Anodic oxides passive films

This review of STM studies of thin anodic oxide (passive) films formed on metals and alloys shows that important results have been obtained by direct imaging of the sur ce structure, providing direct evidence on (for example), the crystallinity of passive films and the nature of defects. The fully crystalline character of the film on Ni has been demonstrated by STM. The nature of defects (steps, kinks, vacancies, points of reduced thickness) has been elucidated. This is important for a better understanding of the breakdown of passive films. The unique protectiveness of fire film on Cr may be related to the observed structure with oxide nanocrystals cemented by a noncrystalline hydroxide. Many more results are expected to be produced, in the future, on the atomic structure of passive films, including the local interactions of impurities and anions with passive films and especially with surface defects, file local conductivity of passive films derived fi om I-V curves at specific sites, and chemical features derived fixim spectroscopic imaging. All these data should drastically improve our understanding of the relation between structure and properties of passive films. 

Oxide passive film formation on metals and their crystaUine structure have been reviewed recentiy [73,87]. The nanometer-scale chemical and structural aspects have been reviewed by Maurice and Marcus [88]. The growth of 2-D anodic oxide films and the nanostructure of 3-D films are considered in this review. The structures of stainless steels [27,89], Co- [90], Ni- [91], and Cu-based alloys [92,93] have been studied with atomic force microscopy (AFM) and scanning tunneling microscopy (STM). 

The authors also noted that following potentiodynamic polarization from the corrosion potential to 0 mV at a scan rate of 1 mV/s, XPS analysis was still able to detect significant quantities of surface nitride. This is illustrated in Figure 11. The most active of the alloys studied, type 304, was determined to have dissolved approximately 20 monolayers. This suggested that the nitride may form a kinetic barrier that is protected by the oxide passive film from rapid protonation to ammonia and ammonium in the active range of potential. In the same study the nitride phase formed on Ni had little effect on anodic behavior in 0.1 M HCl,... 

Because the metal dissolution is an anodic process, for example, Fe(s) Fe +(aq) + 2e , the current of the process is assumed to be positive. When potential increases from Mez+zMe lo f (passivation or Flade potential), the current is increasing exponentially due to the electron transfer reaction, for example, Fe(s) -> Fe +(aq) + 2e", and can be described using Tafel s equation. At a E the formation of an oxide layer (passive film) starts. When the metal surface is covered by a metal oxide passive film (an insulator or a semiconductor), the resistivity is sharply increasing, and the current density drops down to the rest current density, 7r. This low current corresponds to a slow growth of the oxide layer, and possible dissolution of the metal oxide into solution. In the region of transpassivation, another electrochemical reaction can take place, for example, H20(l) (l/2)02(g) + 2H+(aq) + 2e, or the passive film can be broken down due to a chemical interaction with environment and mechanical instability. Clearly, a three-electrode cell and a potentiostat should be used to obtain the current density-potential curve shown in Figure 9.3. 

Corrosion protection of metals can take many fonns, one of which is passivation. As mentioned above, passivation is the fonnation of a thin protective film (most commonly oxide or hydrated oxide) on a metallic surface. Certain metals that are prone to passivation will fonn a thin oxide film that displaces the electrode potential of the metal by +0.5-2.0 V. The film severely hinders the difflision rate of metal ions from the electrode to tire solid-gas or solid-liquid interface, thus providing corrosion resistance. This decreased corrosion rate is best illustrated by anodic polarization curves, which are constructed by measuring the net current from an electrode into solution (the corrosion current) under an applied voltage. For passivable metals, the current will increase steadily with increasing voltage in the so-called active region until the passivating film fonns, at which point the current will rapidly decrease. This behaviour is characteristic of metals that are susceptible to passivation. 

Highly protective layers can also fonn in gaseous environments at ambient temperatures by a redox reaction similar to that in an aqueous electrolyte, i.e. by oxygen reduction combined with metal oxidation. The thickness of spontaneously fonned oxide films is typically in the range of 1-3 nm, i.e., of similar thickness to electrochemical passive films. Substantially thicker anodic films can be fonned on so-called valve metals (Ti, Ta, Zr,. ..), which allow the application of anodizing potentials (high electric fields) without dielectric breakdown. 

Films, anodic oxide Films, passivating Films, plastic Film theory Film wrappers Filter Filter aid Filter aids Filter fabrics Filtering centrifuges Filter media Filters... 

Besides the use of anodic polarization with impressed current to achieve passivation, raising the cathodic partial current density by special alloying elements and the use of oxidizing inhibitors (and/or passivators) to assist the formation of passive films can be included in the anodic protection method [1-3]. 

Formation of the first layer (a monolayer) of passivating oxide film on a denuded metal surface occurs very simply by the loss of protons from the adsorbed intermediate oxidation products, such intermediates being common to both dissolution and passivation processes . Thus for example, the first oxidative step in the anodic oxidation of nickel is the formation of the unstable adsorbed intermediate NiOH by... 

The dissolution of passive films is, in the main, controlled by a chemical activation step in contrast to film-free conditions at. Many protective anodic films are oxides and hydroxides whose dissolution depends upon the hydrogen ion concentration, and the rate follows a Freundlich adsorption equation ... 

Tin when made anodic shows passive behaviour as surface films are built up but slow dissolution of tin may persist in some solutions and transpassive dissolution may occur in strongly alkaline solutions. Some details have been published for phosphoric acid with readily obtained passivity, and sulphuric acid " for which activity is more persistent, but most interest has been shown in the effects in alkaline solutions. For galvanostatic polarisation in sodium borate and in sodium carbonate solutions at 1 x 10" -50 X 10" A/cm, simultaneous dissolution of tin as stannite ions and formation of a layer of SnO occurs until a critical potential is reached, at which a different oxide or hydroxide (possibly SnOj) is formed and dissolution ceases. Finally oxygen is evolved from the passive metal. The nature of the surface films formed in KOH solutions up to 7 m and other alkaline solutions has also been examined. 

Before considering the principles of this method, it is useful to distinguish between anodic protection and cathodic protection (when the latter is produced by an external e.m.f.). Both these techniques, which may be used to reduce the corrosion of metals in contact with electrolytes, depend upon the electrochemical mechanisms that result from changing the potential of a metal. The appropriate potential-pH diagram for the Fe-H20 system (Section 1.4) indicates the magnitude and direction of the changes in the potential of iron immersed in water (pH about 7) necessary to make it either passive or immune in the former case the stability of the metal depends on the formation of a protective film of metal oxide (passivation), whereas in the latter the metal itself is thermodynamically stable and egress of metal ions from the lattice into the solution is thus prevented. 

Since the natural passivity of aluminium is due to the thin film of oxide formed by the action of the atmosphere, it is not unexpected that the thicker films formed by anodic oxidation afford considerable protection against corrosive influences, provided the oxide layer is continuous, and free from macropores. The protective action of the film is considerably enhanced by effective sealing, which plugs the mouths of the micropores formed in the normal course of anodising with hydrated oxide, and still further improvement may be afforded by the incorporation of corrosion inhibitors, such as dichromates, in the sealing solution. Chromic acid films, in spite of their thinness, show good corrosion resistance. 

CV of solutions of lithium bis[ salicy-lato(2-)]borate in PC shows mainly the same oxidation behavior as with lithium bis[2,2 biphenyldiolato(2-)-0,0 ] borate, i.e., electrode (stainless steel or Au) passivation. The anodic oxidation limit is the highest of all borates investigated by us so far, namely 4.5 V versus Li. However, in contrast to lithium bis[2,2 -biphenyl-diolato(2-)-0,0 Jborate based solutions, lithium deposition and dissolution without previous protective film formation by oxidation of the anion is not possible, as the anion itself is probably reduced at potentials of 620-670 mV versus Li, where a... 

As mentioned, corrosion is complexly affected by the material itself and the environment, producing various kinds of surface films, e.g., oxide or hydroxide film. In the above reactions, both active sites for anodic and cathodic reactions are uniformly distributed over the metal surface, so that corrosion proceeds homogeneously on the surface. On the other hand, if those reaction sites are localized at particular places, metal dissolution does not take place uniformly, but develops only at specialized places. This is called local corrosion, pitting corrosion through passive-film breakdown on a metal surface is a typical example. 

In the polarization curve for anodic dissolution of iron in a phosphoric acid solution without CP ions, as shown in Fig. 3, we can see three different states of metal dissolution. The first is the active state at the potential region of the less noble metal where the metal dissolves actively, and the second is the passive state at the more noble region where metal dissolution barely proceeds. In the passive state, an extremely thin oxide film called a passive film is formed on the metal surface, so that metal dissolution is restricted. In the active state, on the contrary, the absence of the passive film leads to the dissolution from the bare metal surface. The difference of the dissolution current between the active and passive states is quite large for a system of an iron electrode in 1 mol m"3 sulfuric acid, the latter value is about 1/10,000 of the former value.6... 

Figure 5 shows the relationship between the passive film thickness of an iron electrode and the electrode potential in an anodic phosphate solution and a neutral borate solution.6,9 A passive film on an iron electrode in acidic solution is made up of an oxide barrier layer that increases its thickness approximately linearly with increasing electrode potential, whereas in a neutral solution, there is a precipitated hydroxide layer with a constant thickness outside the oxide barrier layer. 

The origin of the observed correlation was not established, and the relation was not interpreted as causal. It could be argued that a sustained elevated potential due to as-yet unknown microbial processes altered the passive film characteristics, as is known to occur for metals polarized at anodic potentials. If these conditions thickened the oxide film or decreased the dielectric constant to the point where passive film capacitance was on the order of double-layer capacitance (Cji), the series equivalent oxide would have begun to reflect the contribution from the oxide. In this scenario, decreased C would have appeared as a consequence of sustained elevated potential. 

If the electrode is covered with a film, then anodic oxidation of the metal does not involve facetting. The surface of the metal either becomes more rough (if the film is discontinuous) or becomes very lustrous (continuous films). Films, especially continuous films, retard the electrode reaction of metal oxidation. The metal is said to be in its passive state. 

Environmental tests have been combined with conventional electrochemical measurements by Smallen et al. [131] and by Novotny and Staud [132], The first electrochemical tests on CoCr thin-film alloys were published by Wang et al. [133]. Kobayashi et al. [134] reported electrochemical data coupled with surface analysis of anodically oxidized amorphous CoX alloys, with X = Ta, Nb, Ti or Zr. Brusic et al. [125] presented potentiodynamic polarization curves obtained on electroless CoP and sputtered Co, CoNi, CoTi, and CoCr in distilled water. The results indicate that the thin-film alloys behave similarly to the bulk materials [133], The protective film is less than 5 nm thick [127] and rich in a passivating metal oxide, such as chromium oxide [133, 134], Such an oxide forms preferentially if the Cr content in the alloy is, depending on the author, above 10% [130], 14% [131], 16% [127], or 17% [133], It is thought to stabilize the non-passivating cobalt oxides [123], Once covered by stable oxide, the alloy surface shows much higher corrosion potential and lower corrosion rate than Co, i.e. it shows more noble behavior [125]. 

Mechanism 3 involves NiOH in at least three reactions, and Ni(OH)2 as the active Ni reactant in solution. Since increasing the concentration of the complex-ant(s) in solution will reduce the concentration of both unhydrolyzed and hydrolyzed metal ions, arguments of complexation cannot be readily employed to either support or discount this mechanism. However, it has been this author s experience in formulating electroless Co-P solutions with various complexants for Co2+ that improper complexation which results in even a faint precipitate of hydrolyzed cobalt ions yields an inactive electroless Co-P solution. Furthermore, anodic oxidation of hypo-phosphite at Ni anodes does not proceed at a significant rate under conditions where the surface is most probably covered with a passive film of nickel oxide [48], e.g. NiO.H20, which would be expected to oxidize the reducing agent via a cyclic redox mechanism. 

At higher anodic potentials an anodic oxide is formed on silicon electrode surfaces. This leads to a tetravalent electrochemical dissolution scheme in HF and to passivation in alkaline electrolytes. The hydroxyl ion is assumed to be the active species in the oxidation reaction [Drl]. The applied potential enables OH to diffuse through the oxide film to the interface and to establish an Si-O-Si bridge under consumption of two holes, according to Fig. 4.4, steps 1 and 2. Details of anodic oxide formation processes are discussed in Chapter 5. This oxide film passivates the Si electrode in aqueous solutions that are free of HF. 

---