Electrical properties: epoxies

Epoxy resins were introduced commercially in the USA in the late 1940s. They have gained wide acceptance in the surface coatings industry due to their exceptional combination of properties such as toughness, adhesion, chemical resistance and superior electrical properties. Epoxy resins are characterized as compounds or mixtures of compounds which contain one or more epoxide or oxirane groups as shown in formula (20). 

Sihcones (qv) have an advantage over organic resias ia their superior thermal stabiUty and low dielectric constants. Polyurethanes, when cured, are tough and possess outstanding abrasion and thermal shock resistance. They also have favorable electrical properties and good adhesion to most surfaces. However, polyurethanes are extremely sensitive to and can degrade after prolonged contact with moisture as a result, they are not as commonly used as epoxies and sihcones (see Urethane polymers). 

The bisphenol A-derived epoxy resins are most frequendy cured with anhydrides, aUphatic amines, or polyamides, depending on desired end properties. Some of the outstanding properties are superior electrical properties, chemical resistance, heat resistance, and adhesion. Conventional epoxy resins range from low viscosity Hquids to soHd resins. 

Epoxy resins have outstanding mechanical and electrical properties, dimensional stability, resistance to heat and chemicals, and adhesion to other materials. They are used for casting, potting, encapsulation, protective coatings, and adhesives. Epoxy glues separate the resin from the curing. igciU to be mixed just prior to use. 

Siloxane containing interpenetrating networks (IPN) have also been synthesized and some properties were reported 59,354 356>. However, they have not received much attention. Preparation and characterization of IPNs based on PDMS-polystyrene 354), PDMS-poly(methyl methacrylate) 354), polysiloxane-epoxy systems 355) and PDMS-polyurethane 356) were described. These materials all displayed two-phase morphologies, but only minor improvements were obtained over the physical and mechanical properties of the parent materials. This may be due to the difficulties encountered in controlling the structure and morphology of these IPN systems. Siloxane modified polyamide, polyester, polyolefin and various polyurethane based IPN materials are commercially available 59). Incorporation of siloxanes into these systems was reported to increase the hydrolytic stability, surface release, electrical properties of the base polymers and also to reduce the surface wear and friction due to the lubricating action of PDMS chains 59). 

Alignment of CNTs markedly affects the electrical properties of polymer/CNT composites. For example, the nanocomposites of epoxy/MWCNTs with MWCNTs aligned under a 25 T magnetic field leads to a 35% increase in electric conductivity compared to those similar composites without magnetic aligned CNTs (Kilbride et al., 2002). Improvements on the dispersion and alignment of CNTs in a polymer matrix could markedly decrease the percolation threshold value. 

In 2000, NEC developed an epoxy resin with what it describes as a fire-retardant structure that avoids the need for either TBBA or phosphorus-based flame retardants in circuit boards. The new resin contains a metal hydroxide retardant. The company claims the new board is almost totally free of pollutants, and is easy to process and thermally recycle. By also integrating flame retardant properties within the board, use of the metal hydroxide is minimised, while offering good electrical properties, higher heat resistance and improved processing characteristics. ... 

Nylons 6/6 and 6 comprise more than 90% of the polyamide market. The two have similar properties but nylon 6 has a lower Tm (223°C). Small amounts of nylons 6/9, 6/10, 6/12, 11, 12, 12/12, and 4/6 are produced as specialty materials. Those with more methylene groups than nylons 6/6 and 6 have better moisture resistance, dimensional stability, and electrical properties, but the degree of crystallinity, Tm, and mechanical properties are lower. Specialty nylons made from dimerized fatty acids find applications as hot-melt adhesives, crosslinking agents for epoxy resins, and thermographic inks. 

In the crosslinked state, epoxy resins are highly resistant to chemicals, temperature, and solvents and are also endowed with good electrical properties. They are therefore employed, for example, as casting resins in electro- and electronic industry as well as resistant lacquers and coatings. Moreover, they possess excellent adhesive power for many plastics, wood, and metals ( reaction adhesives two-component adhesives ). 

Thus, the cured epoxy resin is a highly functional material whose final chemical, physical, and electrical properties dictate the ultimate utility of that material. 

Some electrical properties of reinforcing fibers, composite resins, and the resulting composites are given in Tables 6.12, 6.13, and 6.14, respectively. These values should be taken as approximate only, especially for the composites, since fiber orientation, content, and field strengfh have an enormous impacf on fhe dielecfric properties of these materials. Some of the most widespread electrical applications for glass-fiber-reinforced epoxy systems are in printed circuit boards and electrical housing such as junction boxes. 

The characteristics of the three most common thermoset resin systems used in pultrusion are compiled in Table 11.2 [3]. It is noteworthy that unreinforced polyesters and vinylesters shrink 7-9% upon crosslinking, whereas epoxies shrink much less and tend to adhere to the die. These epoxy characteristics translate into processing difficulties, reduced processing speed, and inferior component surface finish. It is normal practice to use resin additives to improve processability, mechanical properties, electrical properties, shrinkage, environmental resistance, temperature tolerance, fire tolerance, color, cost, and volatile evaporation. It is normally the resin, or rather its reactivity, that determines the pulling speed. Typical pulling speeds for polyesters tend to be on the order of 10-20 mm/s, whereas speeds may exceed lOOmm/s under certain circumstances. Apart from the resins characterized in Table 11.2, several other thermosets, such as phenolics, acrylics, and polyurethanes, have been tried, as have several thermoplastics (as will be discussed in Sec. 11.2.6). 

Polyurethanes can be used in applications where electrical properties are important. They are not normally used for high-voltage insulation. Polyurethanes are often used directly or in combination with epoxies for encapsulation. The addition of antistatic agents to polyurethane gives a product with the correct electrical properties while retaining the excellent wear needed for a number of roller-type applications. 

Epoxy casting resins are frequently applied for encapsulation of electro-technical parts such as coils and transformers. The electrical properties of epoxies are, in general, better than those of polyesters. 

Tetrabromobisphenol A is used in epoxy resins especially for glass fiber reinforced used in printed circuit board. Nonreactive compounds such as tetrabromophatalate ester, bis(tribromophenoxy) ethane, and decabromodiphenyl ether are also used. The use of synergists, such as antimony oxide, reduces the quantity of brominated flame retardant necessary but decreases the electrical properties required. 

Epoxy resin can have varying amounts of inorganic material remaining in the product after its synthesis. One of these is sodium chloride, which is formed by the reaction of sodium hydroxide with epichlorohydrin molecules, as described in Chap. 2. This is important in electrical applications because the sodium salt can be hydrolyzed and can degrade electrical properties. Some epoxy resin manufacturers will offer special ultrapure electrical grades or low-chlorine grades of epoxy resins for application where this is an important factor. 

The cycloaliphatic epoxy resins are characterized by the saturated ring in their chemical structure. They are almost water-white, very low-viscosity liquids. They provide excellent electrical properties such as low dissipation factor and good arc-track resistance, good weathering, and high heat distortion temperature. They are also free of hydrolyzable chlorine, sometimes present in DGEBA resins, which adversely affects certain electronic applications. 

Cycloaliphatic and heterocyclic epoxy have better weather resistance and less tendency to yellow and chalk than do aromatic epoxy resins. These resins possess excellent electrical properties and are often used in electrical and electronic applications. They are generally formulated into casting and filament winding compounds. 

Nonconductive fillers are employed with electrical-grade epoxy adhesive formulations to provide assembled components with specific electrical properties. Metallic fillers generally degrade electrical resistance values, although they could be used to provide a degree of conductivity as discussed above. 

The effect of electrical-grade fillers (e.g., silica) on the electrical properties of the adhesive is usually marginal. Generally fillers are not used to improve electrical resistance characteristics such as dielectric strength. The unfilled epoxy is usually optimal as an insulator. Also under conditions of high humidity, fillers may tend to wick moisture and considerably degrade the electrical resistance properties of the adhesive. 

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