Electrodeposition copper

Markovic N M, Gasteiger H A and Ross P N 1995 Copper electrodeposition on Pt(111) in the presence of chloride and (bi)sulphate Rotating ring-Pt(111) disk electrode studies Langmuir 11 4098-108... 

Copper electrodeposition on Au(111) Copper is an interesting metal and has been widely investigated in electrodeposition studies from aqueous solutions. There are numerous publications in the literature on this topic. Furthermore, technical processes to produce Cu interconnects on microchips have been established in aqueous solutions. In general, the quality of the deposits is strongly influenced by the bath composition. On the nanometer scale, one finds different superstmctures in the underpotential deposition regime if different counter-ions are used in the solutions. A co-adsorption between the metal atoms and the anions has been reported. In the underpotential regime, before the bulk deposition begins, one Cu mono-layer forms on Au(lll) [66]. 

Cerisier et al examined copper electrodeposits over a range of scales from 6 nm to 10 pm [78], They obtained a = 0.33 and j> = 0.46 for deposition on silicon from pyrophosphate solution, and concluded that growth occurs at three dimensional centers with little surface diffusion. 

Fig. 3. Log-log plots of w versus L for copper electrodeposition in the presence of various additives. From Leung et al. [75]...

Equations (7.16) and (7.17) are used in an analysis of experimental data. Eor example, R5mders and AUdre (32) used these equations to analyze copper electrodeposition on platinum. They concluded that at the intermediate overpotentials (120 and 170 mV), the dimensionless current transients are consistent with the theoretical predictions for progressive nucleation, Eq. (7.17). At overpotentials higher than 220mV, nucleation shifted to the instantaneous nucleation theory. 

Figure 7.13. Propagation of copper microsteps on real surfaces of Pt. AFM images (z = lOOnm/div) of copper electrodeposition at / = 1 mAJcvr for a total charge of (a) 0.0, (Z ) 0.8, and (c) 1.6 mC. (From Ref 32, with permission from the Electrochemical Society.)...

Early stages of copper electrodeposition and coadsorption of chloride on the Au(lll) electrode surface have been studied by Wu et al. [390] applying electrochemical methods and in situ X-ray absorption measurements. The results indicate a large degree of static disorder and exclude the presence of high-symmetry structures. Krznaric and Goricnik [391]... 

Zhang et al. have studied the influence of bromine adsorption on copper electrodeposition on pc-Au electrodes modified with SAMs [415]. 

Elemental copper is the least easily oxidized of the first-row transition metals. This largely accounts for the extensive use of copper electrodeposition for both industrial applications and analytical purposes. Since the electrochemistry of elemental copper, including electrodeposition, electroplating, and electrowinning, was treated extensively in the previous edition of this encyclopedia [1] and detailed descriptions are to be found elsewhere [2-4], it is not covered in this treatise. 

Hope GA, Woods R (2004) Transient adsorption of sulfate ions during copper electrodeposition. J Electrochem Soc 151 C550-C553... 

The numerical investigation by Dukovic [63] centered on a base case of copper electrodeposition into a 10-micron cavity defined in a 5-micron resist wall. The following conditions were assumed a current density of 50 mA/cm, a diffusion boundary layer extending 40 microns beyond the resist layer, a Cu2+ concentration of 100 mM in the plating bath, a Cu " diffusion coefficient of 5.2 X 10cm /s, an exchange current density of 1 mA/cm, transfer coefficients of = 0.5 and Oj = 1.5, and a bath conductivity of 0.5 2 cm . 

Figure 2.1 Bottom-up superfilling of sub-micrometer trenches by copper electrodeposition from an electrolyte containing PEG-SPS-CI.

Figure 2.14 Slow sweep rate r -i curves showing halide-dependent PEC inhibition of copper electrodeposition.

Carlo Simulation of Copper Electrodeposition with Additives. Int. ]. Multiscale Comput. Eng., 2, 313-327. 

Drews, T.O., Braatz, R.D. and Alkire, R.C. (2003) Parameter Sensitivity Analysis of Monte Carlo Simulations of Copper Electrodeposition with Multiple Additives./. Electrochem. Soc., 150, C807-C812. 

R.C. (2005b) Coupled Mesoscale-Continuum Simulations of Copper Electrodeposition in a Trench. AIChE/., 50, 226-240. 

In the case of copper, electrodeposition at low overpotentials produces large grains with relatively well-defined crystal shapes. Further increasing the overpotential leads to the formation of cauliflower-like and carrot-like protrusions, and finally, dendritic deposits are formed in the absence of strong hydrogen co-deposition.13... 

The polarization curve for copper electrodeposition from 0.15 M CUSO4 in 0.50M H2SO4 is shown in Fig. 2. The average current efficiencies for hydrogen evolution reaction, /jav(I I2), in potentiostatic... 

The morphologies of copper electrodeposits obtained potentio-statically, onto vertical stationary copper wire electrodes previously covered by copper thin films10 from a copper solution containing 0.15 M Q1SO4 in 0.50 M H2SO4, at a temperature of 18.0 1.0°C in different hydrogen co-deposition conditions are shown in Figs. 3-10. 

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