Physical vapor deposition films

The epitaxy reactor is a specialized variant of the tubular reactor in which gas-phase precursors are produced and transported to a heated surface where thin crystalline films and gaseous by-products are produced by further reaction on the surface. Similar to this chemical vapor deposition (CVE)) are physical vapor depositions (PVE)) and molecular beam generated deposits. Reactor details are critical to assuring uniform, impurity-free deposits and numerous designs have evolved (Fig. 22) (89). 

Diserens, M., Patscheider, J., and Levy, F., "Mechanical Properties and Oxidation Resistance of Nanocomposite TiN-SiN Physical-Vapor-Deposited Thin Films, Surf. Coat. Technol,Vol. 120 Ill, 1999,65. 

Electrocatalytic activity of supported metal particles has been investigated on surfaces prepared in an ultrahigh vacuum (UHV) molecular beam epitaxy system (DCA Instruments) modified to allow high throughput (parallel) synthesis of thin-film materials [Guerin and Hayden, 2006]. The system is shown in Fig. 16.1, and consisted of two physical vapor deposition (PVD) chambers, a sputtering chamber, and a surface characterization chamber (CC), all interconnected by a transfer chamber (TC). The entire system was maintained at UHV, with a base pressure of 10 °mbar. Sample access was achieved through a load lock, and samples could be transferred... 

Bhattacharya, R. N. Balcioglu, A. Ramanathan, K. 2001. Deep-level transient spectroscopy (DLTS) of CdS/CuIni xGaxSe2-based solar cells prepared from electroplated and auto-plated precursors, and by physical vapor deposition. Thin Solid Films 384 65-68. 

Thin-Film Deposition Physical Vapor Deposition (sputtering, pulsed laser)... 

Thermal spray, laser deposition, physical vapor deposition, and magnetron sputtering are physical processes that are used for fabrication of electrolyte thin films. Sputtering is a reliable technique for film deposition and is being used in industry... 

Increased control of film composition, structure and size can be achieved by limiting the rate of reaction. This is possible using gas phase deposition where the amount of reactant is relatively low. Gas phase deposition loosely covers any hybridization strategy where at least one of the hybrid components is in the gas phase. This includes chemical vapor deposition (CVD), physical vapor deposition (PVD) and atomic layer deposition (ALD) as well as various plasma, sputtering and evaporation processes. 

Direct metal deposition from metallic sources has been extensively used for model catalyst deposition for high-throughput and combinatorial studies. However, these methods are also increasingly used to deposit practical electrocatalyst materials. The best known approach is the one developed by 3M researchers have used physical vapor deposition to deposit Pt and Ft alloys onto nanostructured (NS) films composed of perylene red whiskers. The approach has been recently been reviewed by Debe. ... 

Saha et al. [109] have proposed an improved ion deposition methodology based on a dual ion-beam assisted deposition (dual IBAD) method. Dual IBAD combines physical vapor deposition (PVD) with ion-beam bombardment. The unique feature of dual IBAD is that the ion bombardment can impart substantial energy to the coating and coating/substrate interface, which could be employed to control film properties such as uniformity, density, and morphology. Using the dual lABD method, an ultralow, pure Ft-based catalyst layer (0.04-0.12 mg Ft/cm ) can be prepared on the surface of a GDL substrate, with film thicknesses in the range of 250-750 A. The main drawback is that the fuel cell performance of such a CL is much lower than that of conventional ink-based catalyst layers. Further improvement... 

In physical vapor-deposited as well as sputter-deposited films, incorporated gases can also increase stress and raise annealing temperatures. Similar effects are present in electron beam-evaporated films. 

The adsorption of alkyl and aryl isocyanides on Au film [26, 32, 33], powder [36, 37] and nanoparticles [39, 41, 42] has been studied using several different techniques IR methods (RAIR, ATR-IR, DRIFT), Raman methods (SERS), X-ray methods (NEXAFS), ellipsometry (OE, SWE) and contact angle measurements (ACA). The gold surface is not oxidized under normal conditions consequently, the experiments were performed in air at room temperature. The gold film was obtained by physical vapor deposition of 100-200 nm of gold on different substrates glass [28, 33], mica [33], silicon [25, 27, 31, 32], ZnSe crystal [26]. A... 

Physical Vapor Deposition Processes. The three physical vapor deposition (PVD) processes are evaporation, ion plating, and sputtering (see Thin films, film formation techniques). 

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