Nitto Denko Corporation

LUBRIZOL CORPORATION (THE) MACDERMID INCORPORATED MARATHON OIL CORP MATHESON TRI-GAS INC MINERALS TECHNOLOGIES INC MITSUI CHEMICALS INC MOHAWK INDUSTRIES INC MONSANTO CO NAGASE CO LTD NALCO HOLDING COMPANY NITTO DENKO CORPORATION NL INDUSTRIES INC NYPRO INC... [Pg.125]

NANOPHASE TECHNOLOGIES CORP NATUREWORKS LLC NEWELL RUBBERMAID INC NEWMARKET CORPORATION NIPPON SODA CO LTD NITTO DENKO CORPORATION NL INDUSTRIES INC NORTH AMERICAN PIPE INC NOVA CHEMICALS CORPORATION NUFARM LIMITED NYPRO INC... [Pg.129]

Nitto Denko Corporation primarily manufactures industrial adhesive tapes for the electronics, automotive, health care, packaging and construction industries. The company produces industrial, electronic and functional products. Industrial products include double-coated adhesive tapes, masking tapes surface protective materials, sealing materials and label printing systems. Electronics products include LCD-related items general and advanced device resins printed circuit boards and semiconductor package adhesive sheets. Functional products include medical items such as transdermal therapeutic patches polymer separation membranes used for water purification and treatment and plastic engineering products such as information equipment and porous film materials used in cars, electronics, and home appliances. Nitto Denko America, Inc., an optoelectronics subsidiary, manufactures semiconductor... [Pg.400]

NITROPHYL ROGERS CORPORATION Nitto Denko America, Inc. NITTO DENKO CORPORATION... [Pg.551]

Akemi, H. Kinoshita, T. Otsuka, S. Hosaka, Y. Nakano, Y. Acrylic Oily Gel Bioadhesive Material and Acrylic Oily Gel Preparation. U.S. Patent 5,298,258, March 29, 1994, Nitto Denko Corporation... [Pg.2934]

M. Nakao, T. Nishioka, M. Shimizu, H. Tabata, and K. Ito Nitto Denko Corporation, 919 Fuke-cho, Kameyama-shi, Mie, Japan... [Pg.414]

M. Yamamoto, S. R. Marder, and B. Kippelen. Polymer, producing method thereof, and photorefractive composition. US Patent 6610809, assigned to Nitto Denko Corporation (Osaka, JP) and Arizona Board of Regents on behalf of the University of Arizona (Tucson, AZ), August 26,2003. [Pg.63]

M. Kanada, T. Fukuoka, and N. Kinjou. Method for producing porous poly-imide resin and porous polymide resin. US Patent 7 022 377, assigned to Nitto Denko Corporation (Osaka, JP), April 4, 2006. [Pg.515]

Hachisuka H and Ikeda K, Composite reverse osmosis membrane having a separation layer with polyvinyl alcohol coating and method of reverse osmosis treatment of water using the same, US Patent 6 177 Oil, Nitto Denko Corporation, Osaka, Japan, January 23, 2001. [Pg.49]

Hirose M, Ito H, Maeda M, and Tanaka K, Highly permeable composite reverse osmosis membrane, method of producing the same, and method of using the same, US Patent 5 614 099, Nitto Denko Corporation, Japan, 1997. [Pg.50]

Yamamoto, M., et al. (2000). Pressure-sensitive adhesive composition containing styrene-acrylic block polymers. In Eur. Pat. Appl. 1008640, Nitto Denko Corporation,... [Pg.942]

Producers and Trade Names 3M (Scotch tapes), Nitto Denko Corporation, PPL... [Pg.120]

Nitto Denko Corporation, Onomichi, Japan e-mail tatsuki nagatsuka gg.nitto.co.jp... [Pg.81]

ND-L02-S0201 HSP47 Vitamin A-coupled lipid nanoparticle i.v. METAVIR F3-4 I Ib/II Completed Recruiting NCT01858935 NCT02227459 Nitto Denko Corporation... [Pg.408]

N. Sadayori and Y. Hotta, Polycarbodiimide having high index of refraction and production method thereof, U.S. Patent Application Publication No. 20040158021A1, assigned to Nitto Denko Corporation, Aug. 12, 2004. [Pg.74]

Nitto Denko Corporation developed an anisotropic conductive film for fine-pitch flip-chip applications [33]. This ACF (1) is connectable between bumpless chips and a fine-pitch printed circuit board (PCB) (2) has high electrical conductivity (3) is repairable (easy to peal off chips from a printed circuit board at elevated temperatures) (4) has high reliability and (5) can be stored at room temperature. The other notable features are it is usable at pitches down to 25 pm the conductive elements are micrometallic columns as opposed to random-shaped particles this adhesive matrix consists of a thermoplastic polymer resin and the conductive columns are coated with an insulator and a high- Tg polymer that completely separates the columns from the adhesive (Fig. 8). [Pg.737]

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