Dual-inline package

The sensor can either be mounted in a DIE28 package (dual-inline package with 28 pins) for testing and calibration purposes or in a TO-package (Fig. 6.15), which is... 

Dual Inline Package (DIP) dynamic electricity heat sink... 

B. The DIP, or Dual Inline Package, is a type of IC package that has two rows of pins, one on each side of the package. 

Older CPUs are generally square, with transistors arranged in a Pin Grid Array (PGA). Prior to 1981, chips were found in a rectangle with two rows of 20 pins known as a Dual Inline Package (DIP). See Figure 2.20. There are still integrated circuits that use the DIP form factor. However, the DIP form factor isn t used for PC CPUs anymore. Most CPUs use either the PGA or the SECC form factor (discussed earlier). 

Each card must be separately configured to operate with the computer according to the instructions that come with the card. You set the configuration on each card using jumpers and Dual Inline Package (DIP) switches so that the... 

DIP (Dual Inline Package) A standard housing constructed of hard plastic commonly used to hold an integrated circuit. The circuit s leads are connected to two parallel rows of pins designed to fit snugly into a socket these pins may also be soldered directly to a printed-circuit board. If you try to install or remove dual inline packages, be careful not to bend or damage their pins. 

DIP switch A small switch used to select the operating mode of a device, mounted as a Dual Inline Package. DIP switches can be either sliding or rocker switches and are often grouped together for convenience. They are used on printed circuit boards, dot-matrix printers, modems, and other peripherals. 

Dual Inline Package See DIP (Dual Inline Package). 

The simplest of these IGs is called an inverter, and a standard inverter IC provides six separate inverter circuits in a dual inline package (DIP) that looks like a small rectangular block of hlack plastic about 1 centimeterwide, 2 centimeters long, and 0.5 centimeters thick, with fourteen legs, seven on each side. The actual silicon chip contained within the body of the plastic block is approximately 5 millimeters square and no more than 0.5 millimeters thick. Thousands of such chips are cut from a single silicon wafer that has been processed specifically for that application. 

Small outline 1C (SOIC), 8-28 pin packages, commonly 0.050-in pin spacing, with gull wing leads. This package style is about 50-70% of the size of a standard dual inline package (DIP) part (30% as thick). 

Ceramic dual inline package (CERDIP). The DIP package was developed by Fairchild Semiconductor and Texas Instruments followed with a metal topped ceramic package that resolved problems with the early ceramic packaged parts. 

Shrink DIP, a dual inline package with 24—64 pins with 0.070-in lead spacing. 

FIGURE 403 Dual inline package (DIP). (Courtesy of Sandia National Laboratories)... 

Fig. 3. Most widely used method for packaging integrated circuits—low cost plastic packages called P-DIPs (plastic dual inline packages).

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