MEMS devices

Luo, J. B. and Pan, G. S., Variations of the Surface Layer during Chemical Mechanical Polish," Indo-Chinese Workshop on MEMS Devices and Related Technologies, New Delhi, India, April 5-7,2006. 

Nanoparticle Thin-Film Deposition on MEMS Devices... 

In order to prevent the irrevisible adhesion of MEMS microstructures, several studies have been performed to alter the surface of MEMS, either chemically or physically. Chemical alterations have focused on the use of organosilane self-assembled monolayers (SAMs), which prevent the adsorption of ambient moisture and also reduce the inherent attractive forces between the microstructures. Although SAMs are very effective at reducing irreversible adhesion in MEMs, drawbacks include irreproducibility, excess solvent use, and thermal stability. More recent efforts have shifted towards physical alterations in order to increase the surface roughness of MEMS devices. 

Current market trends indicate a gaining momentum of corrosion and temperature-resistant MEMS devices for the use in mass market applications. Silicon-on-insulator material properties make way for a whole new range of uses and applications while being available in sufficiently large quantities to satisfy large volume production requirements. A breakthrough of these devices can be expected through automotive applications, if they can meet the price pressure. 

Surface layer dissociation behavior, in polymer colloids, 20 381-383 Surface layer impregnation, hydrothermal technology for, 14 105, 106t, 107t Surface layers, IR spectra of, 24 110 Surface micromachining in MEMS, 22 260 of MEMS devices, 26 964 Surface modification adsorbents, 1 585... 

The sensitivity of hydrogels to a large number of physical factors like temperature [149], electrical voltage [150], pH [151-153], concentration of organic compounds in water [154], and salt concentration [155] make them promising materials for a broad range of applications as microsensors [156] and microactuators [154] in MEMS devices. 

In order to establish good electrical contact to the sensitive layer, it was necessary to coat the electrodes with a metal stack of Ti/W (diffusion barrier and adhesion layer) and Pt. The usage of a shadow mask during the metal deposition ensures full compatibility with other MEMS processing steps so that it is possible to fabricate various CMOS-MEMS devices on the same wafer. 

There is tacit recognition that power is a vital issue for the continued development of the MEMS device... 

The power needs for MEMS devices are diverse— and batteries may not be the best choice to provide power to systems based on various types of MEMS drives. For example, magnetic drives operate at less than 1 V, but they require generating hundreds of milliamperes, which becomes a difficult challenge for batteries sized on the subcentimeter scale. The required micro- to nanoampere current levels for electrostatic and piezoelectric MEMS are feasible for batteries, but the tens to hundreds of volts that are needed will present difficulties for batteries with nominal voltages of 3 V. However, there may be a niche for batteries that would be used to power 10— 15 V drives. 

The above discussion provides the context for 3-D batteries. That is, there are a variety of small power applications, typified by MEMS devices, which the most advanced, 2-D lithium battery systems are unable to satisfy. The inability to provide sufficient power is because of configuration and not because of intrinsic energy density. Three-dimensional designs offer the opportunity to achieve milliwatt-hour energies in cubic millimeter packages and, more importantly, with square millimeter footprints. While such power sources may not influence the enormous commercial markets in cell phones and laptop computers, they are certain to impact emerging markets where... 

Optical and Photonic MEMS Devices Design, Fabrication and Control, Ai-Qun Liu... 

Stein D. CMP technologies for MEMS device fabrication. SEMI Technical S5mposium, Semicon West 2002. 

Vijayakumar A, Du T, Sundaram KB, Desai V. The application of chemical mechanical polishing for nickel used in MEMS devices. MRS Symp Proc 2004 816 203-208. 

MEM devices, thin films, (fullerenes, nanotubes, nanofibers, integrated circuits) dendritic polymers, nanoparticles, inorganic-organic nanocomposites nanoelectronic devices)... 

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