOM can be further increased by using a quadfilayer configuration with dielectric layers on both sides of the MO layer. Practical disks use the generalized configuration 50—120-nm dielectric layer, 25—90-nm MO layer, 17—70-nm dielectric layer (for quadfilayer configuration only), and 15—150-nm reflective layer. [Pg.148]

Discharges initiate in the gap region between the electrodes and then spread into surface discharges at the surface of the dielectric layer. The bright surface discharges are on the order of a few mm in diameter and the power ranges from these lamps can be from a few watts to several kilowatts over a... [Pg.430]

Ellipsometry in the vacuum UV (< 190 nm) enables the analysis of materials for the next generation lithography (photoresist, AR coatings) at the latest exposure wavelengths (157 nm and 193 nm). The short wavelengths increase the sensitivity of ellipsometric measurements of ultra thin films (<10 nm). New prospects are expected for the analysis of thin metallic and dielectric layers. [Pg.269]

Figure 14-12. Various types of OFETs. (a) Inverted coplanar on a highly doped Si wafer, (b) inverted coplanar on a neutral substrate, (c) inverted staggered oil a neutral substrate, (d) inverted staggered using the dielectric layer as the substrate. Figure 14-12. Various types of OFETs. (a) Inverted coplanar on a highly doped Si wafer, (b) inverted coplanar on a neutral substrate, (c) inverted staggered oil a neutral substrate, (d) inverted staggered using the dielectric layer as the substrate.
Soft and smooth wall Charged hard spheres Low dielectric layer... [Pg.627]

Here, it is easy to see the various layers and steps necessary to form the IC. We have already emphasized the formation of the n- and p-wells 8uid the individual proeess steps needed for their formation. Note that an epitaxial layer is used in the above model. There are isolation barriers present which we have already discussed. However, once the polysilicon gate transistors are formed, then metal Interconnects must then be placed in proper position with proper electrical isolation. This is the function of the dielectric layers put into place as succeeding layers on the IC dice. Once this is done, then the wafer is tested. [Pg.333]

An ideal (classical) electrostatic capacitor consists of two plane-parallel metal plates having surface areas S and a mutual distance 5, the gap being filled with air or a dielectric layer (the latter variety often is called a film capacitor). When a capacitor is charged (by applying an electrostatic potential difference A / between the two plates), electrical charges +Q m electron deficit) and Q (an efectron excess), which are equal in magnitude but opposite in sign, will accnmulate on the plates. The values of Q are proportional to the potential difference ... [Pg.369]

Substrate material Price per unit area (arb. units) Dielectric permittivity of insulator Maximum working temperature (K) Resistivity of dielectric layer (fl-cm) Density (g/cm3) Linear expansion coefficient x i[Pg.490]

Figure 9. Propagating brush discharges, (a) Insulating dielectric layer of dielectric permittivity e thickness dlayer, and surface charge ey with conductive backing, (b) Example of improper use of plastic (PVC) pipe where surface charge builds up leading to risk of propagating brush discharge. Figure 9. Propagating brush discharges, (a) Insulating dielectric layer of dielectric permittivity e thickness dlayer, and surface charge ey with conductive backing, (b) Example of improper use of plastic (PVC) pipe where surface charge builds up leading to risk of propagating brush discharge.
Spin 10nm-5pm Uniformity, reproducibility, excellent thickness control, low cost Requires flat substrate, high material loss Photoresists, dielectric layers, flat panel displays... [Pg.50]

Budd, K. D. 1986. Structure evolution in sol-gel derived lead titanate-based materials, and application to the processing of thin dielectric layers. PhD dissertation. University of Illinois at Urbana-Champaign. [Pg.72]

Interference filters consist of several evaporated dielectric layers on a glass or quartz substrate. Their transmittance can be tailored by choosing appropriate layers. A problem is their limited bandwidth of transmission which is usually above AT. = 30 nm. Also, a substantial loss in sensitivity has to be accepted since the maximum transmission is limited to less than 40%. [Pg.170]

Bragg mirrors on periodic stacks of layers Periodic stacks of metal nanoparticles or dielectric layers with alternating high and low refractive index produce a desired reflectance of the mirror that depends on the thickness and the refractive index of the layers in the stack 16,17... [Pg.78]


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See also in sourсe #XX -- [ Pg.10 ]

See also in sourсe #XX -- [ Pg.135 ]




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Dielectric constant, in the double layer

Dielectric insulating layers, model

Dielectric layer fabrication

Dielectric layer model

Dielectric layers operating temperatures

Dielectric passivation layers

Dielectric surface layer

Dielectric, constant layer

Gate Dielectric Layers

Gate Dielectrics and Surface Passivation Layers for Organic Field Effect Transistors

Gradient-Index Single-Layer Dielectric Films

High-K dielectric layers

Insulating dielectrics layers

Interlevel dielectric layer

Multiple dielectric layers

Other Dielectric Layers Used in Microelectronics

Polyimide for dielectric layers

Spectroscopic Characterisation of Interfaces and Dielectric Layers for OFET Devices

Types of dielectric layers

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