Epoxies and other polymer resins

To function as electrical conductors, epoxies and other polymer resins, because they are inherently insulators, must be filled with electrically conductive particles such as metals. The selection of electrically conductive or insulative adhesives is based largely on their conductivities or, conversely, on their volume resistivities. Electrically conductive adhesives should have low resistivities initially and retain those values on aging, moisture exposure, thermal cycling, and other operating and test conditions. The resistivities of metal-filled epoxy adhesives can range from... 

Water molecules plasticise polar polymers such as epoxy and other advanced resins used as matrices for fibre composites so that absorption of moisture can cause the glass transition temperature, Tg, to be reduced significantly. This effect is illustrated in Figure 12.12 [4] and therefore has an impact on the maximum service temperature available to a specific composite system. A rule of thumb for epoxy resins is that Tg is reduced on average... 

Uses. As a curing agent for epoxy and other resins and as a vinyl plasticizer also found in anticorrosive surface coatings, polymers, paints, dyes, and pharmaceuticals... 

The major uses of BPA are in the production of polycarbonate resins (63%) and epoxy resins (27%). Polycarbonates have major outlets in automotive parts, compact discs, eyeglasses, and sheet and glazing applications, and have caused bisphenol A consumption to more than double during the past decade. Epoxy resins are two-component adhesives for very strong bonding. Miscellaneous uses include flame retardants (mostly tetrabromobisphenol A) and other polymer manufacture. Polycarbonate grade bisphenol A is >99% p,p isomer. The epoxy grade is 95% p,p. The p,p and o,p isomers can be separated by a combination of distillation and crystallization. 

Additions of BN powder to epoxies, urethanes, silicones, and other polymers are ideal for potting compounds. BN increases the thermal conductivity and reduces thermal expansion and makes the composites electrically insulating while not abrading delicate electronic parts and interconnections. BN additions reduce surface and dynamic friction of rubber parts. In epoxy resins, or generally resins, it is used to adjust the electrical conductivity, dielectric loss behavior, and thermal conductivity, to create ideal thermal and electrical behavior of the materials [146]. 

Epoxy resins and other polymers (tetrahydrofuran, vinyl ethers, styrene, etc.) can be cured when exposed to an acid or cation intermediate species. The photoactive catalyst system commonly used to cure epoxy resins and multifunctional vinyl ether materials is composed of salts of aryldiazonium, triarylsulfonium, and diaryliodonium. These systems are commonly employed in coatings and adhesives for electronic products. The acid initiator generated from the photoinitiator continues to be active even after uv curing, and so conversion of reactants and crosslinking continue even in the absence of uv light. This phenomenon is typically referred to as dark cure. 

Epoxy resins are not ideal adhesives in their natural form so they are mixed with materials to improve and enhance their properties and, thereby, make them more useful in a variety of applications. This process is called compounding or formulating. Compounding is the combining of a base epoxy resin with curing agents, modifiers, additives, reinforcement, fillers, and other polymers to make the base polymer perform better, cost less, and process more easily. 

There is a common feature of the polymer composition in PC, PPO, epoxy and phenol-formaldehyde resin, all contain phenoxy moieties in their repeating unit. Hence, it is not unexpected that the major pyrolysis products of these plastics are phenols. The reason of the production of phenolic compounds is the higher bonding energy of the C-0 linkage in the phenoxy moiety related to that of other bonds along the polymer chain. 

Epichlorohydrin or chloromethyloxirane is manufactured from allyl chloride, and, in 2006, had a merchant price of US 1.66 kg [4]. It is used as a building block in the manufacture of plastics, epoxy resins, phenoxy resins, and other polymers, and as a solvent for cellulose, resins, and paints, and has also found use as an insect fumigant. Epoxy resins (aryl glycidyl ethers) are manufactured successfully in large scale (1.2 x 10 metric tons in 2000) [26] and are widely used in a variety of industrial and commercial applications [27]. These are made by addition reactions of epichlorohydrins or by epoxidation of allyl ethers or esters (Table 1.1). Epichlorohydrin can be reacted with an alkali nitrate to produce glycidyl nitrate, an energetic binder used in explosive and propellant compositions. 

Chem. Descrip. Triphenyl phosphite CAS 101-02-0 EINECS/ELINCS 202-908-4 Uses Costabilizer for PVC and other polymers such as PP vise, modifier, reactive diluent for a variety of resin systems, esp. epoxies antioxidant for syn. rubbers, butyrates flame retardant for PU foams in transesterification reactions lubricant oil additive chem. intermediate for prod, of other phosphite esters and phosphonates Features Improves adhesion, elec, props., dimensional stability Properties Colorless mobile liq. 10% P Albrite Tributyl Phosphate [Huntsman Surf. Sciences]... 

The first completely synthetic resin, based on phenol and formaldehyde, was invented by Baekeland and others in the first decade of this century. " While the phenol-formaldehyde resins yielded excellent adhesives then as now, blends with carboxylic rubber, epoxy resins, neoprene, nitrile rubber, and other polymers Improved adhesive properties for various purposes. 

The are two basic ways of making polymer/clay hybrids. Direct polymerization in the presence of clay platelets has been used successfully for polyamides and for epoxy and other resins. But, at a less exotic and more flexible level, compounding offers an economic way of modifying polypropylene - in theory - and there has been some active development of processes to produce polypropylene/clay hybrids by melt mixing. 

Bisphenol-A (BPA) is an important raw material for the synthesis of polycarbonates, epoxy resins and other polymers as well as polymer additives. It is conventionally produced by acid-catalysed condensation of phenol with acetone. Application of various catalysts for the BPA synthesis is discussed with particular attention to the substrates conversion and the reaction selectivity. Recent developments in the BPA production and its applications are presented. Moreover, potential toxicological and endocrine disrupting properties of BPA are considered with the emphasis on human exposure, general toxicology, and biological effects. 

Epichlorohydrin is a monomer for epoxy resins, elastomers, and other polymers. During the production of polymers, it may be released to the atmosphere and in wastewater. 

The dialkyl succinates are good plasticizers for vinyl chloride polymers and copolymers and for cellulose derivatives. SA is also used in the manufacture of alkyd resin to impart flexibility, elasticity, and water resistance. " In addition, it finds numerous applications in the field of adhesives, elastomers, lubricants, pharmaceuticals, pesticides, and epoxy and other resins. Succinic acid is also used as a food acidulant and has been placed on the GRAS (generally regarded as safe) list by the FDA. ... 

Although the plastics industry uses both classes of polymers, most thermoset plastics are based on heterochain polymers such as the urethane, epoxy, and aldehyde condensation resins. Thermoplastics, however, are mainly based on carbon chain polymers (with the notable exceptions of polyesters, nylons, and a few others). 

Another important use of BCl is as a Ftiedel-Crafts catalyst ia various polymerisation, alkylation, and acylation reactions, and ia other organic syntheses (see Friedel-Crafts reaction). Examples include conversion of cyclophosphasenes to polymers (81,82) polymerisation of olefins such as ethylene (75,83—88) graft polymerisation of vinyl chloride and isobutylene (89) stereospecific polymerisation of propylene (90) copolymerisation of isobutylene and styrene (91,92), and other unsaturated aromatics with maleic anhydride (93) polymerisation of norhornene (94), butadiene (95) preparation of electrically conducting epoxy resins (96), and polymers containing B and N (97) and selective demethylation of methoxy groups ortho to OH groups (98). 

Synthetic resins, such as phenoHc and cresyUc resins (see Phenolic resins), are the most commonly used friction material binders, and are usually modified with drying oils, elastomer, cardanol [37330-39-5] an epoxy, phosphoms- or boron-based compounds, or even combinations of two. They ate prepared by the addition of the appropriate phenol and formaldehyde [50-00-0] in the presence of an acidic or basic catalyst. Polymerization takes place at elevated temperatures. Other resin systems are based on elastomers (see Elastomers, synthetic), drying oils, or combinations of the above or other polymers. 

Currendy, epoxy resins (qv) constitute over 90% of the matrix resin material used in advanced composites. The total usage of advanced composites is expected to grow to around 45,500 t by the year 2000, with the total resin usage around 18,000 t in 2000. Epoxy resins are expected to stiH constitute about 80% of the total matrix-resin-systems market in 2000. The largest share of the remaining market will be divided between bismaleimides and polyimide systems (12 to 15%) and what are classified as other polymers, including thermoplastics and thermoset resins other than epoxies, bismaleimides, cyanate esters, and polyimide systems (see Composites,polymer-matrix-thermoplastics). 

A somewhat similar thing happens in many polymers at the glass-rubber transition that we mentioned in Chapter 6. Below the transition these polymers are much more brittle than above it, as you can easily demonstrate by cooling a piece of rubber or polyethylene in liquid nitrogen. (Many other polymers, like epoxy resins, have low Gc values at all temperatures simply because they are heavily cross-linked at all temperatures by covalent bonds and the material does not flow at the crack tip to cause blunting.)... 

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