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Other Bonds

Hydrolases. Enzymes catalysing the hydrolytic cleavage ofC —O, C —N and C —C bonds. The systematic name always includes hydrolase but the recommended name is often formed by the addition of ase to the substrate. Examples are esterases, glucosidases, peptidases, proteinases, phospholipases. Other bonds may be cleaved besides those cited, e.g. during the action of sulphatases and phosphatases. [Pg.159]

Lyases. These enzymes cleave C-C, C-0, C-N and other bonds by elimination leaving double bonds or conversely add groups to double bonds. This group includes decarboxylases, hydratases, dehydratases and some carboxylases. [Pg.159]

This then is the disconnection corresponding to the reaction. It is the thinking device we use to help us work out a synthesis of t-butyl alcohol. We could of course have broken any other bond in the target molecule such as ... [Pg.4]

In this representation the X indicates the substituent other bonds involve only hydrogens. This formalism also applies to 1,1-disubstituted ethylenes in whicli the substituents are different. With these symbols, the isotactic, syndiotactic, and atactic structures shown in Fig. 1.2 are represented by structures [VI]-[VIII], respectively ... [Pg.472]

Another variant of the friction welding process, linear friction welding, uses servo-hydrauHcs pumps to vibrate parts back and forth against each other. Bond areas of approximately 1000 mm can be joined the attachment of turbine blades to rotors is a prevalent apphcation of this technology. [Pg.344]

High Alumina Refractories. The desired alumina content, from 100% to just above 45%, is obtained by adding bauxites, synthetic aluminosihcates, and synthetic aluminas to clay and other bonding agents. These refractories are used in kilns, ladles, and furnaces that operate at temperatures or under conditions for which fireclay refractories are not suited. Phosphate-bonded alumina bricks have exceptionally high strength at low to intermediate temperatures and are employed in aluminum furnaces. High alumina and mullite are used in furnace roofs and petrochemical apphcations. [Pg.37]

The stiffnesses of other bond types are calculated in a similar way (in general, the cumbersome sum described above is not needed because the interactions are of short range). The resulting hierarchy of bond stiffnesses is as shown in Table 6.1. [Pg.60]

The carbon-fluorine bond is very stable. Further, where two fluorine atoms are attached to a single carbon atom there is a reduction in the C—F bond distance from 1.42 A to 1.35 A. As a result bond strengths may be as high as 504 kJ/mole. Since the only other bond present is the stable C—C bond, PTFE has a very high heat stability, even when heated above its crystalline melting point of 32TC. [Pg.365]

It is important to note that we assume the random fracture approximation (RPA) is applicable. This assumption has certain implications, the most important of which is that it bypasses the real evolutionary details of the highly complex process of the lattice bond stress distribution a) creating bond rupture events, which influence other bond rupture events, redistribution of 0(microvoid formation, propagation, coalescence, etc., and finally, macroscopic failure. We have made real lattice fracture calculations by computer simulations but typically, the lattice size is not large enough to be within percolation criteria before the calculations become excessive. However, the fractal nature of the distributed damage clusters is always evident and the RPA, while providing an easy solution to an extremely complex process, remains physically realistic. [Pg.380]

Figure 14.4 The four main types of O2-M geometry. The bridging modes Ib and lib appear superficially similar but differ markedly in dihedral angles and other bonding properties. See also footnote to Table 14.5 for the recently established unique /Lt.rj -superoxide bridging mode. Figure 14.4 The four main types of O2-M geometry. The bridging modes Ib and lib appear superficially similar but differ markedly in dihedral angles and other bonding properties. See also footnote to Table 14.5 for the recently established unique /Lt.rj -superoxide bridging mode.
Figure 18.4 The structure of FXeN(S02F)2 (C2 symmetiy) showing essentially linear Xe and planar N. Other bond angles are OSO 122.6°, OSF 106.3°, NSO 107.2° and 111.2°, NSF 101.2°. Figure 18.4 The structure of FXeN(S02F)2 (C2 symmetiy) showing essentially linear Xe and planar N. Other bond angles are OSO 122.6°, OSF 106.3°, NSO 107.2° and 111.2°, NSF 101.2°.
Raney cobalt is generally less effective than Raney nickel, but may be of use when the rupture of other bonds must be avoided. The important use of Raney nickel desulfurization for the structure determination of thiophenes and for the determination of the absolute configuration of optically active thiophene and benzene derivatives has been stressed earlier. [Pg.116]

The only exception is represented by isoxazole-3-carboxylic acid in which the N—O bond is the only one to be broken, other bonds remaining unaffected hydrolysis of the intermediate (not isolated) gave carbethoxypyruvic acid. Quilico et al, reported the peculiar degradation of 3,3 -diisoxazolyl (124) ° treatment with sodium ethylate even at room temperature yields diacetyl with the evolution... [Pg.402]

The CH3 carbon is sp3 the double-bond carbons are sp2 the C=C—C and C=C-H bond angles are approximately 120° other bond angles are near 109°,... [Pg.1254]

The other bond which the oxygen atom can make must be to a carbon atom, since if it were to another hydrogen atom we would simply have a water molecule. Therefore we write... [Pg.326]

The carbon atom we have added must form three additional bonds to satisfy its tetravalent bonding capacity. If all of these bonds were to hydrogen atoms, we would have the completed molecule CH3OH, and would also have two hydrogen atoms and a carbon atom left over. Therefore, one of the bonds our first carbon atom forms must be to the other carbon atom, and the two other bonds must be to hydrogen atoms. We have then... [Pg.326]

A secondary kie is one that arises from other bonds in the reactive molecule. Obviously, these are much weaker effects than those we have been considering. If they are found, it may suggest that the functional group distorts or twists considerably in the transition state, even though it is not changed in the reaction. [Pg.217]


See other pages where Other Bonds is mentioned: [Pg.354]    [Pg.37]    [Pg.290]    [Pg.214]    [Pg.17]    [Pg.16]    [Pg.116]    [Pg.105]    [Pg.137]    [Pg.440]    [Pg.387]    [Pg.14]    [Pg.352]    [Pg.7]    [Pg.1878]    [Pg.321]    [Pg.14]    [Pg.1154]    [Pg.40]    [Pg.105]    [Pg.137]    [Pg.340]    [Pg.418]    [Pg.702]    [Pg.328]    [Pg.333]    [Pg.619]    [Pg.156]    [Pg.610]    [Pg.316]    [Pg.169]    [Pg.104]    [Pg.571]    [Pg.221]   


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Acetylenes and other compounds with C(sp)—F bonds

Addition reactions to other carbonheteroatom MULTIPLE BONDS (

Addition to Other Polar Bonds

Alkenes and other compounds with C(sp2)—Cl bonds

Allenes other multiple bonds

Amino-boranes and other Compounds containing B—N Bonds

Aminoboranes and Other Compounds containing B—N Bonds

Anisotropy of Bonds and Systems (other than Aromatic)

Azides other multiple bonds

Beta-eliminations giving multiple bonds between carbon and other ELEMENTS

Biogenesis of the Thio-Ether Bond and other Processing Events

Block Copolymers Containing Other Hydrogen Bonding Arrays

Bonding and Other Characteristics

Bonding in Proteins and Other Macromolecules

Bonding with Other Unsaturated Ligands

Bonding, Kinetic, and Other Factors that Favor Glass Formation

By means of phosphites and other compounds containing P-H bonds

C-S bond cleavages of other sulfides, thiols and dithioacetals

Comparison with Other Anionic H-bonds

Directional Forces Other than H-Bonds

Edifices Built via H Bonds and Other Host-Guest Interactions

Encapsulation by Hydrogen-Bonded and Other Supramolecular Capsules

Fluorine bonded to an element other than carbon

Formation from Other Compounds Containing Boron-Hydrogen Bonds

Formation of Other C-X bonds

Formation of Two Bonds Atom Fragment by Other Processes

Formation of metal-carbon bonds by other insertion reactions

HTV Used in Other Bonding Applications

Halogen Bonding and Other Interactions

Hydrogen Bonding and Other Group Binding Sites

Hydrogen Bonding with Other Noncovalent Interactions

Hydrogen Bonds and Other Weak Interactions

Hydrogen bond lengths with other elements

Hydrogen bonding other properties affected

Hydrogenation or Other Addition to the Double Bond of Unsaturated 1,3-Oxazines

Ice and Other Structures with Disordered Hydrogen Bonds

Insertion Reactions of Transition Metal-Carbon cr-Bonded Compounds. II. Sulfur Dioxide and Other Molecules

Insertion into Other E-X Bonds

Isocyanates other multiple bonds

Isothiocyanates other multiple bonds

Lipids hydrogen bonding systems, other

New Hydrogen-Bonded Assemblies form Other Nucleoside Analogs

Nitrative cleavage of other nitrogen bonds

Nitrogen-other elements bond lengths

O-C bonds in other species

Odd-electron bonds between other identical heteroatoms

Other Addition Reactions to Double Bonds

Other Biologically Important Hydrogen Bonds

Other Carbon-Heteroatom Multiple Bonds

Other Carbon-bonded Compounds

Other Carbon-bonded Derivatives

Other Complexes Possibly Containing M—H—Si Three-Center Bonds

Other Components of Bonded Films

Other Double Bond-Cleaving Dioxygenases

Other Frameworks Based on Covalent Bonds

Other Hydrogen Bonded Capsules

Other Hydrogen Bonded Systems

Other Hydrogen-Containing Bonds

Other Lewis Bonds

Other Measures of Bond Strength

Other Mixed-Bonded Polymers

Other Molecules Containing the Three-Electron Bond

Other Multiple Bonds

Other Reactive Double Bonds

Other Rigid Bonding

Other Single Bonds

Other Through-Bond Coupling Units

Other double-bond reactions

Other elements bond lengths

Other oxysalt bonded cements

Other types of hydrogen bonds

Oxygen-other elements bond lengths

Raman Frequencies of Other Double Bonds

Relation of Bond Energies to Other Molecular Properties

Rubber to Metal and Other Substrate Bonding

The Ionic Bond and Other Electrostatic Bonds

The bonding of other unsaturated hydrocarbons to transition metals

Through-bond interactions with other nuclei

With Other Singly-bonded Electrophiles

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