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Thin films Physical vapor deposition

The epitaxy reactor is a specialized variant of the tubular reactor in which gas-phase precursors are produced and transported to a heated surface where thin crystalline films and gaseous by-products are produced by further reaction on the surface. Similar to this chemical vapor deposition (CVE)) are physical vapor depositions (PVE)) and molecular beam generated deposits. Reactor details are critical to assuring uniform, impurity-free deposits and numerous designs have evolved (Fig. 22) (89). [Pg.523]

Diserens, M., Patscheider, J., and Levy, F., "Mechanical Properties and Oxidation Resistance of Nanocomposite TiN-SiN Physical-Vapor-Deposited Thin Films, Surf. Coat. Technol,Vol. 120 Ill, 1999,65. [Pg.165]

Electrocatalytic activity of supported metal particles has been investigated on surfaces prepared in an ultrahigh vacuum (UHV) molecular beam epitaxy system (DCA Instruments) modified to allow high throughput (parallel) synthesis of thin-film materials [Guerin and Hayden, 2006]. The system is shown in Fig. 16.1, and consisted of two physical vapor deposition (PVD) chambers, a sputtering chamber, and a surface characterization chamber (CC), all interconnected by a transfer chamber (TC). The entire system was maintained at UHV, with a base pressure of 10 °mbar. Sample access was achieved through a load lock, and samples could be transferred... [Pg.572]

Bhattacharya, R. N. Balcioglu, A. Ramanathan, K. 2001. Deep-level transient spectroscopy (DLTS) of CdS/CuIni xGaxSe2-based solar cells prepared from electroplated and auto-plated precursors, and by physical vapor deposition. Thin Solid Films 384 65-68. [Pg.235]

Thin-Film Deposition Physical Vapor Deposition (sputtering, pulsed laser)... [Pg.390]

Thermal spray, laser deposition, physical vapor deposition, and magnetron sputtering are physical processes that are used for fabrication of electrolyte thin films. Sputtering is a reliable technique for film deposition and is being used in industry... [Pg.18]

Physical Vapor Deposition Processes. The three physical vapor deposition (PVD) processes are evaporation, ion plating, and sputtering (see Thin films, film formation techniques). [Pg.41]

Model catalysts have to be prepared directly on the IRE, which can be a challenging task. Thin metal films are an important type of model catalyst and can be made, for example, by physical vapor deposition or sputtering of the metal onto the IRE. Most suitable IRE materials for such applications are Ge and Si. The former has a high refractive index of 4.0, which results in a small penetration depth and therefore good discrimination against bulk solvent. The metal film should not be too thick, so that the evanescent field can reach the outer interface of the metal film. [Pg.234]

It becomes clear from the above discussion that metal catalyst films suitable for ATR spectroscopy must be very thin. Such films are generally not homogeneous. In many cases physical vapor deposition leads to films composed of metal islands. The morphology depends on the substrate (IRE), the metal, and preparation conditions such as evaporation rate, substrate temperature, and background gas. [Pg.235]

Reproducibility of film preparation and stability of the resulting films are important issues for practical applications. Cleanliness of the IRE before metal deposition can play a decisive role in determining reproducibility. Depending on the conditions, metal films may not be stable and may peel off (36,37). The stability and reproducibility of metal films can be enhanced by evaporating a metal oxide support material (such as AI2O3) prior to evaporation of the desired metal. Contaminants on the IRE are covered or displaced by evaporation of the metal oxide. It was reported that a 50-100-nm-thick AI2O3 layer deposited on a Ge IRE by electron beam physical vapor deposition hardly affected the reflectivity in an ATR experiment. Thin platinum films directly deposited onto it were found to be rather stable under catalytic reaction conditions (26,38). [Pg.238]

Chemical and physical vapor deposition technique has been widely applied for the preparation of such photocatalytic thin films. Since these vapor methods need an instrumental setup which enables control of temperature and pressure, their initial and running costs are generally high and the size of substrate is limited. Spray method, in which titanium alkoxide and water is sprayed on a substrate heated at a desired temperature, affords Ti02 thin films.69) However, like the sol-gel route, the physical properties and photocatalytic activity of Ti02 strongly depend on many factors such as temperature of substrate, flow rate of carrier gas, and partial pressure of starting material in the system. [Pg.212]

Deposition is used in industry to create very thin films of material on the surfaces of objects. This process, known as physical vapor deposition (PVD), takes specific gas molecules and changes them into solids that are deposited as coatings on the surface of objects. In some cases, the coatings are protective in other cases, the coatings create a pleasing appearance. [Pg.93]

The adsorption of albumin from aqueous solution onto copper and nickel films and the adsorption of B-lactoglobulin, gum arabic, and alginic acid onto germanium were studied. Thin metallic films (3-4 nm) were deposited onto germanium internal reflection elements by physical vapor deposition. Transmission electron microscopy studies indicated that the deposits were full density. Substrate temperature strongly Influenced the surface structure of the metal deposits. Protein and/or polysaccharide were adsorbed onto the solid substrates from flowing... [Pg.208]

Physical vapor deposition and chemical vapor deposition are both techniques for producing thin films. Both rely on the transfer of mass from the vapor phase to a solid surface. A third technique, related to chemical vapor deposition but generally considered distinct from it, is molecular beam epitaxy (MBE) (Joyce and Joyce, 2004), in which a neutral beam of atoms is used to deposit a layer of adsorbed atoms. To deposit a compound, two molecular beams are used, depositing the constituent elements in the compound sequentially. Although this appears to make the deposition of any size film of any composition a simple matter (shown schematically below in Figure 3.26), the technical requirements for achieving this deposition are severe. [Pg.136]

Thin Film Formation Liquid Phase Coating Physical Vapor Deposition Chemical Vapor Deposition... [Pg.397]

The problem of adhesion between a polymer and a metal is strongly dependent on the specific type of polymer and metal involved, as well as on the deposition process under which the interface between the two is formed. In order to improve adhesion, different pretreatment methods can be used, but the development of such techniques requires detailed information about metal-polymer interfaces. Particularly, in the case of thin metal films deposited by physical vapor deposition (PVD) in ultra high vaccum (UHV), X-ray and ultraviolet photoelectron spectroscopy (XPS and UPS) have been used to obtain chemical information about initial film growth modes,... [Pg.333]


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See also in sourсe #XX -- [ Pg.79 , Pg.81 ]




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