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Temperature polyurethane thermal

Figure 24. Effect of temperature on thermal conductivity (1 in thick specimens cut from 2 pcf rigid CFC-11 blown polyurethane foam)(213). Figure 24. Effect of temperature on thermal conductivity (1 in thick specimens cut from 2 pcf rigid CFC-11 blown polyurethane foam)(213).
In any discussion of polyurethane thermal-oxidative resistance, fundamental consideration must be given to the fact that re-cleavage or reversion at high temperatures counteracts polyurethane formation at lower temperatures, creating an equilibrium reaction. However, it is possible to heat polyurethanes temporarily, e.g., as part of a short-circuit test, to much higher temperatures without destroying them, because it takes time for re-cleavage equilibrium to set in [513]. [Pg.668]

Polyurethane thermal-oxidative resistance depends on the polyurethane structure and in particular on the structure of the polyol [186]. Soft-flexible standard polyurethane foams have a temperature index of approx. 90 to 120 °C the temperature index for semi-rigid systems is approx. 120 to 140 °C. These numbers can be 10 to 20 °C higher in filled systems [513]. [Pg.668]

Polyurethane, PVC, and extruded polystyrene provide the bulk of the cellular plastics used for low and cryogenic temperature appHcations. In some cases, eg, the insulation of Hquid hydrogen tanks on space systems, foams have been reinforced with continuous glass fibers throughout the matrix. This improves strength without affecting thermal performance significantly. [Pg.336]

Thermosetting-encapsulation compounds, based on epoxy resins (qv) or, in some niche appHcations, organosiHcon polymers, are widely used to encase electronic devices. Polyurethanes, polyimides, and polyesters are used to encase modules and hybrids intended for use under low temperature, low humidity conditions. Modified polyimides have the advantages of thermal and moisture stabiHty, low coefficients of thermal expansion, and high material purity. Thermoplastics are rarely used for PEMs, because they are low in purity, requHe unacceptably high temperature and pressure processing conditions. [Pg.530]

The avadabihty of PMDI also led to the development of polyurethane-modified isocyanurate (PUIR) foams by 1967. The PUIR foams have superior thermal stabiUty and combustibiUty characteristics, which extend the use temperature of insulation foams well above 150°C. The PUIR foams are used in pipe, vessel, and solar panel insulation glass-fiber-reinforced PUIR roofing panels having superior dimensional stabiUty have also been developed. More recently, inexpensive polyester polyols based on residues obtained in the production of dimethyl terephthalate (DMT) have been used in the formulation of rigid polyurethane and PUIR foams. [Pg.342]

Data on the thermal conductivity for a variety of foams used at cryogenic temperatures have been presented by Kropschot Cryogenic Technology, R. W. Vance, ed., Wiloy, New York, 1963, p. 239). Of aJl the foams, polyurethane and polystiyene have received the widest use at low temperatures. The major disadvantage of foams is that they tend to crack upon repeated thermal cychng and lose their insulation value. [Pg.1135]

These materials not only have a good resistance to burning and flame spread but are also able to withstand service temperatures of up to 150°C. At the same time polyisocyanurate foams have the very good hydrolytic stability and low thermal conductivity associated with rigid polyurethane foams. [Pg.805]

Block copolymers can contain crystalline or amorphous hard blocks. Examples of crystalline block copolymers are polyurethanes (e.g. B.F. Goodrich s Estane line), polyether esters (e.g. Dupont s Hytrel polymers), polyether amides (e.g. Atofina s Pebax grades). Polyurethanes have enjoyed limited utility due to their relatively low thermal stability use temperatures must be kept below 275°F, due to the reversibility of the urethane linkage. Recently, polyurethanes with stability at 350°F for nearly 100 h have been claimed [2]. Polyether esters and polyether amides have been explored for PSA applications where their heat and plasticizer resistance is a benefit [3]. However, the high price of these materials and their multiblock architecture have limited their use. All of these crystalline block copolymers consist of multiblocks with relatively short, amorphous, polyether or polyester mid-blocks. Consequently they can not be diluted as extensively with tackifiers and diluents as styrenic triblock copolymers. Thereby it is more difficult to obtain strong, yet soft adhesives — the primary goals of adding rubber to hot melts. [Pg.713]

Operating conditions are important determinants of the choice of filter media and sealant used in the cartridges. Some filter media, such as cellulose paper filters, are useful only at relatively low temperatures of 95 to 150"C (200 to 300°F). For high-temperature flue gas streams, more thermally stable filter media, such as nonwoven polyester, polypropylene, or Nomex, must be used. A variety of commercially available sealants such as polyurethane plastic and epoxy will allow fabric operating temperatures up tol50°C (300°F). Selected sealants such as heat cured Plasitcol will withstand operating temperatures up to 200°C (400°F). [Pg.415]

The R s of a fibrous or cellular insulation like those in Table 2 generally decrease as the temperature increases. In the case of closed-cell polymeric foams like polyurethane nr pnlyisncyanurate board, the R may decrease if the insulation temperature drops below the condensation temperature of the blowing agent in the cells. This is because of changes in the gas- phase composition and therefore the gas-phase thermal conductivity. The R of insulations also depends on density when all other factors are constant. The relationship bett een R and density... [Pg.676]

Thermal and thermomechanical analyses44 are very important for determining die upper and lower usage temperature of polymeric materials as well as showing how they behave between diose temperature extremes. An especially useful thermal technique for polyurethanes is dynamic mechanical analysis (DMA).45 Uiis is used to study dynamic viscoelastic properties and measures die ability to... [Pg.241]

Even though poly(ortho esters) contain hydrolytically labile Linkages, they are highly hydrophobic materiads and for this reason are very stable and can be stored without careful exclusion of moisture. However, the ortho ester linkage in the polymer is inherently thermally unstable and at elevated temperatures is believed to dissociate into an alcohol and a ketene acetal (33). A possible mechanism for the thermal degradation is shown below. This thermal degradation is similar to that observed with polyurethanes (34). [Pg.150]


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