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Microelectronic packaging

R. R. Tummala and E. J. Rymas2ewski, Microelectronics Packaging Handbook, Van Nostrand Reinhold, New York, 1989. [Pg.316]

F. N. Sinnadurai, Handbook of Microelectronics Packaging and Interconnection Technologies, Electrochemical Pubhcations Limited, 1985, p. 8. [Pg.194]

R. W. Biemath and D. S. Soane, Cure Kinetics of Epoxy Cresol Novolac Encap-sulant for Microelectronic Packaging, in Contemporary Topic in Polymer Science. Advances in New Material. Vol. 7, J. S. Salamone and J. S. Riffle (Eds.), Plenum, New York, 1992, pp. 103-160. [Pg.428]

Tummola RR, Rymaszewski EJ, Klopfenstein AG (1997) Microelectronics packaging handbook, semiconductor packing, part II, 2nd edn. Chapman and Hall ITP, NY... [Pg.106]

Epoxy-silicone hybrid resins (Fig. 7.4) have generally been developed for use in the molding of microelectronic packages. These resins have moderate strength but exhibit a degree of elongation of about 60 percent at break. [Pg.135]

Currently commercial installations of inorganic membranes in gas- and vapor-phase applications besides the isotope separation are mostly in the area of particulate filtration, although there have been very limited cases of separation of gaseous mixtures reported. Removal of fine particles from gas streams can be achieved by means of porous inorganic membranes. The major challenge, however, lies in the strict requirements in some of the commercial applications. This is the case in microelectronic packaging and some food and pharmaceutical processes where clean air is needed. [Pg.250]

R. Berriche, D.L. Kohlstedt, Mater. Dev. Microelectron. Packag. Perform. Reliab., Proc. Electron. Mater. Process. Congr., 4th 1991, p. 47... [Pg.191]

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Microelectronic

Microelectronics

Microelectronics packaging

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