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Semiconductors electronic applications

Nanoscale materials are those with dimensions less than 100 nm. Most of the nanomaterials used, such as oxides, sulfides, nitrides, and others are well known, in many cases since the beginning of civilization. In recent decades, it has been observed that specific properties of these materials, useful in biomedical, electromagnetic, mechanical, and catalytic areas," can be enhanced by reducing particle size to nanoscale dimensions. Many synthetic strategies have been developed in order to obtain nanometric materials with specific properties. Thin films of powders, in particular, have been the subject of current investigations. Studies of new synthetic approaches for nanometric films are intimately connected with the development of the chemical vapor deposition technique, which has widespread acceptance and is used for the production of important supplies for semiconductor electronic applications. ... [Pg.285]

Thermal oxidation of the two most common forms of single-crystal silicon carbide with potential for semiconductor electronics applications is discussed 3C-SiC formed by heteroepitaxial growth by chemical vapour deposition on silicon, and 6H-SiC wafers grown in bulk by vacuum sublimation or the Lely method. SiC is also an important ceramic ana abrasive that exists in many different forms. Its oxidation has been studied under a wide variety of conditions. Thermal oxidation of SiC for semiconductor electronic applications is discussed in the following section. Insulating layers on SiC, other than thermal oxide, are discussed in Section C, and the electrical properties of the thermal oxide and metal-oxide-semiconductor capacitors formed on SiC are discussed in Section D. [Pg.121]

For semiconductor electronic applications, thermal oxides on SiC are employed as a masking material for ion implantation and dry etching, as a gate insulator for field-effect devices, and as a surface passivation. Oxidation can also be used to etch the surface of SiC, as well as for polarity determination and for the delineation of defects and boundaries in SiC [1]. The slow oxidation rate of deposited SiC has been used for local oxidation inhibition of silicon [2]. [Pg.121]

Electronic Applications. The PGMs have a number of important and diverse appHcations in the electronics industry (30). The most widely used are palladium and mthenium. Palladium or palladium—silver thick-film pastes are used in multilayer ceramic capacitors and conductor inks for hybrid integrated circuits (qv). In multilayer ceramic capacitors, the termination electrodes are silver or a silver-rich Pd—Ag alloy. The internal electrodes use a palladium-rich Pd—Ag alloy. Palladium salts are increasingly used to plate edge connectors and lead frames of semiconductors (qv), as a cost-effective alternative to gold. In 1994, 45% of total mthenium demand was for use in mthenium oxide resistor pastes (see Electrical connectors). [Pg.173]

D. B. Holt and D. C. Joy. SEM Microcharacterization of Semiconductors. Academic Press, London, 1989. A detailed examination of the applications of the SEM to semiconductor electronics. [Pg.84]

Silicon in the elemental state has important electronic applications as a semiconductor that were developed only during the last decade. The discovery of these uses was possible only after methods were developed for preparing silicon of extremely high purity. Reduction of Si02 with... [Pg.373]

Metallo-organic CVD (MOCVD) is a specialized area of CVD, which is a relatively newcomer, as its first reported use was in the 1960s for the deposition of indium phosphide and indium anti-monide. These early experiments demonstrated that deposition of critical semiconductor materials could be obtained at lower temperature than conventional thermal CVD and that epitaxial growth could be successfully achieved. The quality and complexity of the equipment and the diversity and purity of the precursor chemicals have steadily improved since then and MOCVD is now used on a large scale, particularly in semiconductor and opto-electronic applications.91P1... [Pg.84]

CVD in Electronic Applications Semiconductors 347 2.1 Conductors, Semiconductors, and Insulators... [Pg.347]

Undoubtedly, these devides can still by far not compete with semiconductor electronic elements but the rapid improvement of the concept together with the potential development of better and more versatile organic polymers may allow applications in near future. [Pg.78]

Nanocrystals are receiving significant attention for nano-electronics application for the development of future nonvolatile, high density and low power memory devices [1-3]. In nanocrystal complementary metal oxide semiconductor (CMOS) memories, an isolated semiconductor island of nanometer size is coupled to the channel of a MOS field effect transistor (MOSFET) so that the charge trapped in the island modulates the threshold voltage of the transistor (Fig. 1). [Pg.71]

Semiconductors have a considerably smaller band gap (e.g. silicon 1.17 eV). Their conductivity, which is zero at low temperatures but increases to appreciable values at higher temperatures, depends greatly on the presence of impurities or, if added advertently, dopants. This makes it possible to manipulate the band gap and tune the properties of semiconductors for applications in electronic devices [C. Kit-tel. Introduction to Solid State Physics (1976), Wiley Sons, New York N. Ashcroft and N.D Mermin, Solid State Physics (1976), Saunder College]. [Pg.233]

The wide use of p-block and early transition metal chalcogenide materials for electronics applications (semiconductors, semi-metals, battery materials, etc.) has resulted in a large amount of work concerned with CVD using mixtures of metal halides and chalcogenoethers as dual source precursors and preformed complexes as single sources.166... [Pg.99]

The results of the electron theory as developed for semiconductors are fully applicable to dielectrics. They cannot, however, be automatically applied to metals. Contrary to the case of semiconductors, the application of the band theory of solids to metals cannot be considered as theoretically well justified as the present time. This is especially true for the transition metals and for chemical processes on metal surfaces. The theory of chemisorption and catalysis on metals (as well as the electron theory of metals in general) must be based essentially on the many-electron approach. However, these problems have not been treated in any detail as yet. [Pg.191]

Gallium arsenide is produced in polycrystaUine form as high purity, single crystals for electronic applications. It is produced as ingots or alloys, combined with indium arsenide or gallium phosphide, for semiconductor apphcations. [Pg.310]

The re arch in catalysis is still one of the driving forces for interface science. One can certainly add to the topics of interface physics the whole new field of interface problems that is about to spring out of the new high Tc superconducting ceramics, i.e. the fundamental problem of the matching of the superconducting carriers wave-functions with the normal state metal or semiconductor electron states, the super-conductor-superconductor interfaces and so on, as well as the wide open discovery field for devices and applications. [Pg.97]

W. Shoddey, Electrons and Holes in Semiconductors with Applications to Transistor Electronics, D. Van Nostrand Co., Inc., Princeton, N.J., 1950. [Pg.355]

ZnO. - Zinc oxide is a widely used semiconductor with applications in electrochemistry, photochemistry and photocatalysis. The charge carrier states produced by thermal or radiative treatment, particularly the mobile electrons, are easily trapped as paramagnetic defects at the surface of the material, and can therefore be characterised by EPR. However, unlike the situation discussed earlier for Ti02 (section 3.1) and Zr02 (section 3.2) semiconductors, once again there have been very few EPR studies carried out on ZnO in the past two years.166-167... [Pg.306]

Two types of ion source produce high enough brightness (> 106 A/cm2.ster., 20 keV) for them to be considered for semiconductor fabrication applications the field ion source (56) and the liquid metal source (57,58). The field ion source produces relatively small energy spread (<3 eV) and when combined with a short focal length (< 1 cm) electrostatic focusing system should be able to produce beam sizes as small as 10 nm with adequate current (10-11 amp) for laboratory microfabrication experiments. As with field emission electron sources, the field ion source only produces a limited total current and the maximum beam current is limited to about 1 10 amp. [Pg.35]


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