Dielectric devices

Actuation Laws of a Planar Soft Dielectric Device. 724... 

It should be mentioned that as well as for metals the passivation of semiconductors (particularly on Si, GaAs, InP) is also a subject of intense investigation. However, the goal is mostly not the suppression of corrosion but either the fonnation of a dielectric layer that can be exploited for devices (MIS stmctures) or the minimization of interface states (dangling bonds) on the semiconductor surface [63, 64]. 

Multilayer Capacitors. Multilayer capacitors (MLC), at greater than 30 biUion units per year, outnumber any other ferroelectric device in production. Multilayer capacitors consist of alternating layers of dielectric material and metal electrodes, as shown in Figure 7. The reason for this configuration is miniaturization of the capacitor. Capacitance is given by... 

Uses. The chemical inertness, thermal stability, low toxicity, and nonflammability of PFCs coupled with their unusual physical properties suggest many useflil applications. However, the high cost of raw materials and manufacture has limited commercial production to a few, small-volume products. Carbon tetrafluoride and hexafluoroethane are used for plasma, ion-beam, or sputter etching of semiconductor devices (17) (see loN implantation). Hexafluoroethane and octafluoropropane have some applications as dielectric gases, and perfluorocyclobutane is used in minor amounts as a dielectric fluid. Perfluoro-1,3-dimethyl cyclohexane is used as an inert, immersion coolant for electronic equipment, and perfluoro-2-methyldecatin is used for... 

Dielectric Film Deposition. Dielectric films are found in all VLSI circuits to provide insulation between conducting layers, as diffusion and ion implantation (qv) masks, for diffusion from doped oxides, to cap doped films to prevent outdiffusion, and for passivating devices as a measure of protection against external contamination, moisture, and scratches. Properties that define the nature and function of dielectric films are the dielectric constant, the process temperature, and specific fabrication characteristics such as step coverage, gap-filling capabihties, density stress, contamination, thickness uniformity, deposition rate, and moisture resistance (2). Several processes are used to deposit dielectric films including atmospheric pressure CVD (APCVD), low pressure CVD (LPCVD), or plasma-enhanced CVD (PECVD) (see Plasma technology). 

Wafer charging is becoming a critical issue as new MOS devices are designed with thinner (<10 mm) gate dielectrics. Lower energy implanters require optics that compensate for beam divergence which occurs at low energeries (32). 

Semiconductors (qv) are materials with resistivities between those of conductors and those of insulators (between 10 and 10 H-cm). The electrical properties of a semiconductor determine the hmctional performance of the device. Important electrical properties of semiconductors are resistivity and dielectric constant. The resistivity of a semiconductor can be varied by introducing small amounts of material impurities or dopants. Through proper material doping, electron movement can be precisely controlled, producing hmctions such as rectification, switching, detection, and modulation. 

Single-crystal sUicon has also been employed as substrate material, particularly in multichip module (MGM)-Si appUcations. As a substrate, sUicon offers good thermal conductivity and matches the GTE of the devices mounted on it it does, however, have a relatively high dielectric constant and is very britde. 

Electrical, electronic, and technical appHcations use polycarbonates for a variety of purposes. The woddwide market is about 156,000 t aimuaHy. Because of exceHent electrical properties (dielectric strength, volume resistivity), and resistance to heat and humidity, polycarbonate is used for electrical connectors (qv), telephone network devices, oudet boxes, etc. Polycarbonate had been popular for use in computer and business machine housings, but the use of neat resin has been largely supplanted by blends of polycarbonate with ABS. OveraH, however, the total use of polycarbonate continues to increase. 

Because of the high functional values that polyimides can provide, a small-scale custom synthesis by users or toU producers is often economically viable despite high cost, especially for aerospace and microelectronic appHcations. For the majority of iudustrial appHcations, the yellow color generally associated with polyimides is quite acceptable. However, transparency or low absorbance is an essential requirement iu some appHcations such as multilayer thermal iusulation blankets for satellites and protective coatings for solar cells and other space components (93). For iutedayer dielectric appHcations iu semiconductor devices, polyimides having low and controlled thermal expansion coefficients are required to match those of substrate materials such as metals, ceramics, and semiconductors usediu those devices (94). 

Dielectrics for Interlevel Wiring and Planarization. When connecting a number of devices to form a circuit it is often necessary to cross wires without actual electrical contact between them. In order to accomplish this multiple levels of wiring separated by dielectric films are necessary. 

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