Integrated passive component

Wersing, W. et al. (1999) Integrated passive components using low temperature cofired ceramics, SPIE 3582, 193-9. 

In addition to the multilevel metallization and formation of interconnects, anodic processing of A1 was employed for the fabrication of integrated passive components thin film capacitors and inductors.56,57 For example, localized porous-type anodization of A1 films was used to convert 20- am-thick A1 to the dielectric layer of porous AI2O3 and to define metal-dielectric-metal structures.56 The... 

Nappi, L., Rapelo, I, Pohjonen, H., Holloway, P., and Ristolainen, E., Integrating Passive Components with Thin-Film Deposition, HDI, July 2000, pp. 38-48. 

Compared with printed resin boards, LTCCs are superior from the three aspects ofhigh frequency characteristics, thermal stability, and their capacity for integrating passive components. They are also well suited to integrated substrates and electronic components for high frequency applications. 

As described above, development of small high frequency devices and circuit boards with a variety of integrated passive components has been proceeding at a rapid pace, while the requirements and specifications for the electrical characteristics, size and cost of the devices have been getting ever more demanding. 

To summarize LTCC, it offers systems designers a tool of considerable flexibility for packaging electronic systems. The potential for integrating passive components to save space and to tailor dielectric constant and expansion coefficient are a few of the possibilities this technology offers. 

The constant drive to miniaturize components for communications devices is stimulating efforts to develop LTCC technology into three dimensional circuitry in which passive components (resistors, capacitors and inductors) are packaged into the structure with the active, integrated circuits, bonded to the outer surface. The technology is reviewed by W. Wersing et al. [18]. 

As in electronics in integrated optics, one has to distinguish between passive and active waveguiding components. A simple waveguide is a passive component. Active components enable controlled variations of the guided wave to be performed with respect to phase, amplitude, frequency, polarisation and direction of propagation. All these active components are either modulators or light emitters and amplifiers and detectors. 

The fabrication of rare-earth-doped optical fibers with a wide bandwidth gain have pushed the development of optical fiber amplifiers. This large bandwidth together with the low pump power requirements facilitated the realization of passively mode-locked femtosecond fiber lasers. The advantages of such fiber lasers are their compact setup with highly integrated optical components, their reliability, and their pre-alignment, which makes their daily operation more convenient [709]. 

However, there has been some discussion as to whether these gel electrolytes are indeed simple two-phase materials where the polymer is a passive component acting as a rigid framework for regions of liquid solutions or whether they are integrated systems where the polymer provides the stability of the gel network down to the immediate vicinity of the Li"" ions [61]. Recent papers reporting NMR [62, 63] and Raman [64-66] spectroscopy studies show that some interactions do occur between the polymer backbone and the electrolyte solution, to an extent that depends upon the nature of the two components. 

This safety function is ensured by protecting and maintaining the integrity of the potential radioactivity release barriers (fuel, reactor system boundary and containment). These barriers are passive components as themselves in addition, several passive means are proposed in V-392 design for the protection of these barriers (some of them are reflected above). The V-392 design implies substantial improvement of the containment protection against different loads related to design basis and severe accidents, and various passive systems are important part of this protection. 

Barium titanate. The continuous miniaturization of integrated electronic devices forces to manufacture active and passive components of smaller size, including multilayer capacitors (MLCCs) [285,286]. This accounts for a significant breakthrough in the synthesis of ultrafine BaTiOs powders in recent years [287]. 

The method of deposition is what differentiates the hybrid circuit from other packaging technologies and may be one of two types thick film or thin film. Other methods of metallizing a ceramic substrate, such as direct bond copper, active metal brazing, and plated copper, may also be considered to be in the hybrid family, but do not have a means for directly fabricating resistors and are not considered here. Semiconductor technology provides the active components, such as integrated circuits, transistors, and diodes. The passive components, such as resistors, capacitors, and inductors, may also be fabricated by thick- or thin-film methods or may be added as separate components. 

Active component An electronic component that can alter the waveshape of an electronic signal, such as a diode, a transistor, or an integrated circuit. By contrast, ideal resistors, capacitors, and inductors leave the waveform intact and are referred to as passive components. 

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