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Substrate Heating

Exhaust gas temperature sensor Catalytic substrate Heat insulator... [Pg.308]

CVD plays an increasingly important part in the design and processing of advanced electronic conductors and insulators as well as related structures, such as diffusion barriers and high thermal-conductivity substrates (heat-sinks). In these areas, materials such as titanium nitride, silicon nitride, silicon oxide, diamond, and aluminum nitride are of particular importance. These compounds are all produced by CVD. 1 1 PI... [Pg.367]

Alloy films are commonly sintered during preparation by deposition on substrates heated to, say, 400°C or by subsequent annealing at such temperatures, and, consequently, rather small surface areas have to be measured, perhaps in vessels of substantial volume. Krypton adsorption at liquid nitrogen temperature was used with induction-evaporated Cu-Ni, Fe-Ni, and Pd-Ni films, and BET surface areas of 1000-2000 cm2 were recorded (48), after correction for bare glass. The total area of Cu-Ni films was measured by the physical adsorption of xenon at — 196°C (70) in addition, the chemisorption of hydrogen on the same samples enabled the quantity a to be determined where... [Pg.138]

The yield of HAs in food systems is affected by the concentration of substrates, enhancers and inhibitors, duration and temperature of heating, water activity, and pH. Some HAs are formed in mixtures of substrates heated for several weeks at relatively low temperature, about 37 to 60°C at 150 to 200°C the rate of reaction is much higher. However, in model systems prolonged heating may also bring about a decrease of the concentration of some HAs. Low water activity in the surface layers of the heated products favors the formation of HAs. In presence of lipids, Fe, and Fe, the rate of reaction increases, probably due to oxidation and generation of radicals (Jagerstad et ah, 2000). [Pg.295]

OP - solvent, substrate heat AP - h2o2 cool OP - solvent, product... [Pg.443]

Chemical and physical vapor deposition technique has been widely applied for the preparation of such photocatalytic thin films. Since these vapor methods need an instrumental setup which enables control of temperature and pressure, their initial and running costs are generally high and the size of substrate is limited. Spray method, in which titanium alkoxide and water is sprayed on a substrate heated at a desired temperature, affords Ti02 thin films.69) However, like the sol-gel route, the physical properties and photocatalytic activity of Ti02 strongly depend on many factors such as temperature of substrate, flow rate of carrier gas, and partial pressure of starting material in the system. [Pg.212]

The high vapor pressure of Zn allows even metallic mode operation without reactive gas baffling since desorption of surplus Zn can be achieved by sufficient substrate heating. The feasibility of this approach has been shown using high-rate reactive MF sputtering for ZnO Al films with a resistivity of 300 pXl cm at a growth rate of 9 nms-1. The process parameters are summarized in Table 5.2 [51]. [Pg.205]

The phthalimide anion is a strong nucleophile, displacing a halide or tosylate ion from a good Sn2 substrate. Heating the /V-alkyl phthalimide with hydrazine displaces the primary amine, giving the very stable hydrazide of phthalimide. [Pg.923]

The catalyst derived from hindered phosphine 6 also is effective in the arylation of primary aliphatic amines with aryl bromides, Eq. (77). Although this system is capable of mediating such a reaction at room temperature, with more hindered substrates, heating is required [42 a, 48]. [Pg.164]

Silicon carbide can be made by chemical vapor deposition on a substrate heated to around 1300°C (DeBolt et al, 1974). The substrate can be tungsten or carbon. The reactive gaseous mixture contains hydrogen and alkyl silanes. Typically, a gaseous mixture consisting of 70% hydrogen and 30% silanes is introduced at the... [Pg.159]


See other pages where Substrate Heating is mentioned: [Pg.390]    [Pg.390]    [Pg.135]    [Pg.50]    [Pg.207]    [Pg.16]    [Pg.77]    [Pg.546]    [Pg.374]    [Pg.738]    [Pg.16]    [Pg.77]    [Pg.131]    [Pg.53]    [Pg.134]    [Pg.443]    [Pg.50]    [Pg.443]    [Pg.522]    [Pg.628]    [Pg.533]    [Pg.355]    [Pg.22]    [Pg.237]    [Pg.211]    [Pg.51]    [Pg.425]    [Pg.188]    [Pg.207]    [Pg.202]    [Pg.311]    [Pg.273]    [Pg.340]    [Pg.272]    [Pg.87]    [Pg.611]    [Pg.82]    [Pg.22]   
See also in sourсe #XX -- [ Pg.77 , Pg.78 , Pg.79 , Pg.80 ]

See also in sourсe #XX -- [ Pg.77 , Pg.78 , Pg.79 , Pg.80 ]




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