Packaging structural development

Packages can be structured in many different ways. The separation of an interface from classes in separate packages provides a pattern for setting up the project package structure. Combined with consistent naming conventions, it makes certain aspects of the architecture very visible in the project development stmcture (see Section 7.4.1, Role-based Decoupling of Classes). 

Make your package structure reflect the separations needed across iterations so that different work products can be managed and developed separately. 

ANACONDA is a software package specially developed for the study of genes primary structure. It reads ORFeomes downloaded from public databases in FASTA format and uses a set of statistical and visualization methods to reveal information about codon context, codon usage, and nucleotide repeats within ORFs. The general features of ANACONDA are described below ... 

Guest MF, Bush IJ. Van Dam HJJ, et al. The GAMESS-UK electronic structure packages algorithms, developments, and applications. Mol Phys 2005 103 719-747. 

Remoistenable adhesives are applied as water-borne adhesives and then dried. When dry, they have little or no tack. To apply the tape or label to the box, bottle, or other package structure, water must be applied to reactivate the adhesive. Then the full strength of the bond will develop as the water is removed. Such adhesives are commonly used for adhering paper to paper or to other materials. 

Figure 11.34 shows that the plasticizer structure arrd its amoirrrt determine biodegradation rate of the plastieized polylaetate. Figtrre 11.35 shows that plasticizer increases the degradation rate on expostrre to seawater. This is irrrportarrt for products in packaging applications developed to reduee threat to the marine life. It is estimated that about 100,000 marine animals and about 1-2 million sea birds are killed yearly by the toxic residues of a plastic litter. 

Poly (ethylene terephthalate) (PET) is one of the most common polymers provided by the polymer industry for fiber and packaging purposes [24]. As far as polymer crystallization is concerned, PET can be considered as a paradigm of a crystallisable polymer due to the fact that PET can be obtained either in the amorphous state or with a controlled amount of ciystalUnity. Therefore, PET has been used to study the influence of crystallinity in a great variety of physical properties including thermal behavior [16,25-29], structure development [30-33] and mechanical and dielectric behavior among others [13,14,34,35]. Figure 21.7 presents the dielectric loss, e", and dielectric constant, e, for amorphous PET at T > 7 as a function of frequency for different temperatures. 

This package was developed jointly by representatives from the chemical industry (CEFIC) and the distributing industry (FECC—European Federation of Chemical Distributors—http //www.fecc/org/). In contrast with other SQAS documents, this document is structured around the 8 Guiding Principles of the Responsible Care/Distribution Programme of the International Council of Chemical Trade Associations (ICCTA). These Principles and the corresponding 52 self-assessment questions have been made more explicit by integrating a number of more detailed questions. This makes it possible ... 

Highly accurate and versatile thermal measurements, in addition to modeling efforts, are indispensable to ensure optimal thermal design and performance of solid-state devices and VLSI-based packaging structures. The need for a systematic analysis of flexibUity, sensibiUty, and reproducibihty of current methods and development of appropriate method(s) for thermal characterization of packages and assembhes is widely recognized (Oettinger and Blackburn, 1990). 

This layer provides the necessary structural support and electrical and optical excitation for the sensor to operate. It includes such devices as LEDs, optical fibers, lasers, power supply and electrical driver circuitry included in a robust package. The development of this sensor layer involves understanding the basic properties of optoelectronic and microelectronic materials and devices for low-power, efficient and high speed devices. Power consumption is a major issue here since the conversion from electrical to optical power for subsequent pumping of the sensing layer is one of the least efficient processes in the integrated system. 

Microelectronic packaging assemblies typically consist of stacked layers of materials with dissimilar material properties. When such packaging structures are fabricated, assembled, and used, they are subjected to a wide range of thermal excursions. Under such thermal excursions, thermally-induced stresses develop in various parts of the microelectronic packaging assembly due to the coefiBcient of thermal expansion (CTE) mismatch among the dissimilar materials, and the microelectronic packaging assembly could prematurely fail, if not carefully designed. 

Structural development operates from an input of policy guidelines, product and market criteria uses technical tools and skills to make and evaluate test packs against predetermined protective needs and produces, as output, specifications for economic solutions to the choice of packaging options (primary, secondary and tertiary) as required. 

---