IC technology

Brown, D. M., et al., High Temperature Silicon Carbide Planar IC Technology and First Monolithic SiC Operational Amplifier IC, Trans, of 2nd Inti. High-Temp. Elec. Conf. (HiTEC), 1994, pp. XI-17-XI-22. 

Our choice for an Ion Sensitive Field Effect Transistor (ISFET) as a transducing element was based on the fact that the SiO surface contains reactive SiOH groups for the covalent attachment of organic molecules and polymers. In addition the FET has fast response times and can be made very small with existing planar IC technology. FIGURE 1... 

The Si monolithic image sensor performance has rapidly improved as a result of progress in Si IC technology and/or the advent of charge transfer... 

Gutmann RJ, Lu J-Q, Pozder S, Kwon Y, Menke D, Jindal A, Celik M, Rasco M, McMahon JJ, Yu K, Cale TS. A wafer-level 3D IC technology platform. Proceedings of Advanced Metallization Conference 2003. p 19-26. 

The integrated system, including transducer and enzyme reactor, provides improved reliability and stability in multianalyte determinations, as compared with discrete thermal sensor systems. In addition, application of micromachining and IC technologies is of benefit for the manufacture of uniform, cheap thermal transducers with flexible shape, size, and resistance, as well as delicate microstructure on the chips. The good thermal insulation of the transducers from the flow stream eliminates interference from the reactants on the transducers, and the intrinsic stability of the transducers obviates the need for frequent recalibration of the sensors. 

Historically, silicon and silicon based materials have formed the basis for the well-established integrated circuit (IC) technology. As a consequence, polycrystalline silicon (polysilicon) is one of the most commonly used structural materials for MEMS. Comparatively, silicon is a good structural material for the microscale. However, the inherent mechanical nature of MEMS devices brings about a new level of complexity to their production and reliability compared to standard integrated circuits. Micromechanical structures can be... 

Metal in gap (MIG) heads or ferrite ones are produced with a combination of machining, bonding, and thin film processes. Tliin-film inductive heads are manufactured by thin-film processes similar to the semiconductor IC technology (see Section III). Tliin-film head production process, however, is rather unique as it involves both, very thin and very thick films. We choose to present here a detailed summary of the fabrication process of thin-film inductive heads with a single-layer spiral coil. This should serve, once again, to illustrate the centrally important role of electrochemical deposition in coimection with modem IT. 

NTEGRATED CIRCUIT (IC) TECHNOLOGY has moved Steadily toward increasing circuit density and improved performance during its brief history. These improvements have been achieved through the development of the microlithography process, which now permits production of devices with feature sizes of 1 fim. Submicrometer devices are actively being developed, and production is expected later in this decade. 

Dry etching is a well established pattern-transfer technique in IC technology, characterized by a very good ability to pattern fine lines and by a high fidelity of pattern transfer [31]. It has become an important complementary technique for fabricating microstructures, after it has been adapted to the specific requirements of very deep etching. 

J. -Q Lu, et al.. A wafer-scale 3-D IC technology platform using dielectric bonding glues and copper damascene patterned inter-wafer interconnects. In Proc. IntT Interconnect Technology Conf., 2002, pp. 78 - 80. 

R. Islam, C. Rrubaker, P. Lindner, C. Schaefer. Wafer level packaging and 3-D interconnect for IC technology. In Proc. IEEE/SEMI Advanced Semiconductor Manufacturing Conf., 2002, pp. 212-217. 

Many microfabrication techniques make use of integrated circuit (IC) technology developed originally for the electronics and communications industries. But recently, a whole new area of research has sprung up around making the tiny pTAS devices using... 

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