Hybrid integrated circuits

M. Pecht, Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines M Focus on Keliability,]ohxi Wiley Sons, Inc., New York, 1994. 

The first specifications for adhesives were generated by the staff of NASA and the DoD who were prompted by the high reliability that was required of microcircuits used in aerospace programs. These specifications covered primarily die and substrate attachments for hermetically sealed integrated circuits, hybrid microcircuits, and multichip modules. Subsequently, with the increased use of surface-mount adhesives in the assembly of commercial printed-wiring boards and underfills for flip-chip devices, industry associations took the lead in generating the requirements and test methods. 

Applications and uses electronics circuit boards, sensors, integrated circuits/hybrids, MEM devices, motor assemblies, coil forms, silicon wafers medical needles, prosthetic devices. 

Pecht, M. 1994. Integrated Circuit, Hybrid, and Mutichip Module Package Design Guidelines—A Focus on Reliability. John Wiley and Sons, New York. 

Electronic Applications. The PGMs have a number of important and diverse appHcations in the electronics industry (30). The most widely used are palladium and mthenium. Palladium or palladium—silver thick-film pastes are used in multilayer ceramic capacitors and conductor inks for hybrid integrated circuits (qv). In multilayer ceramic capacitors, the termination electrodes are silver or a silver-rich Pd—Ag alloy. The internal electrodes use a palladium-rich Pd—Ag alloy. Palladium salts are increasingly used to plate edge connectors and lead frames of semiconductors (qv), as a cost-effective alternative to gold. In 1994, 45% of total mthenium demand was for use in mthenium oxide resistor pastes (see Electrical connectors). 

Many of these steps include CVD, and CVD is now a major process in the fabrication of monolithic integrated circuits (IC), custom and semi-custom ASIC s, active discrete devices, transistors, diodes, passive devices and networks, hybrid IC s, opto-elec-tronic devices, energy-conversion devices, and microwave devices. 

Polina R.J., Klainer S.M., A field-hardened, optical waveguide hybrid integrated-circuit, multi-sensor chemical probe and its chemistry, Proc. SPIE-Int. Soc. Opt. Eng. 1997 3105 71... 

Most microhotplate-based chemical sensors have been realized as multi-chip solutions with separate transducer and electronics chips. One example includes a gas sensor based on a thin metal film [16]. Another example is a hybrid sensor system comprising a tin-oxide-coated microhotplate, an alcohol sensor, a humidity sensor and a corresponding ASIC chip (Application Specific Integrated Circuit) [17]. More recent developments include an interface-circuit chip for metal oxide gas sensors and the conccept for an on-chip driving circuitry architecture of a gas sensor array [18,19]. 

The silicon substrate is removed while the temporary substrate provides mechanical support. Next, the substrate is bonded to a final carrier substrate 54 with a layer 52 of epoxy adhesive. The bonding layer 48 is removed, which also removes the temporary carrier substrate 50. The final carrier substrate is chosen according to the same criteria as described in the first embodiment. Processing continues by forming indium interconnects 34b for later hybridization of the read-out integrated circuit assembly with a detector array. 

However, its bine chloride solntion had been previously observed by Vauquehn in Paris in 1804. Rnthenium is the least abundant platinum metal (10 to 10 ppm) after rhodium. In 2002, the demand for ruthenium was 11.6 tons, an increase of 1.8 tons compared to 2001, mainly becanse of increased sales of rnthenium paste to the electronics industry, for the manufacture of chip resistors and hybrid integrated circuits (HIC). Its atomic number is 44, its atomic weight 101.07, and its electronic configuration [Kr]4d 5s. Seven stable isotopes are known. Some physical data are reported in Table 1 (see Coordination Chemistry History mA Coordination Numbers Geometries). 

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