Tape automated bonding

Tantalum reserves, 24 316-317 Tantalum wire, 24 326-327 Tape, metal plating for, 17 834 Tape-automated bonding (TAB), 17 823, 824, 833-836 Tape casting... 

Since the invention of integrated circuits (ICs), polyimides as heat-resistant organic polymers have been applied to insulation materials in electronics devices such as flexible printed circuit boards (FPCs), interlayer dielectrics, buffer coatings, and tape automated bonding (TAB). A polyimide thin layer is easily... 

Figure 6. Cofired ceramic pin grid array package with 270 pins and a tape-automated-bonded 1C.

Figure 16. Cross section of thin-film multilayer interconnections on a pinned cofired ceramic substrate, with face-up tape-automated-bonded chip and thermal vias. (Reproduced with permission from reference 79. Copyright 1988 Materials Research Society.)...

Figure 21. Nine-chip microprocessor module with TFML copper-polyimide interconnections on an 80 by 80 mm ceramic substrate. Top, completed package populated with tape-automated-bonded lCs bottom, internal signal interconnection layers. (Reproduced from reference 80. Copyright 1987 American...

JP 05311144 (Japanese) 1993 Heat-resistant adhesive compositions containing polyimide-siloxane block copolymers Ube Industries, Japan H Inoe, S Takabayashi, T Funakoshi, K Sonoyana Useful for Cu-clad laminates of printed circuit boards and tape-automated bonding with good flexibility and heat resistance Formulated compositions containing siloxane-imide block copolymers made from aromatic tetracarboxylic acids and aromatic diamines and aminosiloxanes... 

The chips can be electrically bonded to the multichip package by wire bonding or tape automated bonding (TAB). 

Figure 5. Tape automated bonding system. (Reproduced permission from Ref. 4. Copyright 1988 [Technology and Management, Ltd.].)...

Sharenow, B. Tape Automated Bonding High Lead Count Cost Analysis, Proc. Technical Program, NEPCON West, 1988 (written subsequently). 

Further miniaturization is enabled by direct assembly of bare dies onto circuit carriers. This kind of component is electrically connected by wire bonding. Other methods for direct chip attachment are flip chip and tape automated bonding. All three methods require special equipment for processing and inspection. 

In tape-automated bonding (TAB), the semiconductor die, fabricated with bumped interconnect pads, are positioned in apertures of a polymer-film tape, generally polyimide (Kapton , a registered trademark of DuPont), then gang-bonded to cantilevered beams that are formed by photodelineated metal pads on the tape. The tape (film) has sprocket holes along its sides similar to movie film and, like movie film, is handled on reels in automatic equipment for high-speed assembly. ... 

Film Applications Film for tape automated bonding (TAB) applications, flexible printed circuits (FPCs), insulation stirrer automotive wiring harness, bar code labels, aerospace, gas connections, fire gloves, and loudspeaker vibration boards. 

Isotropic adhesives conduct current equally in all directions and are the most common and widely used in industry. The anisotropic types, also referred to as z-direction adhesives or anisotropic-conductive adhesives (ACA), although filled with metal particles, are filled at much lower levels (0.5%-5% by volume) than isotropic types (filled 25%-30% by volume). The volume Iraction of filler is well below the percolation threshold at which the adhesive becomes highly conductive in all directions. Because of the low volume Iraction of metal particles, there are no continuous electrically conductive paths in the x-y plane. During the connection process, the anisotropic adhesive, either as a film or paste, is positioned between a flip-chip bumped die or a tape-automated bonded (TAB) die and the corresponding pads of an interconnect substrate. Pressure and heat are... 

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