Electron beam sputtering

Hot kerosene drying Hot petroleum drying Combustion Laser beam Electron beam Sputtering... 

Such limited experiments have been carried out with silicon and germanium vapor, created by electron beam sputtering and simple heating, that the results are given below. 

Radiation Sources. Ordinarily, electron beams are produced from soHds in vacuo by thermal or field-assisted processes. Plasmas also serve as electron sources, but are more uniquely used as ion sources. Whereas ions can be produced by sputtering and field assisted processes in the absence of plasmas, most ion sources involve plasmas (75). 

Alternative Thin-Film Fabrication Approaches. Thin films of electronic ceramic materials have also been prepared by sputtering, electron beam evaporation, laser ablation, chemical beam deposition, and chemical vapor deposition (CVD). In the sputtering process, targets may be metal... 

Auger electron spectroscopy (AES) is a technique used to identify the elemental composition, and in many cases, the chemical bonding of the atoms in the surface region of solid samples. It can be combined with ion-beam sputtering to remove material from the surface and to continue to monitor the composition and chemistry of the remaining surface as this surface moves into the sample. It uses an electron beam as a probe of the sample surface and its output is the energy distribution of the secondary electrons released by the probe beam from the sample, although only the Ai er electron component of the secondaries is used in the analysis. 

AES analysis is done in one of four modes of analysis. The simplest, most direct, and most often used mode of operation of an Auger spectrometer is the point analysis mode, in which the primary electron beam is positioned on the area of interest on the sample and an Auger survey spectrum is taken. The next most often used mode of analysis is the depth profiling mode. The additional feature in this mode is that an ion beam is directed onto the same area that is being Auger analyzed. The ion beam sputters material off the surface so that the analysis measures the variation, in depth, of the composition of the new surfaces, which are being continu-... 

A variation on depth profiling that can be performed by modern scanning Auger instruments (see Sect. 2.2.6) is to program the incident electron beam to jump from one pre-selected position on a surface to each of many others in turn, with multiplexing at each position. This is called multiple point analysis. Sets of elemental maps acquired after each sputtering step or each period of continuous sputtering can be related to each other in a computer frame-store system to derive a three-dimensional analysis of a selected micro volume. 

When LiMn204 electrodes are deposited as thin films on a platinum substrate, either by electron-beam evaporation or radiofrequency (rf) sputtering, structures are sometimes formed that exhibit unusual electrochemical behavior [146, 147]. Such electrodes have been evaluated in solid-... 

These materials are produced in monolithic form or as coatings. The coatings are generally applied by CVD on ceramic substrates and by sputtering, electron-beam evaporation, or ion-beam assisted deposition on steel substrates (see Appendix). 

Alloy coating of turbine components by electron-beam evaporation and sputtering. 

Chemical alternation of the surface layer and deposition of a new layer on top of the silicone mbber can be achieved by physical techniques. For the inert surface of silicone rubber, the former requires the generation of high-energy species, such as radicals, ions, or molecules in excited electronic states. In the latter case, coatings of atoms or atomic clusters are deposited on polymer surfaces using technique such as plasma (sputtering and plasma polymerization) or energy-induced sublimation, like thermal or electron beam-induced evaporation. 

Some physical techniques can be classified into flame treatments, corona treatments, cold plasma treatments, ultraviolet (UV) treatment, laser treatments, x-ray treatments, electron-beam treatments, ion-beam treatments, and metallization and sputtering, in which corona, plasma, and laser treatments are the most commonly used methods to modify silicone polymers. In the presence of oxygen, high-energy-photon treatment induces the formation of radical sites at surfaces these sites then react with atmospheric oxygen forming oxygenated functions. 

Sputtering- Deposition of copper doped (damascene) almninum interconnects, as well as diffusion barriers, and anti-reflective stacks of Ti/TiN is done by this technique. The metal is heated by an electron beam and "sputters" onto the target. Nitrogen gas is used when TiN is required. 

This technique can be applied to samples prepared for study by scanning electron microscopy (SEM). When subject to impact by electrons, atoms emit characteristic X-ray line spectra, which are almost completely independent of the physical or chemical state of the specimen (Reed, 1973). To analyse samples, they are prepared as required for SEM, that is they are mounted on an appropriate holder, sputter coated to provide an electrically conductive surface, generally using gold, and then examined under high vacuum. The electron beam is focussed to impinge upon a selected spot on the surface of the specimen and the resulting X-ray spectrum is analysed. 

Since ion beams (like electron beams) can be readily focussed and deflected on a sample so that chemical composition imaging is possible. The sputtered particles largely originate from the top one or two atom layers of a surface, so that SIMS is a surface specific technique and it provides information on a depth scale comparable with other surface spectroscopies. 

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