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Polyurethanes thermal

ASTM C 591-85 Standard Specification for Unfaced Preformed Rigid Cellular Polyurethane Thermal Insulation, 4 pp (DOD Adopted) (FSC 5640) (YD) (Comm C-16)... [Pg.401]

Sandwich panel with 1-mm skin of black-finished trapezoidal steel sheet with core of polyurethane thermal insulation covered with trapezoidal aluminium sheet of 1 mm in thickness 50 0.7... [Pg.202]

In any discussion of polyurethane thermal-oxidative resistance, fundamental consideration must be given to the fact that re-cleavage or reversion at high temperatures counteracts polyurethane formation at lower temperatures, creating an equilibrium reaction. However, it is possible to heat polyurethanes temporarily, e.g., as part of a short-circuit test, to much higher temperatures without destroying them, because it takes time for re-cleavage equilibrium to set in [513]. [Pg.668]

Polyurethane thermal-oxidative resistance depends on the polyurethane structure and in particular on the structure of the polyol [186]. Soft-flexible standard polyurethane foams have a temperature index of approx. 90 to 120 °C the temperature index for semi-rigid systems is approx. 120 to 140 °C. These numbers can be 10 to 20 °C higher in filled systems [513]. [Pg.668]

Siace the pores ia an aerogel are comparable to, or smaller than, the mean free path of molecules at ambient conditions (about 70 nm), gaseous conduction of heat within them is iaefficient. Coupled with the fact that sohd conduction is suppressed due to the low density, a siUca aerogel has a typical thermal conductivity of 0.015 W/(m-K) without evacuation. This value is at least an order of magnitude lower than that of ordinary glass and considerably lower than that of CFC (chloro uorocarbon)-blown polyurethane foams (54). [Pg.6]

The thermal degradation of mixtures of the common automotive plastics polypropylene, ABS, PVC, and polyurethane can produce low molecular weight chemicals (57). Composition of the blend affected reaction rates. Sequential thermolysis and gasification of commingled plastics found in other waste streams to produce a syngas containing primarily carbon monoxide and hydrogen has been reported (58). [Pg.232]

Polyurethane. SmaU quantities of polyurethane film are produced as a tough mbber-like film. Polyurethane is more commonly used to produce foamed sheet, both flexible and rigid. The flexible foam is used as cushioning in furniture and bedding the rigid foam is widely used for architectural insulation because of its outstanding thermal insulation efficiency (see Urethane POLYMERS). [Pg.378]

Pentabromodiphenyl Oxide. Pentabromodiphenyl oxide [32534-81-9] (PBDPO) is prepared from diphenyl oxide by bromiaation (36). It is primarily used as a flame retardant for flexible polyurethane foams. For this appHcation PBDPO is sold as a blend with a triaryl phosphate. Its primary benefit ia flexible polyurethanes is superior thermal stabiUty, ie, scorch resistance, compared to chloroalkyl phosphates (see Phosphate esters). [Pg.468]

The thermal conductivity of a cellular polymer can change upon aging under ambient conditions if the gas composition is influenced by such aging. Such a case is evidenced when oxygen or nitrogen diffuses into polyurethane foams that initially have only a fluorocarbon blowing agent in the cells (32,130,143,190,191,198-201). [Pg.414]

In a study (206) of the moisture gain of foamed plastic roof insulations under controlled thermal gradients the apparent permeabiUty values were greater than those predicted by regular wet-cup permeabiUty measurements. The moisture gains found in polyurethane are greater than those of bead polystyrene and much greater than those of extmded polystyrene. [Pg.415]

CeUular polymers are also used for pipe and vessel insulation. Spray and pour-in-place techniques of appHcation are particularly suitable, and polyurethane and epoxy foams are widely used. Ease of appHcation, fire properties, and low thermal conductivity have been responsible for the acceptance of ceUular mbber and ceUular poly(vinyl chloride) as insulation for smaller pipes. [Pg.416]

The sandwich-type stmcture of polyurethanes with a smooth integral skin produced by the reaction injection molding process provides a high degree of stiffness as weU as exceUent thermal and acoustical properties necessary for its use in housing and load-bearing stmctural components for the automotive, business machine, electrical, furniture, and materials-handling industry. [Pg.416]

Uses. Neopentyl glycol is used extensively as a chemical intermediate in the manufacture of polyester resins (see Alkyd resins), polyurethane polyols (see Urethane polymers), synthetic lubricants, polymeric plasticizers (qv), and other polymers. It imparts a combination of desirable properties to properly formulated esterification products, including low color, good weathering and chemical resistance, and improved thermal and hydrolytic stabiUty. [Pg.372]

A variety of cellular plastics exists for use as thermal iasulation as basic materials and products, or as thermal iasulation systems ia combination with other materials (see Foamed plastics). Polystyrenes, polyisocyanurates (which include polyurethanes), and phenoHcs are most commonly available for general use, however, there is increasing use of other types including polyethylenes, polyimides, melamines, and poly(vinyl chlorides) for specific appHcations. [Pg.331]

Fig. 3. Aging effect on thermal conductivity of cellular plastics A, extmded polystyrene B, unfaced polyurethane C, unfaced phenolic and D, polyurethane... Fig. 3. Aging effect on thermal conductivity of cellular plastics A, extmded polystyrene B, unfaced polyurethane C, unfaced phenolic and D, polyurethane...
Polyurethane, PVC, and extruded polystyrene provide the bulk of the cellular plastics used for low and cryogenic temperature appHcations. In some cases, eg, the insulation of Hquid hydrogen tanks on space systems, foams have been reinforced with continuous glass fibers throughout the matrix. This improves strength without affecting thermal performance significantly. [Pg.336]

Thermosetting-encapsulation compounds, based on epoxy resins (qv) or, in some niche appHcations, organosiHcon polymers, are widely used to encase electronic devices. Polyurethanes, polyimides, and polyesters are used to encase modules and hybrids intended for use under low temperature, low humidity conditions. Modified polyimides have the advantages of thermal and moisture stabiHty, low coefficients of thermal expansion, and high material purity. Thermoplastics are rarely used for PEMs, because they are low in purity, requHe unacceptably high temperature and pressure processing conditions. [Pg.530]

Sihcones (qv) have an advantage over organic resias ia their superior thermal stabiUty and low dielectric constants. Polyurethanes, when cured, are tough and possess outstanding abrasion and thermal shock resistance. They also have favorable electrical properties and good adhesion to most surfaces. However, polyurethanes are extremely sensitive to and can degrade after prolonged contact with moisture as a result, they are not as commonly used as epoxies and sihcones (see Urethane polymers). [Pg.531]

Phosphoms compounds are effective flame retardants for oxygenated synthetic polymers such as polyurethanes and polyesters. Aryl phosphates and chloroalkyl phosphates are commonly used, although other compounds such as phosphonates are also effective. The phosphoms compounds can promote char formation, thereby inhibiting further ignition and providing an efficient thermal insulation to the underlying polymer. [Pg.373]


See other pages where Polyurethanes thermal is mentioned: [Pg.20]    [Pg.93]    [Pg.20]    [Pg.93]    [Pg.86]    [Pg.251]    [Pg.6]    [Pg.234]    [Pg.478]    [Pg.406]    [Pg.415]    [Pg.416]    [Pg.416]    [Pg.418]    [Pg.418]    [Pg.372]    [Pg.539]    [Pg.323]    [Pg.328]    [Pg.335]    [Pg.144]    [Pg.360]    [Pg.428]   


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