Thermal expansion compatibility

Calcium substitution on the La site reduces the sinterability of LaFe03 and dense La, xCaxFc()3 (LCF) can be obtained at sintering temperature of 1320°C [90], The compositions with x < 0.2 show good thermal expansion compatibility with YSZ electrolyte and high electronic conductivity (88 Scnr1 at 800°C for x = 0.15). Increasing Ca substitution leads to the decomposition of the LCF and the formation of the second phase. 

The anode (the fuel electrode) must also have electrical conductivity, thermal expansion compatibility, and porosity, and must function in a reducing atmosphere. The reducing conditions combined with electrical conductivity requirements make metals attractive materials candidates. Recent development has focused on a Ni-YSZ composite in which the YSZ provides structural support for separated Ni particles, preventing them from sintering together while matching the thermal expansions. 

SOFC. Thus, it is desirable to have a thermal expansion compatible ceramic phase in intimate contact with both the solid electrolyte and the metallic electrode at the anode/solid electrolyte interface of an SOFC for wetting purposes. 

First-level packages provide interconnection between the printed circuit board and the chip. These packages must have the desired number of wiring layers, provide thermal expansion compatibility with the chip, provide a thermal path for heat dissipation from the chip, and keep electrical noise and transmission delay to the minimum. The two types of packages used are plastic packages and ceramic packages. 

Deep refrigeration Ice making Thermal expansion Compatibility of materials Gas liquefaction Refrigerants and gases System control and monitoring Vapor-compression circuits Absorption systems... 

M. Mori, Enhancing effect on densification and thermal expansion compatibility for Lao. 8Sro2Cro9Tio 1O3 based SOFC interconnect with B-site doping. J. Electrochem. Soc. 

Although thermal expansion compatibility [1-6] is usually assessed by the differences between thermal expansion coefficients, the magnitude of stresses also depends on elastic constants and on the amplitude of temperature changes, from sintering or deposition/bonding conditions to operation temperatures, and down to room temperature due to discontinuous operation or for maintenance. Excessive thermal expansion of individual materials also implies greater risks of thermal shock or failure under temperature gradients. 

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