Copper processing parameters

As noted, copper electroplating of wafer interconnects poses significant challenges primarily due to the extreme requirements it mandates for uniformity, purity, and process control. On the other hand, it offers, because of its unique characteristics, special design opportunities that call for departure from classical acid copper process parameters. 

Electrical and electronic waste can be successfully recovered by pyrolysis following a suitable amount of separation. It has been demonstrated that by selecting the correct processing parameters, any halogenated hydrocarbons present are satisfactorily destroyed. Oil and gas from the pyrolysis are best used to heat the pyrolysis kiln. The metal containing pyrolysis coke can be treated in a secondary copper smelter without need for further processing. 

In addition to controlling the standard process parameters such as down force and the relative velocity, it is also important to have random access capability to route wafers through a CMP tool to optimize both performance and throughput. Low-down-force processes and special CMP pads are likely to be necessary to reduce copper dishing just as they improve oxide planarization. Furthermore, a balance between high relative velocity to reduce copper dishing and moderate relative velocity to minimize the sheering of small oxide feature may be necessary. 

Z. Stavreva, D. Zeidler, M. Plotner, and K. Drescher, Influence of process parameters on chemical-mechanical polishing of copper, Microelectr. Eng., 37-38, pp. 143-149, 1997. 

For solving mixtures of copper products, parameters derived from Tafel analysis of voltammetric curves were used [127, 133, 183]. The use of this formalism requires (i) that electrochemical processes for individual analytes can be taken as independent, and (ii) strong overlapping of voltammetric curves. Both conditions apply in our studied samples because these systems can be taken as constituted by separated micro- or nanograins of different solid compounds. Tafel analysis is based on the assumption that the rising portion of voltammetric curves can, in general, be... 

ABSTRACT The purpose of this study is to find pyrolysis conditions for diromium-copper- arsenate (CCA) treated wood in ordw to maxiniize the retention of arsenic in wood charcoal along with a high oil yield. An experimental dlhy was built to examine the influence of process parameters such as pyrolysis temperature and total pyrolysis time. Milled powder was prepared from CCA treated wood. The powder was pyrolized on top of the fluidized bed at temperatures between 300 to 500 C and during total pyrolysis times of 80 to 3600 s. 

THE EFFECTS OF PROCESS PARAMETERS ON THE STABILITY OF ELECTRODEPOSITED COPPER FILMS... 

Deposition process parameters are known to affect the properties of copper films. These process parameters include applied current density and additives in the bath chemistry, as well as the concentrations of these additives (1). Our focus in this work was to investigate the effect of current density on the self-annealing behavior of copper. Blanket copper films deposited at higher current densities were found to change more over time than those deposited at lower current densities. Films deposited at low current densities contain more impurities than those deposited at high current densities. Resistivity transients for a blanket film were compared and found to be similar to copper electrodeposited in lines. 

Response surface methodology (RSM) is utilized to develop mathematical relationships as well as for searching out optimal EMM process parameters setting to achieve the desired level of micro-machining performance criteria. EMM process criteria are measured during linear microchannel generation on copper workpiece, after each set of experimental mn based on experimental planning. The actual values of factors and their levels utilized for the RSM are listed in Table 8.3. 

Mixed copper/zinc catalysts with high copper-to-zinc ratios are widely used as catalysts for low-pressure methanol production and for low-temperature shift reaction [2, 31], see also Chapter 15. These catalysts are commonly made by coprecipitating mixed-metal nitrate solutions by addition of alkali. Li and Inui [32] showed that apart from chemical composition, pH and temperature are key process parameters. Catalyst precursors were prepared by mixing aqueous solutions of copper, zinc, and aluminum nitrates (total concentration 1 mol/1) and a solution of sodium carbonate (1 mol/1). pH was kept at the desired level by adjusting the relative flow rate of the two liquids. After precipitation was complete, the slurry was aged for at least 0.5 h. When the precipitation was conducted at pH 7.0, the precipitate consisted of a malachite-like phase (Cu,Zn)C03(0H)2 and the resulting catalysts were very active, while at pH < 6 the formation of hydroxynitrates was favored, which led to catalysts less active than those prepared at pH 7.0 (Figure 7.8). 

As told already, a copper powder is not formed of particles of identical size and morphology the individual particles may assume various forms and have very different surface areas for the same average size of granule [3]. As a result of this, it is not possible to relate the powder properties with the deposition process parameters and the deposition conditions, and, hence, a representative particle of the metal powder, having at least one property the same as the powder, should be determined. Obviously, a powder can then be considered as a group of identical particles. 

The prepared microcapsules were added into normal nickel-plating or copper-plating baths to determine how they would co-deposit with the metal ions, the effects of different types of metal ion, and the process parameters required for co-deposition. 

This can be accomplished by using materials between the metal lines that have a lower dielectric constant (also referred to as the k-value). Copper interconnect was first introduced with silicon oxide as the dielectric material, with a dielectric constant of about 4.0 (the value depends on the specifics of the deposition process, such as the precursor used, the temperature of deposition, plasma parameters, etc.). Substitution of some of oxygen atoms with fluorine in fluorinated silicon glass decreased the dielectric constant (with values about 3.7, depending on the fluorine content and process parameters). It should be noted that the incorporation of fluorine was not an unalloyed benefit, since the addition of greater amounts of fluorine can affect the moisture stability of the F-doped oxide films, and the F can attack Ta-based diffusion barriers. 

This thick-film/plated-copper process yields conductors with both high thermal conductivity and low electrical resistivity. A very good first-order approximation of both parameters is to use the values for pure copper 401... 

Copper Sulphide Nanoparticles Among the chalcogenide semiconductor nanoparticles, copper sulphides have been synthesized by a variety of methods as shown in Table 3. Various nanoparticles (plates, tubes, wires, spheres and other architectures) of these binary compounds have been prepared by several techniques and effect of process parameters have been extensively explored with a view to generate controlled size and shape of nanoparticles. 

In applying electrolytic protection, galvanized tubes can be installed downstream from copper components in water boilers without danger of Cu " -induced pitting corrosion. The protection process extends the application range for galvanized tubes with respect to water parameters, temperature and material quality beyond that in the technical regulations [16, 17]. 

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