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Adhesive resins, manufacturing

P(2) The adhesive/resin layer thickness shall not exceed the maximum value given by the adhesive/resin manufacturer because of the temperature peak produced by the exothermal cure process of adhesives/resins. [Pg.208]

Table 3 lists the selected properties [16] that we have measured for several commercially available acrylate resins manufactured by the Sartomer Company and the Rohm and Haas Company. The resins were cured in an AECL Gammacell Model 240. The temperature rise was measured for an 8-g sample using Acsion s (formerly AECL Radiation Applications Branch) Gamma Calorimetry method [17]. All of this information is being used to evaluate the applicability of EB-cured acrylate adhesives for repairing composite structures. Combinations of these adhesives can be used to create electron-curable adhesives suitable for composite repair. [Pg.1014]

Phenolic novolacs, 18 760-761 Phenolic resin adhesives, 18 783-784 Phenolic resin can coatings, 18 38 Phenolic resin composites, 18 792-794 Phenolic resin drying-oil varnishes, 18 783 Phenolic resin fibers, 18 797-798 mechanical properties of, 18 798 Phenolic resin foam, 18 795-796 Phenolic resin manufacturers, U.S., 18 774 Phenolic resin polymerization, 18 760-765 alkaline catalysts in, 18 762-765 neutral catalysts in, 18 761-762 strong-acid catalysts in, 18 760-761 Phenolic resin prepregs, 18 793 Phenolic resin production unit, 18 766 Phenolic resins, 10 409 18 754-755, 756-802 22 10 26 763 in abrasive materials, 18 786-787 in air and oil filters, 18 790 additional reactants in, 18 759 analytical methods for, 18 774-779 applications of, 18 781-798 batch processes for, 18 766 from biomass and biochemical processes, 18 769-770... [Pg.693]

Adhesive. Urea-formaldehyde water-based dispersions are the most widely used particleboard binders. The low-cost, rapid curing, and colorless properties of urea-formaldehyde adhesives make them the adhesive of choice for most interior particleboard. These adhesives have been continuously improved by the resin manufacturers, resulting in reduced press times without detrimental effects on their storage life or handling characteristics. [Pg.230]

After the veneer has been properly unitized and dried, it is transported to the gluing operation. It is here that the greatest proportion of chemicals other than water are involved in the plywood process. To better understand the adhesive resins involved, perhaps it is best to review the quantities of softwood and hardwood plywood manufactured in relation to the adhesive needs required. The 1972 - 1973 era were years of peak production in the United States for plywood. Data will be extracted from various reports for presentation purposes. Hardwood and softwood plywood production is normally reported in different manners and it is difficult to compare. While the values reported are not intended to be exactly accurate, they will give some comparison, relatively speaking, and should give some concept of the volume of plywood produced and in turn the volume of adhesives used. [Pg.282]

Properties often used by epoxy resin manufacturers to specify particular grades of resin include the epoxy content, viscosity or softening point, and color. In addition, properties such as density, vapor pressure, flash point, refractive index, solubility characteristics, and hydroxyl content are often reported. The important properties of uncured epoxy formulations with regard to most adhesive applications are... [Pg.44]

Phenolic adhesives continue to be the most significant adhesives for the production of weather-resistant wood products. The energy crisis of the seventies, the cost of phenol, and the inevitable decline in petroleum reserves have caused the wood industry to focus attention on obtaining adhesive self-sufficiency (1). This concern arises primarily from the questionable longterm availability of resins and secondarily from the economics of adhesive resin use. Ready availability of adhesive resins is critical to the manufacture of bonded wood products. In practical terms, this means that new adhesive systems are needed in which part, or perhaps all, of the petroleum-derived phenolic component is replaced... [Pg.352]

Another problem of a seemingly unrelated nature is the formaldehyde emission from building boards that are currently manufactured using urea-formaldehyde adhesive resins. Formaldehyde has been implicated as a carcinogen and can also cause severe upper respiratory problems and contact dermatitis in some individuals (3-5). [Pg.395]

The use of formaldehyde-free adhesive resins from whey and whey byproducts for manufacturing construction-quality boards could resolve these problems simultaneously. The demand for formaldehyde-based thermosetting adhesive resins in the United States was estimated to be 1.9 billion pounds in 1983 (5). The anticipated requirement for resins and the potential availability of raw materials from whey are a fortuitous combination. [Pg.395]

Manufacture of glycerol and unmodified epoxy resins manufacture of elastomers, water-treatment resins, surfactants, ion exchange resins, plasticizers, dyestuffs, pharmaceutical products, oil emulsifiers, lubricants, and adhesives 3511,3513, 3529, 354, 38, 4... [Pg.94]

Two concrete blocks were carefully bonded by inserting a carbon fiber sheet with the adhesive resin and cured at room temperature for 48 hours as the manufacturer s recommendation. A thin releasing film was inserted between the concrete blocks and carbon fiber sheet to introduce an artificial crack and to make an adhesive region of 20 x 10 mm The blocks were then bonded to the steel jigs with the same adhesive resin, as shown in Fig. 11. A liquid type primer was used to gain the adhesiveness of the interface between the concrete and carbon fiber sheet. [Pg.336]

Pressure-sensitive adhesives are the essential components of adhesive tapes and labels. They are polymers with permanent tack, usually applied on substrates (plastic/metal films, siliconized papers). To enhance their tack, compounds with high inherent tack are added, for example, resins, plasticizers. Pressure-sensitive adhesives reach their adhesion on the material to be bonded by contact pressure, from which the term pressure-sensitive adhesive (PSA) derives. Apart from electron radiation, also UV-radiation curing described in Section 4.3.2 is applied in adhesive tape manufacturing. The monomer molecules to be polymerized are applied, in liquid form, to the substrates to be coated by rolling and are continuously cured to a polymer layer within seconds under a UV-radiation source. Depending on their composition, predetermined adhesion values can be adjusted. The adhesive tapes can be subsumed under the systems shown in Figure 5.4 ... [Pg.53]

The adhesive is manufactured in tape form by a hot-melt process. It is a tacky solid at room temperature. The integrity is maintained by using a finely woven glass fabric scrim as the carrier. This process is an excellent example of the compromises required in the technology of formulation. Some of the high-temperature performance that is expected from the phenolic resole is sacrificed for the improved bond strength and toughness afforded from the epoxy resin. The filler is added to make the thermal coefficient of expansion of the cured adhesive more metallic in nature. Dicyandiamide is the... [Pg.569]

PCBs are extremely stable to heat, chemical, and biological decomposition. They are excellent insulating and cooling fluids, extensively used for many years in manufacture of transformers and capacitors. PCBs are also used in hydraulic fluids, lubricating oils, paints, adhesive resins, inks, fire retardants, wax extenders, and numerous other products. The chemical and physical properties of PCBs make the remediation of polluted sites difficult. They resist degradation and absorb into soils and colloidal materials in water. Some persist with half-lives of 8-15 years in the environmental compartments. This stability contributes to their dispersion in the environment and long-range air pollution. Because they are lipophilic, these species are stored in fatty tissues and accumulate in the food webs (see Section 2.2). [Pg.371]


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