Robustness packaging

Components can be treated as robustly packaged objects.25 This might mean that a component comes with a test kit, that it is designed to be fairly defensive against its interlocutors that do not observe the documented preconditions, that it executes in its own space, and that it can cope with intermittent failure of its neighbors. All the principles we have discussed hitherto are therefore just as applicable within a single programming space as they are between objects that are distributed all over the planet. 

Both mechanical and thermal durability requirements favor a circular contour for the filter, since it lends itself to robust packaging and at the same time experiences less severe temperature gradients during regeneration. Furthermore, circular filters are easier to manufacture and control tolerances, making them more cost effective than noncircular contours. Indeed, the latter have also been manufactured for special applications where space constraint is the dominating factor. 

The primary objective of designing a ceramic preconverter system for light-otf application has been met by proper selection of cordierite composition, cell geometry, substrate contour, size and volume, high temperature durable mat, and a robust packaging design. 

This layer provides the necessary structural support and electrical and optical excitation for the sensor to operate. It includes such devices as LEDs, optical fibers, lasers, power supply and electrical driver circuitry included in a robust package. The development of this sensor layer involves understanding the basic properties of optoelectronic and microelectronic materials and devices for low-power, efficient and high speed devices. Power consumption is a major issue here since the conversion from electrical to optical power for subsequent pumping of the sensing layer is one of the least efficient processes in the integrated system. 

A substrate is a robust element that provides mechanical support for the die. It can be mounted with more than one die such packages are called multichip modules. Because parasitic capacitance effects are directiy proportional to the dielectric constant, substrate material should have a low dielectric constant. 

Baird [Comp. Chem. Engng., 9, 593 (1985)]. Since then, they have been applied successfully to problems involving interlinked distillation (Wayburn and Seader, op. cit.), azeotropic and three-phase distillation [Kovach, 111 and Seider, Comp. Chem. Engng., 11,593(1987)], and reac tive distillation [Chang and Seader, Comp. Chem. Engng., 12, 1243 (1988)], when SC and inside-out methods have failed. Today, many computer-aided distillation-design and simulation packages include continuation techniques to make the codes more robust. 

A great variety of PVC materials have been tested in the process thus far cable, cable trays, flooring material, window frames, artificial leather, packaging, pipes, flexible hoses, ring binders and roofing material. This indicates that the process is robust and can handle a broad range of PVC materials. In terms of chlorine content, there are no restrictions. With the completion of the pretreatment pilot plant, the contents of other plastics and metals may now be reduced significantly. 

The standard deviation, Sj, is the most commonly used measure of dispersion. Theoretically, the parent population from which the n observations are drawn must meet the criteria set down for the normal distribution (see Section 1.2.1) in practice, the requirements are not as stringent, because the standard deviation is a relatively robust statistic. The almost universal implementation of the standard deviation algorithm in calculators and program packages certainly increases the danger of its misapplication, but this is counterbalanced by the observation that the consistent use of a somewhat inappropriate statistic can also lead to the right conclusions. 

If basic assumptions concerning the error structure are incorrect (e.g., non-Gaussian distribution) or cannot be specified, more robust estimation techniques may be necessary. In addition to the above considerations, it is often important to introduce constraints on the estimated parameters (e.g., the parameters can only be positive). Such constraints are included in the simulation and parameter estimation package SIMUSOLV. Beeause of numerical inaccuracy, scaling of parameters and data may be necessary if the numerical values are of greatly differing order. Plots of the residuals, difference between model and measurement value, are very useful in identifying systematic or model errors. 

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