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Interfaces states

Fowkes and Harkins reported that the contact angle of water on paraffin is 111° at 25°C. For a O.lAf solution of butylamine of surface tension 56.3 mJ/m, the contact angle was 92°. Calculate the film pressure of the butylamine absorbed at the paraffin-water interface. State any assumptions that are made. [Pg.381]

It should be mentioned that as well as for metals the passivation of semiconductors (particularly on Si, GaAs, InP) is also a subject of intense investigation. However, the goal is mostly not the suppression of corrosion but either the fonnation of a dielectric layer that can be exploited for devices (MIS stmctures) or the minimization of interface states (dangling bonds) on the semiconductor surface [63, 64]. [Pg.2724]

Interface states played a key role in the development of transistors. The initial experiments at Bell Laboratories were on metal/insulator/semiconductor (MIS) stmctures in which the intent was to modulate the conductance of a germanium layer by applying a voltage to the metal plate. However, only - 10% of the induced charges were effective in charging the conductance (3). It was proposed (2) that the ineffective induced charges were trapped in surface states. Subsequent experiments on surface states led to the discovery of the point-contact transistor in 1948 (4). [Pg.348]

Analysis of stress distributions in epitaxial layers In-situ characterization of dislocation motion in semiconductors Depth-resolved studies of defects in ion-implanted samples and of interface states in heterojunctions. [Pg.150]

Parker [55] studied the IN properties of MEH-PPV sandwiched between various low-and high work-function materials. He proposed a model for such photodiodes, where the charge carriers are transported in a rigid band model. Electrons and holes can tunnel into or leave the polymer when the applied field tilts the polymer bands so that the tunnel barriers can be overcome. It must be noted that a rigid band model is only appropriate for very low intrinsic carrier concentrations in MEH-PPV. Capacitance-voltage measurements for these devices indicated an upper limit for the dark carrier concentration of 1014 cm"3. Further measurements of the built in fields of MEH-PPV sandwiched between metal electrodes are in agreement with the results found by Parker. Electro absorption measurements [56, 57] showed that various metals did not introduce interface states in the single-particle gap of the polymer that pins the Schottky contact. Of course this does not imply that the metal and the polymer do not interact [58, 59] but these interactions do not pin the Schottky barrier. [Pg.278]

Figure 32. Shapes of PMC curves and photocurrent curves in a p+n junction formed from an n-type material by allowing in-diffusion of an acceptor (boron). The absence of interface states (sr = 0) generates a strong overlapping of the two curves. Figure 32. Shapes of PMC curves and photocurrent curves in a p+n junction formed from an n-type material by allowing in-diffusion of an acceptor (boron). The absence of interface states (sr = 0) generates a strong overlapping of the two curves.
Silicon wafer has been extensively used in the semiconductor industry. CMP of silicon is one of the key technologies to obtain a smooth, defect-free, and high reflecting silicon surfaces in microelectronic device patterning. Silicon surface qualities have a direct effect on physical properties, such as breakdown point, interface state, and minority carrier lifetime, etc. Cook et al. [54] considered the chemical processes involved in the polishing of glass and extended it to the polishing of silicon wafer. They presented the chemical process which occurs by the interaction of the silicon layer and the... [Pg.249]

At the interface of the nitride (Ef, = 5.3 eV) and the a-Si H the conduction and valence band line up. This results in band offsets. These offsets have been determined experimentally the conduction band offset is 2.2 eV, and the valence band offset 1.2 eV [620]. At the interface a small electron accumulation layer is present under zero gate voltage, due to the presence of interface states. As a result, band bending occurs. The voltage at which the bands are flat (the flat-band voltage Vfb) is slightly negative. [Pg.178]

It follows from the above that the mechanism for electrical potential oscillation across the octanol membrane in the presence of SDS would most likely be as follows dodecyl sulfate ions diffuse into the octanol phase (State I). Ethanol in phase w2 must be available for the transfer energy of DS ions from phase w2 to phase o to decrease and thus, facilitates the transfer of DS ions across this interface. DS ions reach interface o/wl (State II) and are adsorbed on it. When surfactant concentration at the interface reaches a critical value, a surfactant layer is formed at the interface (State III), whereupon, potential at interface o/wl suddenly shifts to more negative values, corresponding to the lower potential of oscillation. With change in interfacial tension of the interface, the transfer and adsorption of surfactant ions is facilitated, with consequent fluctuation in interface o/ wl and convection of phases o and wl (State IV). Surfactant concentration at this interface consequently decreased. Potential at interface o/wl thus takes on more positive values, corresponding to the upper potential of oscillation. Potential oscillation is induced by the repetitive formation and destruction of the DS ion layer adsorbed on interface o/wl (States III and IV). This mechanism should also be applicable to oscillation with CTAB. Potential oscillation across the octanol membrane with CTAB is induced by the repetitive formation and destruction of the cetyltrimethylammonium ion layer adsorbed on interface o/wl. Potential oscillation is induced at interface o/wl and thus drugs were previously added to phase wl so as to cause changes in oscillation mode in the present study. [Pg.711]

Here, Ws is the work function of electrons in the semiconductor, q is the elementary charge (1.6 X 1CT19 C), Qt and Qss are charges located in the oxide and the surface and interface states, respectively, Ere is the potential of the reference electrode, and Xso is the surface-dipole potential of the solution. Because in expression (2) for the flat-band voltage of the EIS system all terms can be considered as constant except for tp (which is analyte concentration dependent), the response of the EIS structure with respect to the electrolyte composition depends on its flat-band voltage shift, which can be accurately determined from the C-V curves. [Pg.219]

Herberholz, R. Igalson, M. Schock, FI. W. 1998. Distinction between bulk and interface states in CuInSe2/CdS/ZnO by space charge spectroscopy. J. Appl. Phys. 83 318-325. [Pg.235]

Figure 3. ARUPS energy distribution curves taken with Hel radiation at normal incidence and an electron emission angle of 52" shown as a function of copper coverage. The intensity of the various curves has been normalized at the Fermi level Ef The individual curves are matched to their corresponding copper coverages in monolayers by the solid lines and the saturation behavior of the interface state at approximately —1.5 eV is identified by the dashed lines. (Data from ref. 8.) (Reprinted with permission from ref. 43. Copyright 1987 American Association for the Advancement of Science.)... Figure 3. ARUPS energy distribution curves taken with Hel radiation at normal incidence and an electron emission angle of 52" shown as a function of copper coverage. The intensity of the various curves has been normalized at the Fermi level Ef The individual curves are matched to their corresponding copper coverages in monolayers by the solid lines and the saturation behavior of the interface state at approximately —1.5 eV is identified by the dashed lines. (Data from ref. 8.) (Reprinted with permission from ref. 43. Copyright 1987 American Association for the Advancement of Science.)...
These two features exemplify the behavior of interface states, which are states that are not seen for either component of a bimetallic surface alloy but which exist because of the abrupt change in electronic properties at the interface. [Pg.160]

The interface nature of the states shown in Figure 3 have been corroborated in recent theoretical calculations (8). The calculated energy position of these states is in close agreement with the experimental results. Their orbital character has been determined as well. These results indicate that the interface states at about 1.5 eV are of appropriate character and energy to be active in environmental chemical reactions involving sub- and monolayer copper films on ruthenium. [Pg.160]

ARUPS results have identified unique electronic interface states for the Cu/Ru(0001) system. These states are not present in either metal separately but exist because of the abrupt change in properties at the interface. [Pg.164]

It should also be briefly recalled that semiconductors can be added to nanocarbons in different ways, such as using sol-gel, hydrothermal, solvothermal and other methods (see Chapter 5). These procedures lead to different sizes and shapes in semiconductor particles resulting in different types of nanocarbon-semiconductor interactions which may significantly influence the electron-transfer charge carrier mobility, and interface states. The latter play a relevant role in introducing radiative paths (carrier-trapped-centers and electron-hole recombination centers), but also in strain-induced band gap modification [72]. These are aspects scarcely studied, particularly in relation to nanocarbon-semiconductor (Ti02) hybrids, but which are a critical element for their rational design. [Pg.440]

The interface of semiconductor electrodes iiequently contains more or less localized electron levels called either surface states or interface states. In this textbook we use the term of surface states. [Pg.188]

In other studies on MOS structures, the two types of hysteresis, normal and abnormal, are suggested to arise from the ion displacement in the insulator and to the trapping at the interface states. The presence of site-radiation-induced polymerization has been used to provide increased film stability and has been described as an application for high-resolution electron beam lithography for the fabrication of microcircuitry. [Pg.98]


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Bridging the Molecule-Solid State Interface

Charge transfer interface states

Dangling bond interface states

Electrode band structure and interface states

Electronic States at the Interface

Flat band potential interface states

Induced density of interface state

Interface state generation

Interface states in electron-transfer processes

Interface surface states

Interface-state density

Interfaces Using Plasma State

Interfaces, solid-state reactions

Phase angle of local stress state at interface

Photoelectrochemical interface states

Solder solid-state interface reactions

Solid state interface

Solid-state amorphization reactions interface

Steady-state diffusion moving interface problems

Substrate interface states

Surface states semiconductor-electrolyte interface

The Interface of Information with State Likelihood

Trap States and Fixed Interface Charges

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