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Adhesives, electron curable

Over the years there have been several studies examining electron-curable adhesives [9-12]. Off-the-shelf acrylate adhesives were the primary focus of the studies. These adhesives, that have potential use for the repair of advanced composites using high-energy electron accelerators, offer several advantages over conventional repair systems, including [6] ... [Pg.1010]

Table 3 lists the selected properties [16] that we have measured for several commercially available acrylate resins manufactured by the Sartomer Company and the Rohm and Haas Company. The resins were cured in an AECL Gammacell Model 240. The temperature rise was measured for an 8-g sample using Acsion s (formerly AECL Radiation Applications Branch) Gamma Calorimetry method [17]. All of this information is being used to evaluate the applicability of EB-cured acrylate adhesives for repairing composite structures. Combinations of these adhesives can be used to create electron-curable adhesives suitable for composite repair. [Pg.1014]

All of the types of repairs described can be accomplished using electron/X-ray curing and suitable electron-curable adhesive systems. The advantages ol using an electron accelerator are faster curing cycles, short turn-around time, and higher-temperature-resistant bonds, cured at ambient temperatures. [Pg.1026]

For most electron-curable adhesives, a dose of 100 kGy is required to cure. Fig. 4 shows the speed of curing various widths of material as a function of accelerator power. A reasonably controllable speed for moving parts through an accelerator would be approximately 10 m per minute. Based on this criterion, the lower wattage limit for an accelerator curing an adhesive strip 5 cm wide would be 5 kW. For curing very large parts a 50 kW accelerator would be more suitable. [Pg.1028]

Lopata, V.J., Chung, M., McDougall, TE. and Weinberg, V.A., Electron-curable adhesives for high-performance structures. 39 Int. SAMPE Symp., Apr. 11-14, 1994. [Pg.1037]

Electron-Curable Coatings and Adhesives Formulation Basics and Application Technology... [Pg.71]

The papers presented in the following chapters represent advances in pressure sensitive adhesives (ultraviolet light activated acrylate monomer - low Tg polyether formulations) photoinitiated cationic polymerization (light activated aryliodonium and arylsulfonium salts of lewis acids in epoxy resin formulations) polymer and formulation design criteria for radiation curable adhesives radiation curable composites (dynamic thermal analysis characterization of electron beam cured... [Pg.317]

UV curable adhesives have been used in electronics and electrical manufacturing operations for many years. There are many uses, such as bonding of coils, bonding of loudspeaker membranes, bonding and sealing of wires in ducfs, bonding of liquid crystal displays, and bonding of membrane swifches. ... [Pg.152]

Formulation details are then presented in Chapters 11 through 14 for the various possible forms of epoxy adhesive systems room temperature and elevated-temperature curing liquids, pastes, and solids. The more or less unconventional forms of epoxy adhesives are also identified and discussed, since these are now achieving prominence in industry. These include uv and electron beam radiation curable, waterborne systems, and epoxy adhesives capable of curing via the indirect application of heat or energy. [Pg.552]

Energy curable adhesives for use in flexible packaging based on ultraviolet or electron beam irradiation are in their infancy. The potential use of these types of adhesive is promising due to the fast cure rate (essentially full cure on irradiation and hence low risk of migratory components) and the potentially... [Pg.358]


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