Distortion temperature

SAN resins possess many physical properties desked for thermoplastic appHcations. They are characteristically hard, rigid, and dimensionally stable with load bearing capabiHties. They are also transparent, have high heat distortion temperatures, possess exceUent gloss and chemical resistance, and adapt easily to conventional thermoplastic fabrication techniques (7). 

TetrabromobisphenoIA. Tetrabromobisphenol A [79-94-7] (TBBPA) is the largest volume bromiaated flame retardant. TBBPA is prepared by bromination of bisphenol A under a variety of conditions. When the bromination is carried out ia methanol, methyl bromide [74-80-9] is produced as a coproduct (37). If hydrogen peroxide is used to oxidize the hydrogen bromide [10035-10-6] HBr, produced back to bromine, methyl bromide is not coproduced (38). TBBPA is used both as an additive and as a reactive flame retardant. It is used as an additive primarily ia ABS systems, la ABS, TBBPA is probably the largest volume flame retardant used, and because of its relatively low cost is the most cost-effective flame retardant. In ABS it provides high flow and good impact properties. These benefits come at the expense of distortion temperature under load (DTUL) (39). DTUL is a measure of the use temperature of a polymer. TBBPA is more uv stable than decabrom and uv stable ABS resias based oa TBBPA are produced commercially. 

Nylon-6. Nylon-6—clay nanometer composites using montmorillonite clay intercalated with 12-aminolauric acid have been produced (37,38). When mixed with S-caprolactam and polymerized at 100°C for 30 min, a nylon clay—hybrid (NCH) was produced. Transmission electron microscopy (tern) and x-ray diffraction of the NCH confirm both the intercalation and molecular level of mixing between the two phases. The benefits of such materials over ordinary nylon-6 or nonmolecularly mixed, clay-reinforced nylon-6 include increased heat distortion temperature, elastic modulus, tensile strength, and dynamic elastic modulus throughout the —150 to 250°C temperature range. 

Fig. 26. Qualitative compatison of substrate materials for optical disks (187) An = birefringence IS = impact strength BM = bending modulus HDT = heat distortion temperature Met = metallizability WA = water absorption Proc = processibility. The materials are bisphenol A—polycarbonate (BPA-PC), copolymer (20 80) of BPA-PC and trimethylcyclohexane—polycarbonate (TMC-PC), poly(methyl methacrylate) (PMMA), uv-curable cross-linked polymer (uv-DM), cycHc polyolefins (CPO), and, for comparison, glass.

Because the heat distortion temperature of cured epoxy resins (qv) increases with the functionality of the curing agents, pyromellitic dianhydride is used to cross-link epoxy resins for elevated temperature service. The dianhydride may be added as a dispersion of micropulverized powder in liquid epoxy resin or as a glycol adduct (158). Such epoxies may be used as an insulating layer in printed circuit boards to improve heat resistance (159). Other uses include inhibition of corrosion (160,161), hot melt traffic paints (162), azo pigments (163), adhesives (164), and photoresist compounds (165). 

Film or fibers derived from low molecular weight polymer tend to embrittle on immersion ia acetone those based on higher molecular weight polymer (>0.60 dL/g) become opaque, dilated, and elastomeric. When a dilated sample is stretched and dried, it retains orientation and is crystalline, exhibiting enhanced tensile strength. The tensile heat-distortion temperature of the crystalline film is iacreased by about 20°C, and the gas permeabiUty and resistance to solvent attack is iacreased. 

For all three diallyl phthalate isomers, gelation occurs at nearly the same conversion DAP prepolymer contains fewer reactive allyl groups than the other isomeric prepolymers (36). More double bonds are lost by cyclisation in DAP polymerisation, but this does not affect gelation. The heat-distortion temperature of cross-linked DAP polymer is influenced by the initiator chosen and its concentration (37). Heat resistance is increased by electron beam irradiation. 

Reinforced Thermoplastic Sheet. This process uses precombined sheets of thermoplastic resin and glass fiber reinforcement, cut into blanks to fit the weight and size requirements of the part to be molded. The blanks, preheated to a specified temperature, are loaded into the metal mold and the material flows under mol ding pressure to fiU the mold. The mold is kept closed under pressure until the temperature of the part has been reduced, the resin solidified, and demolding is possible. Cycle time, as with thermosetting resins, depends on the thickness of the part and the heat distortion temperature of the resin. Mol ding pressures are similar to SMC, 10—21 MPa (1500—3000 psi), depending on the size and complexity of the part. 

The effects of release additives on bulk properties must also be carefully considered, particularly with integral additives to plastics. Eor example, partial solubiHty usually confers some plastici2ing effect. This may improve impact strength but could reduce the heat distortion temperature. Some release additives such as metallic soaps have secondary antioxidant and heat-stabiH2er benefits. Such effects are exploited in multipurpose formulations. 

Four modes of characterization are of interest chemical analyses, ie, quaUtative and quantitative analyses of all components mechanical characterization, ie, tensile and impact testing morphology of the mbber phase and rheology at a range of shear rates. Other properties measured are stress crack resistance, heat distortion temperatures, flammabiUty, creep, etc, depending on the particular appHcation (239). 

The alkyl group also produces subde changes in the processing of the PVC, the use level and cost of the stabilizer, and in some cases even the final properties of the article, especially the heat distortion temperature or Vicat softening point. Overall, methyl derivatives are most widely used. Butyls are second and octyls a distant third. 

Samples S/B mole. b ratios Elongation at break, % Light transmittance, % Charpy impact strength, J /m Heat distortion temperature, °C... 

Random copolymers of vinyl chloride and other monomers are important commercially. Most of these materials are produced by suspension or emulsion polymerization using free-radical initiators. Important producers for vinyl chloride—vinyUdene chloride copolymers include Borden, Inc. and Dow. These copolymers are used in specialized coatings appHcations because of their enhanced solubiUty and as extender resins in plastisols where rapid fusion is required (72). Another important class of materials are the vinyl chloride—vinyl acetate copolymers. Principal producers include Borden Chemicals Plastics, B. F. Goodrich Chemical, and Union Carbide. The copolymerization of vinyl chloride with vinyl acetate yields a material with improved processabihty compared with vinyl chloride homopolymer. However, the physical and chemical properties of the copolymers are different from those of the homopolymer PVC. Generally, as the vinyl acetate content increases, the resin solubiUty in ketone and ester solvents and its susceptibiUty to chemical attack increase, the resin viscosity and heat distortion temperature decrease, and the tensile strength and flexibiUty increase slightly. 

Polymers with differing morphologies respond differentiy to fillers (qv) and reinforcements. In crystalline resins, heat distortion temperature (HDT) increases as the aspect ratio and amount of filler and reinforcement are increased. In fact, glass reinforcement can result in the HDT approaching the melting point. Amorphous polymers are much less affected. Addition of fillers, however, intermpts amorphous polymer molecules physical interactions, and certain properties, such as impact strength, are reduced. 

Ultem PEI resins are amber and amorphous, with heat-distortion temperatures similar to polyethersulfone resins. Ultem resins exhibit high modulus and ate stiff yet ductile. Light transmission is low. In spite of the high use temperature, they are processible by injection mol ding, stmctural foam mol ding, or extmsion techniques at moderate pressures between 340 and 425°C. They are inherently flame retardant and generate Httie smoke dimensional stabiUties are excellent. Large flat parts such as circuit boards or hard disks for computers can be injection-molded to maintain critical dimensions. 

Blends of PC and ABS resins are being used more and more. Sufficient PC is used to raise the heat-distortion temperature of the ABS above 100°C. Impact resistance is reduced without sacrificing utihty, and cost saving can be considerable. 

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