Embedded components Resistors

So, on this basis, low power electrical components such as semiconductors, capacitors, transformers, relays (which shall be sealed in order to prevent ingress of granules into the contact space and mechanical blocking caused hereby), resistors and fuses can be explosion protected by embedding in a... 

Passive integration is an effective technique to increase the component density. It is defined as a combination of circuit carrier (substrate, board, and interconnections) with passive components like resistors, capacitors, inductors, and line elements in one technology. Passive elements may be integrated on the surface or embedded in a multilayer structure of the substrate. The goal is to achieve ... 

Resistors were the first component to be embedded in a multilayer board, making it a truly three-dimensional interconnection and circuit system. While early designs were custom for... 

The trend in surface-mount technology is to use smaller passive devices such as capacitors, resistors, and inductors. Also, there is the use of embedded passive devices, that is, resistors and capacitors that are located within the circuit board laminate. Embedded passive devices free up additional surface area for larger, active components. 

The air sub-model has two components the inertia of the air above the reed and the (nonlinear) air flow resistance labelled I r and R r, respectively. The former is the straightforward bond graphs I component (mass) considered earlier, but the other component is more complex, as the flow resistance is modulated by the reed position. Thus R r is not the simple R component (dumper) but rather an Effort-Modulated Resistor (EMR) component (Figure 4.23) which is modulated by the displacement of x of the reed please refer to book by Gawthrop and Smith (1996) for more information on bond graphs components. The fact that displacement appears as an effort in this context is a result of the way we have chosen to model the system. The constitutive relationship embedded in this EMR component follows de Bruin and van Walstijn s description (1995). 

Several AM techniques have been modified to work at a small scale to deposit passive electronic structures (conductors, insulators, resistors, antennas, etc.). These techniques are often known as direct-write techniques and, for instance, use electronic inks that contain nanoparticles or other additives that result in electronic properties after drying, thermal decomposition, or other post-treatment. By combining direct-write techniques with other AM techniques it becomes possible to create multifunctional 3D-embedded electronic structures on a layer-by-laycT basis that combine structural, thermal, electronic, and other functions into a single component. 

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