Low-temperature cofired ceramic

Jantunen, H. et al. (2000) Preparing low-loss low-temperature cofired ceramic material without glass addition, J. Am. Ceram. Soc. 83, 2855-7. 

Wersing, W. et al. (1999) Integrated passive components using low temperature cofired ceramics, SPIE 3582, 193-9. 

A DIRECT METHANOL FUEL CELL USING CERMET ELECTRODES IN LOW TEMPERATURE COFIRE CERAMICS... 

A Direct Methanol Fuel Cell Using Cermet Electrodes in Low Temperature Cofire Ceramics... 

MCM-C interconnect substrates are produced from either low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC). Either process can produce multilayer substrates having high numbers of conductor layers (up to 100), although for most applications 2-20 layers are sufficient. The fabrication of MCM-C involves thick-film processes that have wider lines and spacings (5-20 mils) than MCM-D, but are lower in cost. 

Photodiode Band-pass filters 125 X 125 Peristaltic pump Low- temperature cofired ceramic (LTCC) Dye (Pcmceau IV) 10 ng / ml Spectrofluorometry spectro 4iotometry... 

The chips themselves are most commonly made from SU-8 molds and polydimethylsUoxane (PDMS) which is a silicon-based organic polymer. It is optically clear, inert, and nontoxic, which makes it well suited for lab-(Mi-a-chip applications. Other glasses, silicon wafers, and acrylics have also been used. Recently, Golrmka et al. have used low-temperature cofired ceramic (LTCC) technology to produce electrical, optical, and fluidics within an LOC structure (Table 1, 10th and 11th rows) [10, 11]. 

PDMS, poly dimethylsilozane) PET, poly(ethylene terephthalate) PC, polycarbonate PMMA, poly(methyl methacrylate) PVC, poly(vinyl chloride) LTCC, low-temperature cofirable ceramics MES, 2-morpholinoethanesulfonic acid SDS, sodium dodecyl... 

Figure 1.3 shows an example module with thin-film interconnects on a low-temperature cofired ceramic (LTCC) substrate [32]. This module measures 81 X 55 X 1.88 mm and has a 14-layer cofired LTCC substrate with silver conductor and 6-layer thin-film interconnects (three on the top and three on the bottom) using Ti/Cu and benzocyclobutane (BCD) structure. A microprocessor is connected to 2 memory chips and over 140 passive components through about 4000 nets. 

Thermal vias in low-temperature cofired ceramic (LTCC) are fabricated in the same manner with the same constraints as in multilayer thick films. The only difference is the formulation of the via-fill material. 

Low-Temperature Cofired Ceramic (LTCC) Fligh-Temperature Cofired Ceramic (HTCC)... 

Elshabini, A., Wang, G., Barlow, F., Elvey, E., and Folk, M., Fundamental issues in processing and applications of low temperature cofired ceramic tape, Proc. XXVIII Int. Conf. IMAPS Poland Chapter, Wroclaw, September 26-29, 2004, pp. 19-29. 

Copper can be plated on the surface conductors of both high-temperature cofired ceramic (HTCC) and low-temperature cofired ceramic (LTCC) packages and substrates. On internal layers, on HTCC, the conductors must be composed of high-resistivity refractory metallization. 

In particular, low-temperature cofired ceramics (LTCC) is a convenient technology for the manufacturing of band-pass filters for a frequency band of 380-2400 MFlz as required by radio telephony systems. 

As it is comparatively easy to combine Low Temperature Cofired Ceramics (LTCC) with materials that have different characteristics, it is possible to integrate and build the different types of components into the ceramic. Furthermore, while it is possible to incorporate low loss metal into LTCCs as a conductor, ceramic has low dielectric loss at high frequencies making it effective for achieving low loss performance, compared with other materials such as resin and the like. In addition, its thermal expansion coefficient compared with resin materials and other ceramic materials is low, and it has the merit of excellent connection reliability for high density packaging of LSI components. For these reasons, LTCCs are regarded as a... 

Multilayered Low Temperature Cofired Ceramics (LTCC) Technology... 

Imanaka, Y. (2005). Multilayered Low Temperature Cofired Ceramics (LTCC) Technology, Springer, New York. 

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