Flip-chip components

FIGURE 40.14 Flux dispensed on the balls of a flip-chip component (a, b) The solder balls are immersed into the flux reservoir (c) the component is removed from the reservoir with the solder balls coated with flux (d) the component is placed on the circuit board. 

FIGURE 40.22 Vision system images (a) a flip chip component (b) a printed circuit board fiducial. (Courtesy of Universal Instruments.)... 

FIGURE 40.32 Stereo photographs showing (a) confonnal-coated (bottom) and encapsulated (top) versions of a surface-mount circuit board and (b) underfilled flip-chip components. (Courtesy ofSandia National Laboratories)... 

Baggerman, A. Schwarzbach, D. 1998. Solder-jetted eutectic PbSn bumps for flip-chip. IEEE Transactions on Components Packaging and Manufacturing Technology Part B-Adv. Packaging 21 371-381. 

Luo S, Wong CP. Surface property of passivation and solder mask for flip chip packaging. Proceedings of the IEEE Electronic Components and Technology Conference 2001. 

Further miniaturization is enabled by direct assembly of bare dies onto circuit carriers. This kind of component is electrically connected by wire bonding. Other methods for direct chip attachment are flip chip and tape automated bonding. All three methods require special equipment for processing and inspection. 

The trend in component packaging towards miniaturization of standard components and the development of new packages for components with high pin account (fine pitch, /rBGA, flip-chip) are increasing requirements for placement accuracy. 

Some adhesive materials and processes are used across many apphcations. For example, adhesives are used to attach bare die, components, and substrates in assembling commercial, consumer and aerospace electronic products. Adhesives are also widely used for surface mounting components onto interconnect substrates that serve numerous functions for both low-end consumer products and for high rehability applications. Underfill adhesives are used to provide stress relief and ruggedize the solder interconnects for almost all flip-chip and area-array devices, regardless of their function as integrated circuits. 

Silver-filled epoxies and other electrically conductive adhesives are widely used to electrically connect chip devices or packaged components to interconnect substrates or printed-circuit boards. Chip capacitors, resistors, transistors, diodes, and magnetic components may be attached with silver-filled epoxies whose volume resistivities range from 1 x 10 " to 3 x 10 " ohm-cm or with gold-filled epoxies whose volume resistivities are approximately 8 x 10 ohm-cm. Conductive adhesives are also finding use as replacements for solder balls in flip-chip devices. In all cases, to achieve reliable connections, initially low-contact resistances or volume resistivities must remain low on aging and on exposure to operational stress conditions, such as humidity, temperature, vibration, shock, and power. 

Conductive adhesives are one of the feasible alternatives to lead for electronics assembly. Isotropically conductive adhesives are suitable for standard pitch (50- to 100-mil) surface-mounted components and numerous commercial materials are available (see commercial suppher Ksting, Section VI.E). Anisotropically conductive adhesives are more suited to flex to rigid connections, fine pitch components (15- to 20-mil pitch), and flip-chip assembly (4- to 12-mil pitch) [22]. Adhesives are not ready to replace solder throughout the electronics industry, however, due to questions that remain concerning the reliability of electrical interconnections. Their implementation is currently limited to low-cost applications using polyester substrates and specialty appHcations where solder cannot be used. Additionally, the lack of equipment for large-volume assembly with anisotropically conductive adhesives, which require the simultaneous appUcation of heat and pressure, impedes the acceptance of these promising materials. 

Data describing the reliability of joints assembled with anisotropically conductive adhesives are incomplete. Several papers have been published, but usually the sample size investigated is small, the accelerated stress tests are not standardized, and the results are highly dependent on device type (e.g., flexible circuit to rigid PWB, surface-mounted components, and flip-chip assembles). Further work is required in this area. 

Electrically conductive adhesives, primarily silver-filled epoxies, are finding uses as replacements for solder in surface-mounting components on printed-circuit boards and in flip-chip attachments. There are several driving forces for this application, a major one being the trend to eliminate lead and tin-lead solders because they may be health hazards. Also associated with the use of solder, is the need to eliminate ozone-depleting solvents presently used to clean and remove flux residues. Electrically conductive polymer... 

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