Dielectric, electronic devices

L. Kang, B. Hun Lee, W.-J. Qi, Y. Jeon, R. Nieh, S. Gopalan, K. Onishi, J.C. Lee, Electrical characteristics of highly reliable ultrathin hafniumoxide gate dielectric. Electron Device Lett. (2000) 21181-21183. 

J. Heikenfeld and A.J. Steckl, Contrast enhancement in black dielectric electroluminescent devices, IEEE Trans. Electron. Devices, 49 1348-1352, 2002. 

The Parylene family has very attractive properties for use as dielectric materials as was noted above, but their thermal stability at the temperatures used in the fabrication of electronic devices is less than optimum. When considering alternatives as possible precursors for VDP, the isomeric ortho-xylylene (o-quinodimethane) is a likely candidate (Scheme 4). This approach involves the thermolysis ofbenzocyclobutene derivatives to generate a reactive dieneoid intermediate (o-quinodimethane),... 

The ability to apply a planarizing, optically transparent, thermally stable polymer system that cures under relatively mild conditions has recently been demonstrated to have utility in the fabrication of multilayer devices such as advanced color liquid-crystal display31,32 The ability to apply this material as a dielectric or optical coating for thin-film electronics devices has also recently been demonstrated with the fabrication of an optical wave guiding device.33... 

Barium titanate has many important commercial apphcations. It has both ferroelectric and piezoelectric properties. Also, it has a very high dielectric constant (about 1,000 times that of water). The compound has five crystalline modifications, each of which is stable over a particular temperature range. Ceramic bodies of barium titanate find wide applications in dielectric amplifiers, magnetic amplifiers, and capacitors. These storage devices are used in digital calculators, radio and television sets, ultrasonic apparatus, crystal microphone and telephone, sonar equipment, and many other electronic devices. 

The last 20 years have seen enormous progress in the development of high-performance fluoropolymers. Fluorine-containing polyimides stand out as one of the few types of materials that simultaneously possess outstanding thermal stability and mechanical properties, low dielectric permittivity, and thin-film processability. This combination of properties makes them ideal for use as high-performance insulators in electronic devices. 

Since the invention of integrated circuits (ICs), polyimides as heat-resistant organic polymers have been applied to insulation materials in electronics devices such as flexible printed circuit boards (FPCs), interlayer dielectrics, buffer coatings, and tape automated bonding (TAB). A polyimide thin layer is easily... 

We are currently in the process of developing printable dielectrics such that all layers can be sequentially applied without the need for re-registration. The source/drain and interconnect layer of the 20-inch x 28-inch source/drain panel shown in Fig. 10.6 was printed in 4 min, speed certainly appropriate for fabrication of electronic devices. 

Typical nanopore materials are porous oxides or polymers that have an ultra-low dielectric constant (k < 2). Ultra-low k is significant in producing highspeed electronic devices such as the interconnect structure shown in Figure 13.8. Si02, which has a dielectric constant of about 4, is currently used as a dielectric material between interconnects in most microelectronic devices. When the packing density between multilevel interconnects increases, a low... 

The ability to integrate an electro-optic material with other optical devices, e.g. light sources and detectors, and with electronic drive circuits is important. Integrability implies that the electro-optic materials and the processing of these materials are compatible with the other components, and that electrical and optical interconnects can be fabricated. Polymer glasses are widely used in the fabrication of electronic devices and device interconnects. Polymers are also used as photoresists and as dielectric interlayers for electrical interconnects. As a result, a body of knowledge already exists concerning planarization methods of polymers on substrates, the definition of microscopic features, and the fabrication of microstructures in planar polymer structures. 

The protection of electronic devices has been a key application for specialty silicones, and this application continues to keep pace with the rate of device development (5). Silicones are used in various ways, ranging from resinous circuit board coatings to encapsulants, with the silicone gels representing a unique solution to a diflScult problem, stress relief These dielectric gels are prepared by hydrosilation and are lightly cross-linked poly(dimethylsiloxane)s. Their modulus is extremely low, but they are elastic in their behavior. They have the stress-relief characteristic of a liquid but the nonflow property of an elastomer. These jellylike materials maintain their physical profile over the broad temperature range of-80 to 200 °C. 

The relative dielectric permittivity of open porous materials (e.g. aerogels) especially its variation with ambient conditions is very important for materials application. A precise measurement has to be assured because of highly porous materials has a value close to unity in the limit of 100 % porosity. Also the variation of due to changes in the environmental parameters (humidity etc.) might be small on a absolute scale, but large on a relative one. This had been the case in previous studies who focused on the relationship between the adsorption of water and/or chemical compounds and of porous systems, e.g. zeolithes[l] and Si02 aerogels [2]. To avoid misinterpretation of the data the measurement has to be checked for the influence of cables and of the electronic devices etc. 

Glass films are used in the semiconductor industry because of their dielectric properties, and are used for encapsulating integrated circuits and other electronic devices because they provide a hermetic seal. Glass films are formed by both reactive and non reactive deposition methods, (e.g., evaporation, sputtering, and ion implantation or ion platting for the latter). 

Use Removal of greases and oils from metal, plastic, elastomer, and paint or varnish surfaces. Used with all cleaning techniques on assembled motors and parts, electronic devices, precision components, motion-picture film, refrigeration systems, etc. Also used for isolation of viruses, for fire extinguishing, and as dielectric coolants. 

Valve Metal, Si and Ceramic Oxides as Dielectric Films for Passive and Active Electronic Devices... 

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